JPH03173793A - Terminal plating device - Google Patents

Terminal plating device

Info

Publication number
JPH03173793A
JPH03173793A JP31251589A JP31251589A JPH03173793A JP H03173793 A JPH03173793 A JP H03173793A JP 31251589 A JP31251589 A JP 31251589A JP 31251589 A JP31251589 A JP 31251589A JP H03173793 A JPH03173793 A JP H03173793A
Authority
JP
Japan
Prior art keywords
plated
plating
belt
terminal
conveyor belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31251589A
Other languages
Japanese (ja)
Inventor
Koichi Kondo
幸一 近藤
Masanori Baba
馬場 正典
Shigeru Saito
茂 斎藤
Haruyuki Hagiwara
萩原 春幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP31251589A priority Critical patent/JPH03173793A/en
Publication of JPH03173793A publication Critical patent/JPH03173793A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To continuously plate the terminals of a cylindrical insulator such as a reed switch by placing a material to be plated on a carrier belt and immersing the terminals of the material to be plated which are projected from both end edges in the injected plating liquid and plating the terminals. CONSTITUTION:A terminal plating device is formed of a carrier belt 21, a pressing belt 22 described hereunder, a supply body 23 of plating liquid 23a, a cathode and an electromagnetic coil 25 which attracts and holds the material to be plated. The pressing belt 22 is placed on the carrier belt 21 and moved at the velocity different therefrom and pinches the material 1 to be plated while giving rotation to this material 1. The terminals of the material 1 to be plated are continuously plated. The above-mentioned carrier belt 21 holds the axis of the material 1 to be plated at right angle to the direction of transportation and has the projections 21a for controlling transfer on the belt 21. The terminal parts 11a are projected to the width sides of the belt 21 to carry the material 1 to be plated. Further the above-mentioned cathode is provided on the supply body 23 and brought into contact with the terminal parts 11a and arranged obliquely for the belt 21.

Description

【発明の詳細な説明】 〔概 要〕 ガラス封入磁気スイッチ(リードスイッチ)等の円筒状
絶縁体の両端面から軸状に突出する磁性体端子を有する
電子部品に対する端子めっき装置に関し、 端子めっき工程の自動化とその前後工程との接続がスム
ーズに行え、かつ端子面がりの発生が少ない端子めっき
装置を提供することを目的とし、円筒状絶縁体の両端か
ら軸状に突出する磁性材料の端子部を有する被めっき物
に連続して端子めっきを施す装置であって、前記被めっ
き物の軸が搬送方向に直角になるように水平に保持し該
被めっき物のベルト上での移動を規制する突起が所定間
隔で上面に形成され、前記端子部を幅側に突出させて該
被めっき物を搬送する搬送ベルトと、前記搬送ベルトの
上側にあって該搬送ベルトと異なる速度で移動して前記
被めっき物に回転を与えつつ挟持する押さえベルトと、
前記搬送ベルトの両側にあって搬送されつつある被めっ
き物の端子部にめっき液を噴射するめっき液供給体と、
°該めっき液供給体の上にあって前記被めっき物の端子
部に接触ししかもその接触位置が被めっき物の搬送に伴
って端子の軸方向に変化するように前記搬送ベルトに対
して傾斜して配置されためっき陰極と、前記搬送ベルト
の下側にあって該搬送ベルトを介して前記被めっき物を
吸引保持する電磁コイルと、を有する構成である。
[Detailed Description of the Invention] [Summary] A terminal plating process for an electronic component having a magnetic terminal protruding axially from both end faces of a cylindrical insulator such as a glass-enclosed magnetic switch (reed switch). The aim is to provide a terminal plating device that can be automated and smoothly connected to the processes before and after the process, and that reduces the occurrence of terminal surface curling. An apparatus for continuously applying terminal plating to an object to be plated, which holds the object horizontally so that the axis of the object to be plated is perpendicular to the conveyance direction, and restricts movement of the object on the belt. a conveyor belt having protrusions formed at predetermined intervals on its upper surface and conveying the object to be plated with the terminal portion protruding widthwise; A holding belt that holds and rotates the object to be plated;
a plating solution supply body that is located on both sides of the conveyor belt and sprays a plating solution onto the terminal portion of the object to be plated that is being conveyed;
° It is located above the plating solution supply body and contacts the terminal portion of the object to be plated, and is inclined with respect to the conveyor belt so that the contact position changes in the axial direction of the terminal as the object to be plated is transported. The electromagnetic coil is provided below the conveyor belt and attracts and holds the object to be plated through the conveyor belt.

〔産業上の利用分野〕[Industrial application field]

本発明は、ガラス封入磁気スイッチ(リードスイッチ)
等の円筒状絶縁体の両端面から軸状に突出する磁性体端
子を有する電子部品に対する端子めっき装置に関する。
The present invention is a glass-enclosed magnetic switch (reed switch)
The present invention relates to a terminal plating apparatus for electronic components having magnetic terminals protruding axially from both end surfaces of a cylindrical insulator.

近年、リードスイッチ等の小型電子部品に対する高品質
化や低コスト化の要求が強く、その製造過程において各
工程の自動化や工程間のスムーズな製品の流れを図るこ
とが重要になってきた。
In recent years, there has been a strong demand for higher quality and lower costs for small electronic components such as reed switches, and it has become important to automate each process and ensure smooth product flow between processes in the manufacturing process.

〔従来の技術〕[Conventional technology]

第3図は、本発明が対象とする磁性体端子を有する円筒
状の電子部品、例えばリードスイッチを示す図である。
FIG. 3 is a diagram showing a cylindrical electronic component having a magnetic terminal, such as a reed switch, which is the object of the present invention.

リードスイッチは5270イ(Ni52%残りFeの合
金)等の軟質磁性材料よりなる一対のリード片11を所
定の接点間隔で対向させて不活性ガスと共にガラス管1
2の中に封着したもので、!フード片12がガラス管1
2の両端から軸方向に突出してプリント配線板に接続す
るための端子部11aを形成している。この端子部11
aにはすずめっきやはんだめっきが施されている。この
端子めっきは、ガラス管にリード片を封着した第3図の
状態のものに対して行われ、従来はバレルめっき法やラ
ックめっき法(引っ掛けめっき法)などバッチ処理で端
子めっきを行っていた。
A reed switch consists of a pair of reed pieces 11 made of a soft magnetic material such as 5270I (an alloy of 52% Ni and the remaining Fe), which are placed opposite each other at a predetermined contact distance, and are inserted into a glass tube 1 together with an inert gas.
It is sealed inside 2! Hood piece 12 is glass tube 1
Terminal portions 11a are formed that protrude in the axial direction from both ends of 2 and are connected to a printed wiring board. This terminal section 11
A is plated with tin or solder. This terminal plating is performed on a glass tube with a lead piece sealed in the state shown in Figure 3. Conventionally, terminal plating was performed using a batch process such as barrel plating or rack plating (hook plating). Ta.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来のバレルめっきや引っ掛けめっきによる端子め
っき方法では、被めっき物のバレルへの投入・取り出し
あるいはラックへの引っ掛け・取り外しは手作業となり
、前後工程と連続させて自動化することが困難であった
。またバレルめっきでは被めっき物がバレル槽内で絡み
合って端子に曲がりが発生し、この矯正作業にに人手゛
を必要とするという問題があった。
In the conventional terminal plating methods using barrel plating and hook plating, loading and unloading the objects to be plated into and out of the barrel, or hooking and removing them from the rack, must be done manually, making it difficult to automate continuous processes before and after. . In addition, barrel plating has the problem that the objects to be plated become entangled in the barrel tank, causing bends in the terminals, which require manual labor to straighten.

本発明は上記問題点に鑑み創出されたもので、端子めっ
き工程の自動化とその前後工程との接続がスムーズに行
え、かつ端子部がりの発生が少ない端子めっき装置を提
供することを目的とする。
The present invention was created in view of the above-mentioned problems, and aims to provide a terminal plating device that can automate the terminal plating process and smoothly connect the processes before and after the process, and that reduces the occurrence of terminal warping. .

〔課題を解決するための手段〕[Means to solve the problem]

上記問題点は、 円筒状絶縁体の両端から軸状に突出する磁性材料の端子
部を有する被めっき物に連続して端子めっきを施す装置
であって、 前記被めっき物の軸が搬送方向に直角になるように水平
に保持し該被めっき物のベルト上での移動を規制する突
起が所定間隔で上面に形成され、前記端子部を幅側に突
出させて該被めっき物を搬送する搬送ベルトと、 前記搬送ベルトの上側にあって該搬送ベルトと異なる速
度で移動して前記被めっき物に回転を与えつつ挟持する
押さえベルトと、 前記搬送ベルトの両側にあって搬送されつつある被めっ
き物の端子部にめっき液を噴射するめっき液供給体と、 該めっき液供給体の上にあって前記被めっき物の端子部
に接触ししかもその接触位置が被めっき物の搬送に伴っ
て端子の軸方向に変化するように前記搬送ベルトに対し
て傾斜して配置されためっき陰極と、 前記搬送ベルトの下側にあって該搬送ベルトを介して前
記被めっき物を吸引保持する電磁コイルと、 を有することを特徴とする本発明の端子めっき装置によ
り解決される。
The above-mentioned problem lies in an apparatus that continuously applies terminal plating to an object to be plated, which has a terminal portion of a magnetic material that protrudes in the shape of an axis from both ends of a cylindrical insulator, and in which the axis of the object to be plated is in the conveying direction. Protrusions are formed on the top surface at predetermined intervals to hold the object horizontally at right angles and restrict movement of the object on the belt, and the object is conveyed with the terminal portion protruding toward the width. a belt; a holding belt that is located above the conveyor belt and moves at a speed different from that of the conveyor belt to rotate and hold the object to be plated; and a presser belt that is located on both sides of the conveyor belt and holds the object to be plated that is being conveyed. a plating solution supply body that sprays plating solution onto the terminal portion of the object; a plating cathode arranged obliquely with respect to the conveyor belt so as to change in the axial direction of the conveyor; and an electromagnetic coil located below the conveyor belt to attract and hold the object to be plated through the conveyor belt. This problem is solved by the terminal plating apparatus of the present invention, which is characterized by having the following.

〔作用〕[Effect]

被めっき物を搬送ベルト上に載置するだけで、該搬送ベ
ルトの両端縁から突出する被めっき物の端子部はめっき
液供給体から噴出するめっき液に浸されつつ搬送され所
定の端子めっきが行われる。
By simply placing the object to be plated on the conveyor belt, the terminal portion of the object to be plated protruding from both edges of the conveyor belt is conveyed while being immersed in the plating solution spouted from the plating solution supply body, and the predetermined terminal plating is carried out. It will be done.

このめっき処理時間中、被めっき物は搬送ベルト上の載
置位置で適度に回転し且つ電極接触位置が移動とともに
変わるので端子部全体に均一な端子めっきが施され、ま
た端子部が絡まることがないので端子部がりが発生しな
い。
During this plating process, the object to be plated rotates appropriately at the position placed on the conveyor belt, and the electrode contact position changes as it moves, so that uniform terminal plating is applied to the entire terminal area, and the terminal area is prevented from becoming tangled. Since there is no terminal part, there is no risk of warping.

また搬送ベルト上に被めっき物を載置するのはパーツフ
ィーダで、適宜自動的に行うことが容易であり、めっき
終了後の製品は個別に所定間隔で搬送されてくるので取
り出しの自動化も容易である。同様な装置を前後に接続
することによって前処理後処理を含む全めっき処理工程
を連続化することが可能になる。
In addition, parts feeders are used to place the objects to be plated on the conveyor belt, and this can be easily done automatically as needed.After plating, the products are conveyed individually at predetermined intervals, making it easy to automate the removal. It is. By connecting similar devices back and forth, the entire plating process including pre-treatment and post-treatment can be made continuous.

〔実施例〕〔Example〕

以下添付図により本発明の詳細な説明する。 The present invention will be explained in detail below with reference to the accompanying drawings.

第1図は本発明の端子めっき装置を示す図で、図(a)
は側面図、図(b)は図(a)における押さえベルト2
2を取り除いた上面図、図(c)は被めっき物の搬送方
向から視た正断面図である。第2図は本発明の端子めっ
き装置を組み込んだリードスイッチ端子自動めっき装置
のブロック図である。
FIG. 1 is a diagram showing the terminal plating apparatus of the present invention, and FIG.
is a side view, and figure (b) is the presser belt 2 in figure (a).
2 is a top view with part 2 removed, and Figure (c) is a front sectional view seen from the conveyance direction of the object to be plated. FIG. 2 is a block diagram of an automatic reed switch terminal plating apparatus incorporating the terminal plating apparatus of the present invention.

第1図において、本発明の端子めっき装置lは、被めっ
き物例えばリードスイッチ1を水平位置に挟持して搬送
する搬送ベルト21と押さえベルト22、搬送中のリー
ドスイッチの端子部11aにめっき液23aを供給する
めっき液供給体23、端子部11aにめっき電流を供給
するめっき電極24、リードスイッチlが搬送ベルト2
1上で移動しないように保持する電磁コイル25とから
なる。
In FIG. 1, the terminal plating apparatus 1 of the present invention includes a conveyor belt 21 and a presser belt 22 that sandwich and convey an object to be plated, for example, a reed switch 1 in a horizontal position, and a plating solution applied to the terminal portion 11a of the reed switch being conveyed. The plating solution supply body 23 that supplies the plating solution 23a, the plating electrode 24 that supplies the plating current to the terminal portion 11a, and the reed switch l are connected to the conveyor belt 2.
1 and an electromagnetic coil 25 that is held so as not to move.

搬送ベルト21は、リードスイッチlの円筒状ガラス管
が転がってベルト上を移動しないように位置決めする転
がり止め用の突起21aが上面に所定ピッチで形成され
ている。 図示せぬパーツフィーダから供給部26の傾
斜面を転がって搬送ベルト21上に供給されたリードス
イッチ1は、この突起21aに係止して所定間隔で水平
にかつ端子部11aがベルトの両側に突出するように搬
送方向Aに対して直角に載置される。そしてリードスイ
ッチlは搬送ベルト21の移動によって水平に搬送され
て所定のめっき処理がなされ、排出部27の傾斜面に排
出される。
The conveyor belt 21 has protrusions 21a formed at a predetermined pitch on its upper surface to prevent rolling, which positions the cylindrical glass tube of the reed switch l so that it does not roll and move on the belt. The reed switches 1 rolled on the inclined surface of the supply section 26 from a parts feeder (not shown) and supplied onto the conveyor belt 21 are latched onto the protrusions 21a and held horizontally at predetermined intervals, with the terminal portions 11a on both sides of the belt. It is placed perpendicular to the transport direction A so as to protrude. The reed switch l is then conveyed horizontally by the movement of the conveyor belt 21, subjected to a predetermined plating treatment, and then discharged onto the inclined surface of the discharge section 27.

押さえベルト22は所定の間隔を隔てて搬送ベルト21
の上側に配置され適度の押圧力でリードスイッチ1を押
圧しながら搬送方向に搬送ベルト21と異なる送り速度
Bで移動するようになっている。
The presser belt 22 is attached to the conveyor belt 21 at a predetermined interval.
It is arranged above the reed switch 1 and moves in the conveying direction at a feed speed B different from that of the conveyor belt 21 while pressing the reed switch 1 with an appropriate pressing force.

これによってリードスイッチ1は搬送ベルト21上でそ
の位置を変えずに適度に回転する。電磁コイル25は搬
送ベルト21に沿ってその裏面に設けられ、発生する磁
界が搬送ベルト21を声道してその上に載置されている
リードスイッチ、1の磁性体(リード片)に作用し、リ
ードスイッチ1を搬送ベルト21の表面に引きつける働
きをなす。この押圧ベルト22と電磁コイル25の作用
によってリードスイッチlは搬送ベルト21上でその位
置を変えることなく回転しつつ、搬送ベルト21の移動
とともに水平に搬送される。 めっき液供給体23は搬
送ベルト21に沿って両側に設けられ、箱状のめっき槽
23c内にめっきノズル23bが配置され、めっきノズ
ル23bは内蔵するめっき液循環手段によって、リード
スイッチ1の通過路より高い位置まで所定の幅にわたっ
て一面にめっき液23aを噴出するようになっている。
As a result, the reed switch 1 rotates appropriately on the conveyor belt 21 without changing its position. The electromagnetic coil 25 is provided on the back side along the conveyor belt 21, and the generated magnetic field passes through the conveyor belt 21 and acts on the magnetic body (reed piece) of the reed switch 1 placed on it. , serves to attract the reed switch 1 to the surface of the conveyor belt 21. Due to the action of the pressure belt 22 and the electromagnetic coil 25, the reed switch I is rotated on the conveyor belt 21 without changing its position, and is conveyed horizontally as the conveyor belt 21 moves. The plating solution supply body 23 is provided on both sides along the conveyor belt 21, and a plating nozzle 23b is arranged in a box-shaped plating tank 23c. The plating solution 23a is sprayed all over a predetermined width up to a higher position.

めっき液供給体23の内部には、めっき液に接して図示
せぬめっき陽極が設けられている。
A plating anode (not shown) is provided inside the plating solution supply body 23 in contact with the plating solution.

めっき陰極24は白金線等よりなる細長い導電体で、め
っき液供給体23の上部のリードスイッチの端子部11
aが通過する位置に水平かつ搬送ベルト21の移動方向
に対して傾けて設けら、端子部11aは接触位置を変え
ながらこの電極24上を摺動しつつ移動するようになっ
ており、この電極から被めっき物の端子部にめっき電流
が連続して供給される。
The plating cathode 24 is an elongated conductor made of platinum wire or the like, and is connected to the terminal section 11 of the reed switch on the upper part of the plating solution supply body 23.
The terminal portion 11a is provided horizontally at the position where the electrode 24 passes and inclined with respect to the moving direction of the conveyor belt 21, and the terminal portion 11a moves while sliding on this electrode 24 while changing the contact position. A plating current is continuously supplied to the terminal portion of the object to be plated.

上記構成になる端子めっき装置は、リードスイッチ等の
磁性端子を有する円筒状電子部品の端子部に連続してす
ずめつきやはんだめっきなどのめっき処理を良好に施す
ことができる。
The terminal plating apparatus configured as described above can successfully perform continuous plating treatment such as tin plating or solder plating on the terminal portion of a cylindrical electronic component having a magnetic terminal such as a reed switch.

次に第2図により、上記端子めっき装置を組み込んだリ
ードスイッチ端子自動めっきシステムの例を説明する。
Next, an example of an automatic reed switch terminal plating system incorporating the above-mentioned terminal plating apparatus will be explained with reference to FIG.

図において、上記端子めっき装置34の前には電解脱脂
や酸洗い等のめ号き前処理を施す装置33が、また後側
には洗い等の後処理装置や乾燥装置などがライン状に連
結されている。これらの前後処理装置も噴射ノズルを具
えた処理液供給体や搬送ベルト等を用いてめっき装置と
同様に構成されている。そして全処理装置を貫通して上
述の搬送ベルトや押さえベルトよりなる共通の搬送手段
が設けられており、カートリッジ31に収納された状態
で前工程(ガラス管封止工程)から供給されたリードス
イッチは、パーツフィーダ32によりこの搬送手段に送
りこまれ、複数の処理装置を連続して順次通過して端子
めっきが自動的に施され、パーツフィーダ37に排出さ
れて再びカートリッジ38に収納されて試験工程などの
後工程へ送られる。
In the figure, in front of the terminal plating device 34 is a device 33 that performs pre-plating treatments such as electrolytic degreasing and pickling, and behind it are post-processing devices such as washing, drying devices, etc. connected in a line. has been done. These pre- and post-processing devices are also configured in the same way as the plating device, using a processing liquid supply body equipped with a spray nozzle, a conveyor belt, and the like. A common conveying means consisting of the above-mentioned conveying belt and presser belt is provided that passes through all the processing devices, and the reed switch is supplied from the previous process (glass tube sealing process) while being housed in the cartridge 31. is fed into this conveyance means by the parts feeder 32, passes through a plurality of processing devices in sequence, is automatically subjected to terminal plating, is discharged to the parts feeder 37, and is stored in the cartridge 38 again for the testing process. It is sent to subsequent processes such as

これらの全ての処理工程は、搬送ベルトに正しく配列し
たリードスイッチが自動的に送られてなされるので人手
を必要とせず、端子面りが発生しないので高品質の端子
めっき処理を達成することができる。
All of these processing steps are carried out by automatically feeding correctly arranged reed switches onto a conveyor belt, so no human intervention is required, and there is no terminal surface scraping, making it possible to achieve high-quality terminal plating processing. can.

〔発明の効果〕 以上説明した如く、本発明によればリードスイッチ等の
円筒状絶縁体に磁性体端子を有する電子部品に対して端
子めっきを自動的に連続して行うことが可能となり、リ
ードスイッチ等の製造コストの低減と品質の向上に寄与
することが顕著である。
[Effects of the Invention] As explained above, according to the present invention, it is possible to automatically and continuously perform terminal plating on electronic components such as reed switches that have magnetic terminals on cylindrical insulators. This significantly contributes to reducing manufacturing costs and improving quality of switches and the like.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の端子めっき装置を示す図、第2図は
、リードスイッチ端子の自動めっきシ例(リードスイッ
チ)を示す図、 である。 図において、 l・−・被めっき物(リードスイッチ)、11−・リー
ド片、     11a−・一端子部、12・−・円筒
状のガラス管、21・・・搬送ベルト、21a・−突起
、     22−・押さえベルト、23−・−めっき
液供給体、 23a・−めっき液、23b・・・めっき
ノズル、 24−・・めっき陰極、25・・・電磁コイ
ル、 である。 −に
FIG. 1 is a diagram showing a terminal plating apparatus of the present invention, and FIG. 2 is a diagram showing an example of automatic plating of reed switch terminals (reed switch). In the figure, l... object to be plated (reed switch), 11 - lead piece, 11a - one terminal part, 12... cylindrical glass tube, 21... conveyor belt, 21a - protrusion, 22--Press belt, 23--Plating solution supply body, 23a--Plating solution, 23b--Plating nozzle, 24---Plating cathode, 25--Electromagnetic coil. −to

Claims (1)

【特許請求の範囲】 円筒状絶縁体の両端から軸状に突出する磁性材料の端子
部(11a)を有する被めっき物(1)に連続して端子
めっきを施す装置であって、 前記被めっき物(1)の軸が搬送方向に直角になるよう
に水平に保持し該被めっき物(1)のベルト上での移動
を規制する突起(21a)が所定間隔で上面に形成され
、前記端子部(11a)を幅側に突出させて該被めっき
物(1)を搬送する搬送ベルト(21)と、 前記搬送ベルト(21)の上側にあって該搬送ベルト(
1)と異なる速度で移動して前記被めっき物(1)に回
転を与えつつ挟持する押さえベルト(22)と、 前記搬送ベルト(22)の両側にあって搬送されつつあ
る被めっき物(1)の端子部(11a)にめっき液を噴
射するめっき液供給体(23)と、 該めっき液供給体(23)の上にあって前記被めっき物
の端子部(11a)に接触ししかもその接触位置が被め
っき物(1)の搬送に伴って端子の軸方向に変化するよ
うに前記搬送ベルト(21)に対して傾斜して配置され
ためっき陰極(24)と、 前記搬送ベルト(21)の下側にあって該搬送ベルトを
介して前記被めっき物(1)を吸引保持する電磁コイル
(25)と、 を有することを特徴とする端子めっき装置。
[Scope of Claims] An apparatus for continuously applying terminal plating to an object to be plated (1) having terminal portions (11a) of a magnetic material protruding from both ends of a cylindrical insulator in the shape of a shaft, comprising: Projections (21a) are formed on the top surface at predetermined intervals to hold the object (1) horizontally so that its axis is perpendicular to the conveying direction and to restrict movement of the object (1) on the belt. a conveyor belt (21) that conveys the object to be plated (1) with a portion (11a) protruding widthwise; and a conveyor belt (21) that is located above the conveyor belt (21)
1), a presser belt (22) moves at a speed different from that of the object to be plated (1) and holds the object to be plated (1) while imparting rotation; ) a plating solution supply body (23) that injects plating solution to the terminal part (11a) of the object to be plated; a plating cathode (24) arranged obliquely with respect to the conveyor belt (21) so that the contact position changes in the axial direction of the terminal as the object to be plated (1) is conveyed; and the conveyor belt (21). ) and an electromagnetic coil (25) that is located below the conveyor belt and that attracts and holds the object to be plated (1) via the conveyor belt.
JP31251589A 1989-11-30 1989-11-30 Terminal plating device Pending JPH03173793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31251589A JPH03173793A (en) 1989-11-30 1989-11-30 Terminal plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31251589A JPH03173793A (en) 1989-11-30 1989-11-30 Terminal plating device

Publications (1)

Publication Number Publication Date
JPH03173793A true JPH03173793A (en) 1991-07-29

Family

ID=18030154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31251589A Pending JPH03173793A (en) 1989-11-30 1989-11-30 Terminal plating device

Country Status (1)

Country Link
JP (1) JPH03173793A (en)

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