JPH03176341A - Method of forming emboss in sheet material - Google Patents

Abstract

PURPOSE:To form embossed areas on a sheet material quickly and accurately while using non-heated parts of a heated area as supporting parts of the sheet material by a method wherein a plurality of heated areas, which extend in the transfer direction of a sheet material, are formed with designated intervals, and embossed areas which continue from the heated areas are formed. CONSTITUTION:A vinyl chrolide or polyethylene sheet material 51 is continuously fed from a wound body 11, and is transferred to a heating unit 14 through a dancer roll 12 and preheating roll 13. The sheet material 51 is heated by a lower heating die 28 and upper heating die for heating 29 of heating devices 14a, 14b, 14c on respective stages, and a plurality of heated areas, which extend in the transfer direction in a belt shape, are formed on the sheet material 51. Then, the sheet material 51 is transferred to a forming unit 15, and embossed areas are formed on the heated areas of the sheet material 51. also, on both side parts of the sheet material 51, quide openings are formed. That is, when the heated areas of the sheet material 51 reach the emboss forming part of a lower embossing die 32, the sheet material 51 is pinched between an upper embossing die 34 and the lower embossing die 32.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Field of Application) The present invention is directed to an embossed material on a sheet plate in order to manufacture a bottom material of an electronic component carrier for packaging and transporting IC-type electronic components. The present invention relates to a method for embossing a sheet plate to form a section.

(Prior Art) Conventionally, electronic component carriers made of synthetic resin are known that package and transport a large number of electronic components such as ICs.

This electronic component carrier includes a bottom material that accommodates electronic components such as ICs, and a flat lid material that covers the bottom material. Among these, the bottom material consists of an embossed part for storing electronic components and a flange part opening at the upper end of the embossed part, and the lid material is heat-sealed to this flange part. Further, a large number of embossed portions are provided continuously in a single row, and each embossed portion is connected by a flange portion at an opening at the upper end of the embossed portion.

In the electronic component carrier having such a configuration, Ic
Electronic components such as these are housed in each embossed portion of the bottom material, and then a plate-shaped lid material is heat-sealed to the flange portion of the bottom material to package the electronic components.

(Question 8 to be solved by the invention) As mentioned above, the bottom ten o which houses electronic parts such as ICs is
It consists of continuously provided embossed parts and a flange part that connects each embossed part.

In general, the bottom material of electronic component carriers is a synthetic resin sheet board with a width slightly wider than the width of the embossed part, which is heated in advance, and then this sheet board is vacuum or pressure-formed to form a single row of embossed parts. It is manufactured by molding parts.

In such a case, if it is possible to preheat a wide sheet board, then form multiple rows of embossed parts on the sheet, and then divide the sheet board into 711 rows of embossed parts, the embossed parts will be formed every 111 rows. It is convenient because it can be produced more quickly than in the case of molding.

The present invention has been made in consideration of these points,
It is an object of the present invention to provide an embossing method that can quickly form an embossed part on a sheet plate in W and WE.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a method for embossing a sheet plate, in which a synthetic resin sheet plate heated by a heating device is transferred to a forming device, and an embossed portion is formed by this forming device. The apparatus is characterized in that a plurality of heating parts extending in the transport direction are formed on the sheet plate at predetermined intervals, and the forming apparatus forms embossed parts continuous to the heating parts.

(Function) According to the present invention, a plurality of .::)-shaped heating portions are formed at predetermined intervals on the sheet plate using a heating device, and embossed portions are formed on the heating portions using a forming device. The embossed parts of the rows can be formed quickly, and
The unheated part of the heating section can be used as a support part for the sheet plate.

(Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First, the electronic component carrier will be explained with reference to FIGS. 6 and 7. In FIGS. 6 and 7, the electronic component carrier 70 includes a bottom material 71 that stores electronic components 77 such as ICs.
and a lid material 75 that covers the bottom material 71. The bottom material 71 is made up of an embossed part 72 for storing electronic components and a flange part 73 opening at the upper end of the embossed part 72, and the lid material 75 is heat-sealed to this flange part 73. The embossed portions 72 are continuously provided in a single row, and each embossed portion 72 is connected in a circular manner by a flange portion 73 having an open top end. Among these, the bottom material 71 is formed by vacuum or pressure forming a sheet plate made of vinyl chloride or polystyrene, while the lid material is made of a laminated sheet made of synthetic resin. Further, a plurality of perforated holes 74 are continuously provided in the flange portion 73 adjacent to the embossed portion 72 . This punch hole 74 is for transporting the bottom material 71.

Next, the outline of the bottom material manufacturing apparatus for an electronic component carrier will be explained with reference to FIG.

In FIG. 4, a manufacturing apparatus 10 for carrying out a method for manufacturing a bottom material includes a roll 11, a dancer roll 12, a preheating roll 13, a heating device 14, a forming device 15, a cooling device 16, and a punching device 1.
7, feeding section 18, dancer roll 19, inspection device 20, slitting device 21, marking device 22, tension roll 2
4 and a roll 23 are sequentially arranged.

Among these, the heating device 14 is a one-stage heating device 14a.

It consists of a two-stage heating device 14b1 and a three-stage heating device 14c, and is configured to heat the sheet plate 51 in three stages. Further, each heating temperature can be set individually.

1st stage heating device 14a, 2nd stage heating device 14b, 3rd stage heating device j! t i 4 C has a similar structure, and the heating bottom metal fJ:! 2g and a heating upper mold 29. These lower heating mold 28 and upper heating mold 2
9, Figures 1 and 211! Explained by J.

As shown in FIGS. 1 and 2, a plurality of lower heating bodies 30 are provided at predetermined intervals on the upper surface of the lower heating mold 28, and extend in a belt shape in the direction of transport of the sheet plate 51 and protrude upward. It is being Further, on the lower surface of the upper mold 29, an upper heating element 31 is provided which extends in a belt shape in the direction of transport of the sheet plate 51 and projects downward, corresponding to the lower heating element 30. These heating bodies 30, 31 form a heating section extending in a band shape on the sheet plate 51. The lower heating element 30 and the upper heating element 31 each have a heating surface 30a of a predetermined width.
, 31a.

Further, the lower heating element 30 and the upper heating element 31 are both attached to the lower heating mold 28 and the two upper heating molds at the dehydration openings by means of a station I (not shown). For this reason,
A lower heating element 30 that covers a heating surface 30a with a predetermined width, and an upper heating element 3 that angles a heating surface 31a with a corresponding width.
1 to the lower heating mold 28 and the two upper heating molds, a heating section 5 of a desired width is formed on the sheet plate 51.
1a (FIG. 8) can be formed.

The molding device 15 also includes a lower molding mold 32 and an upper molding mold 34.
The lower mold is shown in Figure 3.

As shown in FIG. 3, on the upper surface of the lower mold 32, embossed portions 35 and flange molded portions 33 are alternately arranged. Among these, the emboss molding part 35 is for molding the emboss part 72 of the bottom material 70, and the emboss groove 35
It has a. Further, this embossed part 35 serves as a mark for attachment and detachment from the lower molding die 32. Further, on the upper surface of the lower molding die 32, a pair of guide opening molding holes 37 are provided symmetrically to the right. This guide opening molding 1g
Reference numeral 37 forms a lower guide opening 9 (FIG. 5) on the sheet plate 51.

Further, the punch device 17 includes a punch lower die 41 and a punch upper die 45, and the punch hole 74 is formed in the sheet plate 51 by the punch device 17.

Next, the operation of the full-length embodiment having such a configuration will be explained.

First, a sheet plate 51 made of vinyl chloride or polystyrene
is continuously supplied from the roll 11 and transferred to the heating device 14 through the dancer roll 12 and the preheating roll 13.

The sheet plate 51 that is continuously transferred from the roll 11 is intermittently transferred from the preheating roll 13 to the feeding section 18, where it undergoes various treatments, and then continuously transferred to the roll 23 again. However, these transport adjustments are performed by one of the two dicer rolls 12°.

Next, the operation of the sheet heating device 14 will be described in detail.

In the sheet plate heating device 14, the sheet plate 51 is heated by the lower heating mold 28 and the upper heating mold 29 of the heating devices 14a, 14b, and 14c at each stage. That is, when the sheet plate 51 is transferred to, for example, the first stage heating device 14a of the sheet plate heating device 14, the transfer is stopped, and the lower heating mold 28 and the two upper heating molds of the first stage heating device 14a are moved. get close to it. Then, the sheet plate 51 is held and heated by the lower heating element 30 of the lower heating mold 28 and the upper heating element 31 of the upper heating mold 29, and as shown in FIG. A plurality of extending heating parts 51a are formed.

The sheet plate 51 is then sequentially transferred to the two-stage heating device 14b and the three-stage heating device 14c. Then, by the two-stage heating device 14b and the three-stage heating device 14c, 1
The heating portion 51a that has been heated and formed by the stage heating device 14a is further heated in the same manner.

The two-shaped heating portion 51a is a portion on which the embossed portion 72 is subsequently formed by the molding device 15. In addition,
In order to make the width of the heating portion 51H of the sheet plate 51 larger than the width of the embossed portion 72, the width of the heating surfaces 30a and 31a is made larger than the width of the embossed portion 72.

Next, the sheet plate 51 is transferred to a forming device 15, and in this forming device 15, an embossed portion 72 is formed on the heating portion 51a of the sheet plate 51, and guide openings n79 are formed on both sides of the sheet plate 51. .

That is, the heating part 51a of the sheet plate 51 is
! ! 32, the sheet plate 51 is sandwiched between the upper molding die 34 and the lower molding die 32. In this case, the embossed protrusion (not shown) of the upper mold 34 enters the emboss m 35 a of the embossed part 35, and the embossed part 72 is formed on the heating part 51a of the sheet plate 51 by compressed air or vacuum forming. Ru. At the same time, the guide protrusion (not shown) of the upper molding mold passes through the sheet plate 51 and enters the guide opening molding groove 37 of the lower molding mold 32, and the guide opening lower 9 is molded on the temporary sheet 51. . Further, the portion of the temporary sheet 51 other than the embossed portion 72 becomes the flange portion 73 as it is.

During this time, the sheet plate 51 is transferred from the heating device 14 to the forming device 15.
The sheet plate 51, which has been heated and softened, is supported by support wires 25 to prevent it from sagging. This support wire is inserted into the support wire storage groove 3 in the forming device 15.
It is stored in 9.

Next, the sheet plate 51 is transferred to a cooling device 16 to be cooled, and then transferred to a punch device 17, and a punch hole 74 is formed in a portion of the sheet plate 51 adjacent to the embossed portion 72 by the punch device 17. .

In this way, the bottom material 71 having multiple rows, for example, four rows of embossed portions 72 and corresponding punch holes 74, as shown in FIG. 5, is formed. Next, this multi-row bottom material 7
1 is transferred from the feeding section 18 to the inspection device 20 via the dancer roll 19.

In the inspection device 20, the multi-row bottom material 71 is subjected to various inspections.

Subsequently, the multi-row bottom material 71 is transferred to a slitting device 21, where the flange portion 73 is cut in the transfer direction and divided into each row, and unnecessary portions on both sides are removed.

Subsequently, the marking device 22 marks predetermined defective portions of the bottom material 71 divided into each row.

Next, four rows of bottom material 71 with defective parts marked like this
is then wound onto a roll 23. In this way, a continuous single row of embossed portions 72, a flange portion 73 that connects the embossed portions 72 to each other, and a single row of punched holes 74 provided in the flange portion 73 in correspondence with the embossed portions 72 are provided. A bottom material 71 is manufactured (FIG. 6).

According to this embodiment, the sheet plate 5 is heated by the heating device 14.
Since a plurality of belt-shaped heating portions 51a are formed at predetermined intervals on the sheet plate 5, the unheated portion between the heating portions 51a is
1 support part. For this purpose, the heating device 14
The heated sheet plate 51 can be transferred to the forming device 15 without sagging.
It is possible to improve the molding accuracy and to perform stable manufacturing. Moreover, a plurality of belt-shaped heating parts 51a
Since the embossed portions 72 are formed in multiple rows of embossed portions 7,
2, the bottom material 71 can be rapidly manufactured.

〔Effect of the invention〕

According to the present invention, a heating device forms a plurality of .:i)-shaped heating portions on a sheet at predetermined intervals, and a forming device forms embossed portions on the heating portions, so that multiple rows of embossed portions are formed. can be quickly manufactured. In addition, since the unheated part between the heating parts can be used as a support part for the sheet plate, the sheet plate heated by the heating device can be transferred to the forming device without sagging, thereby improving the forming accuracy in the forming device. Improved and stable manufacturing can be achieved.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing a heating device according to the present invention,
FIG. 2 is a plan view of the lower heating mold of the heating device, FIG. 3 is a plan view of the lower molding mold, and FIG. 4 is a schematic diagram showing the bottom material manufacturing device of the electronic component carrier. , FIG. 5 is a plan view showing the multi-row bottom material, FIG. 6 is a partial perspective view of the electronic component carrier, and FIG. 7 is a sectional view taken along the line ■-■ in FIG.
FIG. 8 is a plan view showing the heating section formed on the sheet plate. 10... Bottom material manufacturing device, 11... Roll, 12...
Dancer roll, 14... Heating device, 15... Forming device, 17... Punching device, 20... Inspection device, 21
...Slitting device, 22...Marking device, 23
... Rolling body, 28 ... Lower heating mold, two ... Upper heating mold, 30 ... Upper heating body, 31 ... Lower heating body,
32... Lower molding mold, 33... Upper molding mold, 51.
...Sheet board, 70...Electronic component carrier, 71...
Bottom material, 72... Embossed part, 73... Flange part,
74...Punch hole.

Claims (1)

[Claims] In a sheet plate embossing forming method in which a synthetic resin sheet plate heated by a heating device is transferred to a forming device and an embossed portion is formed by this forming device, a heating portion extending in the transfer direction is formed on the sheet plate by the heating device in a predetermined manner. A method for embossing a sheet plate, characterized in that a plurality of embossed portions are formed at intervals, and the embossed portions are formed continuous with the heating portion by the molding device.