JPH03171761A - Ceramic printed-circuit board and manufacture thereof - Google Patents
Ceramic printed-circuit board and manufacture thereofInfo
- Publication number
- JPH03171761A JPH03171761A JP31137589A JP31137589A JPH03171761A JP H03171761 A JPH03171761 A JP H03171761A JP 31137589 A JP31137589 A JP 31137589A JP 31137589 A JP31137589 A JP 31137589A JP H03171761 A JPH03171761 A JP H03171761A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- conductor
- mainly consists
- circuit board
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims abstract description 36
- 238000005304 joining Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 6
- 241000587161 Gomphocarpus Species 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000007790 solid phase Substances 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、ビングリッドアレイ（ＰＧＡ）パッケージ等
のセラミックス回路基板及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a ceramic circuit board such as a bin grid array (PGA) package and a method for manufacturing the same.
（従来の技術）、
従来、ビングリッドアレイセラミックスパッケージのビ
ン接合は第４図に示す構造のものが知られている。即ち
、図中の１は表面にＷ導体回路２が形成されたセラミッ
クスからなる基材である。(Prior Art) Conventionally, the structure of the bin joint of a bin grid array ceramic package as shown in FIG. 4 is known. That is, 1 in the figure is a base material made of ceramics on which a W conductor circuit 2 is formed.
前記導体回路２は、前記基材１を貫通して設けたビアホ
ール部３により内部配線に接続されている。The conductor circuit 2 is connected to internal wiring through a via hole 3 provided through the base material 1.
前記導体回路２には、ニッケルメッキ層４及び金メッキ
層５が順次形成され、かつ該金メッキ層５には例えばコ
バール、４２アロイからなるビン６のネールヘッド部６
ａが銀ろう材７を介して接合されている。また、Ｔｉ．
％Ｚ『、Ｈｆのような活性金属を含む銀ろうや活性金属
単独でビン接合を行う場合には、第５図に示すようにニ
ッケルメッキ層及び金層を形成せずに直接活性金属層８
とセラミックス基材１を接合させることになる。A nickel plating layer 4 and a gold plating layer 5 are sequentially formed on the conductor circuit 2, and the gold plating layer 5 has a nail head portion 6 of a bottle 6 made of, for example, Kovar or 42 alloy.
a are joined with a silver brazing filler metal 7 interposed therebetween. Also, Ti.
When bonding is performed using a silver solder containing an active metal such as %Z'' or an active metal alone, as shown in FIG.
and the ceramic base material 1 are bonded to each other.
しかしながら、前記基材ｌを窒化アルミニウムＣＡＲ
Ｎ）を用いて形成した場合にはＡＩＮの熱膨張係数が小
さく、一方銀ろう又は活性金属の窒化物（Ｔ ｉ Ｎ等
）からなる接合部は熱膨張係数が大きいため、ビン付け
時や使用時に加わる熱サイクルに伴う応力によって接合
部分の強度の低下やセラミックス部にクラックが発生す
るなどの信頼性の点で問題があった。また、融点の低い
銀ろう材や活性金属をピンの接合材料として用いると、
ＡＩＮグリーンシートの焼成工程後に別工程としてピン
付けを行う必要がある。その結果、ピンＢを第４図及び
第５図に示すようにそのネールヘッド部６ａを囲むよう
に多量の銀ろう材７、又は活性金属（もしくは活性金属
を含む銀ろう）８により接合する必要があるため、接合
との関係で導体回路の密度が制約される。従って、ＡＫ
ＩＮ回路基板をベースとし、ビン強度が高く、多ピンで
高密度導体回路を有するＰＧＡパッケージを得ることが
困難であった。However, the base material l is aluminum nitride CAR.
AIN has a small coefficient of thermal expansion when formed using N), while a joint made of silver solder or an active metal nitride (such as T i N) has a large coefficient of thermal expansion, making it difficult to use when attaching a bottle or using it. There were problems with reliability, such as a decrease in the strength of the bonded parts and cracks in the ceramic parts due to the stress caused by thermal cycles. In addition, if silver braze or active metal with a low melting point is used as a pin bonding material,
It is necessary to perform pinning as a separate process after the firing process of the AIN green sheet. As a result, it is necessary to bond pin B with a large amount of silver solder 7 or active metal (or silver solder containing active metal) 8 so as to surround the nail head portion 6a as shown in FIGS. 4 and 5. Therefore, the density of the conductor circuit is restricted in relation to the bonding. Therefore, A.K.
It has been difficult to obtain a PGA package that is based on an IN circuit board, has high bottle strength, has a large number of pins, and has a high density conductor circuit.
（発明が解決しようとする課題）
本発明は、上記従来の課題を解決するためになされたも
のでセラミックス、特にＡｌ！Ｎ基材をベースとし、外
部端子強度が高く、かつ多端子で高密度導体回路を有す
るＰＧＡパッケージ等のセラミックス回路基板、並びに
かかるセラミックス回路基板を簡単な工程により製造し
得る方法を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-mentioned conventional problems. An object of the present invention is to provide a ceramic circuit board such as a PGA package that is based on an N base material, has high external terminal strength, and has multiple terminals and a high-density conductor circuit, as well as a method for manufacturing such a ceramic circuit board through a simple process. It is something.
［発明の構或］
（３題を解決するための手段及び作用）本発明のセラミ
ックス回路基板は、ＡｐＮ等のセラミックス基材の導体
回路にピン等の外部端子を接合部材を介することなく直
接連結したことを特徴とするものである。[Structure of the Invention] (Means and Effects for Solving the Three Problems) The ceramic circuit board of the present invention allows external terminals such as pins to be directly connected to a conductor circuit of a ceramic base material such as ApN without using a joining member. It is characterized by the fact that
前記導体回路は、例えばタングステン（Ｗ）を主成分と
する導体材料から形成される。但し、導体回路は同時焼
成に耐えるものであればＷを主成分とする材料に限るも
のではない。The conductor circuit is formed from a conductor material containing tungsten (W) as a main component, for example. However, the conductive circuit is not limited to a material containing W as a main component as long as it can withstand simultaneous firing.
前記外部端子は、導体回路と同様に同時焼威に耐えれば
よく、例えばＡｊｌＮの場合はその焼或温度である１８
００℃以上、好ましくは２０００℃，以上の融点を有す
るものであることが望ましい。具体的には、Ｗ単独、又
は７Ｏｆｆｉ量％以上のＷと、３０＠量％以下のＢＳＣ
ｓ Ｈ ｆ − Ｎ ｂ％Ｉ ｒ、Ｍｏ，ＲｅｓＴａ，
Ｔｉ，Ｚｒから選ばれる少なくとも１種との組成等から
なるＷを主成分とするものが挙げられる。後者の組成の
外部端子は、化学的に安定であるか、窒化物の形で安定
化しＷ単独の場合と同様な効果が得られる。The external terminals only need to withstand the same firing temperature as the conductor circuit, for example, in the case of AJIN, the firing temperature is 18
It is desirable to have a melting point of 00°C or higher, preferably 2000°C or higher. Specifically, W alone, or W with an amount of 7Offi amount% or more and BSC with an amount of 30@amount% or less
sHf-Nb%Ir, Mo, ResTa,
Examples include those whose main component is W, which is composed of at least one selected from Ti and Zr. The external terminal having the latter composition is chemically stable or stabilized in the form of nitride, and the same effect as in the case of W alone can be obtained.
上述した本発明のＰＧＡパッケージ等のセラミックス回
路基板によれば、ＡＩＮ等のセラミックス基材の導体回
路にビン等の外部端子を強固に接合した構造を実現でき
る。According to the above-described ceramic circuit board such as a PGA package of the present invention, it is possible to realize a structure in which an external terminal such as a bottle is firmly joined to a conductor circuit of a ceramic base material such as AIN.
次に、本発明に係わるセラミックス回路基板、例えばＰ
ＧＡパッケージの製造方法を図面を参照して説明する。Next, a ceramic circuit board according to the present invention, for example, P
A method for manufacturing a GA package will be described with reference to the drawings.
まず、ドクターブレード法により例えば第１〜第３のＡ
ＩＮグリーンシートｌｌ＋〜１１３を作製する。前記第
２のＡｇＮグリーンシート１１２に上下に貫通するビア
ホール１３を開口し、ここにＷを主成分とする導体ペー
ストｌ２を埋め込むと共に、その表面にＷを主成分とす
る導体ペーストｌ２を形成し、裏面にもＷを主成分とす
る導体ペーストｌ２形成する。前記第３のＡｊｌＮグリ
ーンシート１１３にビン挿入穴ｌ４を開口する。つづい
て、第１及び前？第２のＡｆｌＮグリ．−ンシ一トＬ１
＋ 、１１■を重ね、更に第２の／ＩＮグリーンシート
１１２上に挿入穴ｌ４が開口された第３のＡ，ＱＮグリ
ーンシート１１Ｎを重ねた後、加熱加圧して積層する。First, by the doctor blade method, for example, the first to third A
IN green sheets 11+ to 113 are produced. A via hole 13 penetrating vertically is opened in the second AgN green sheet 112, a conductive paste l2 mainly composed of W is embedded therein, and a conductive paste l2 mainly composed of W is formed on the surface thereof, A conductive paste l2 containing W as a main component is also formed on the back surface. A bottle insertion hole l4 is opened in the third AJIN green sheet 113. Next, the first and previous? Second AflNgri. - scene L1
+, 11■ are superimposed, and the third A, QN green sheet 11N having an insertion hole l4 is further superimposed on the second /IN green sheet 112, and then heated and pressurized to laminate.
ひきつづき、Ｗを主成分とするピンｌ５のネールヘッド
部１５ａを前記ビン挿入穴ｌ４を通してＡｆｉＮグリー
ンシート１１２の導体ペーストｌ２に当接させる（第１
図図示）。次いで、１８００℃程度の温度で焼成する。Subsequently, the nail head portion 15a of the pin 15 whose main component is W is brought into contact with the conductive paste 12 of the AfiN green sheet 112 through the bottle insertion hole 14 (the first
(Illustrated) Next, it is fired at a temperature of about 1800°C.
これにより前記ＡｆｉＮグリーンシート１１■〜ｌｌｉ
が焼成されて一体化及び緻密化されると共に、導体ペー
ストも緻密化される。同時に、ビンＩ５もＷを主威分と
する導体回路に固相接合される。その結果、導体回路と
ピンはＷの連続した組織となって一体化される。したが
って、従来のようにろう材を使用せずに熱膨張率や濡れ
性（接合性）などの物理的性質によるビンと導体回路と
の接合強度の低下を回避できる共に、多ピンを高密度で
接合したＰＧＡパッケージを製造できる。しかもＡｆｉ
Ｎグリーンシートの焼成と同時にピン付けを行うことが
できるため、簡単かつ量産的にＰＧＡパッケー？を製造
できる。As a result, the AfiN green sheets 11~lli
are fired to be integrated and densified, and the conductor paste is also densified. At the same time, the bin I5 is also solid state bonded to the conductor circuit whose main component is W. As a result, the conductor circuit and the pin become a continuous W structure and are integrated. Therefore, it is possible to avoid a decrease in the bonding strength between the bottle and the conductor circuit due to physical properties such as thermal expansion coefficient and wettability (bondability) without using a brazing filler metal as in the past, and it is also possible to connect multiple pins at high density. Bonded PGA packages can be manufactured. Moreover, Afi
Since the pin attachment can be done at the same time as firing the N green sheet, it is possible to easily and mass-produce PGA packages. can be manufactured.
また、本発明方広においては第２図に示すようにビンｌ
５のネールヘッド部１５ａの底部に突起１６を形成し、
該突起ｌ６をビン挿入穴１４を通してＡＩＮグリーンシ
ート１１２の導体ペーストｌ２に差し込んでもよい。か
かる方法によれば、ピンｌ５を安定してグリーンシート
１１■の導体ペーストｌ２に取り付けることが可能とな
ると共に、高精度のビン付けが可能となる。In addition, in the method of the present invention, as shown in FIG.
A protrusion 16 is formed on the bottom of the nail head portion 15a of No. 5,
The protrusion l6 may be inserted into the conductive paste l2 of the AIN green sheet 112 through the bottle insertion hole 14. According to this method, it is possible to stably attach the pin l5 to the conductor paste l2 of the green sheet 112, and it is also possible to attach pins with high accuracy.
更に、本発明方法においては第３図（Ａ）に示すように
ビンｌ５のネールヘッド部をなくし、その底部に突起１
６を形成し、一方第３のＡ４７Ｎグリーンシートｌ１３
にピンｌ５の直径より僅かに大きい径のビン神人穴ｌ４
をパンチング等で開口し、前記形状のビンｌ５を前記揮
人穴１４を通して該ビンｌ５の突起１６をＡ，ＩＩＮグ
リーンシート＋１２の導体ペーストｌ２に差し込んでも
よい。このような工程の後にｌ８００℃程度の温度で焼
或することによって、同図（Ｂ）に示すように前記ＡＩ
ＮグリーンンートＩｌｌ〜１１３が焼成され、緻密化さ
れてＡｊ７Ｎ基材２１となると共に、導体ペーストも緻
密化されて導体回路２２及びビアホール部２３が形威さ
れる。同時に、ビンｌ５もＷを主或分とする導体回路２
２に固相接合されて導体回路２２とビン１５はＷの連続
した組織となって一体化されたＰＧＡパッーケジが製造
される。また、ＡＩＮグリーンシート１１，〜１１３が
緻密化する段階でＡｊ７Ｎ基材２１は収縮ずるが、Ｗを
主或分とするビンｌ５は収縮しないため、同図（Ｂ）に
示すように焼成後のＡＩＩＮ基材２１のピン挿入穴ｌ４
内面にビン１５の外周面が密着してビンｉ５をより安定
的に固定することが可能となる。Furthermore, in the method of the present invention, as shown in FIG.
6, while the third A47N green sheet l13
Bottle hole l4 with a diameter slightly larger than the diameter of pin l5
The bottle 15 having the shape described above may be opened by punching or the like, and the protrusion 16 of the bottle 15 may be inserted into the conductor paste 12 of the A, IIN green sheet +12 through the screw hole 14. After this process, the AI is baked at a temperature of about 1800°C, as shown in Figure (B).
The N green root Ill~113 is fired and densified to become the Aj7N base material 21, and the conductor paste is also densified to form the conductor circuit 22 and the via hole portion 23. At the same time, the conductor circuit 2 whose main portion is W
2, the conductor circuit 22 and the bottle 15 form a continuous structure of W, and an integrated PGA package is manufactured. In addition, the Aj7N base material 21 shrinks when the AIN green sheets 11, - 113 are densified, but the bottle 15, which is mainly made of W, does not shrink. Pin insertion hole l4 of AIIN base material 21
The outer circumferential surface of the bottle 15 comes into close contact with the inner surface, making it possible to fix the bottle i5 more stably.
（実施例）
以下、本発明の実施例を前述した第３図（Ａ）（Ｂ）を
参照して詳細に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 3(A) and 3(B) described above.
まず、ドクターブレード法により厚さ １００〜４００
μｍの例えば第１〜第３のＡｊ７Ｎグリーンシートｌｌ
＋〜１１３を作製した。前記第２のＡｆｉＮグリーンシ
ー１−１１２に上下に貫通するビアホールｌ３を開口し
、ここにＷを主成分とする導体ペーストｌ２を埋め込む
と共に、その表面にＷを主成分とす？導体ペーストｌ２
を形成し、裏面にもＷを主成分とする導体ペーストｌ２
形或する。前記第３のＡｆＩＮグリーンシート１１３に
パンチングにより０．２２ｍｍ径のピン挿入穴１４を例
えば３００個開口した。 次いで、第１及び前記第２の
ＡＩＮグリーンシート１１■、１１■を重ね、更に第２
のＡＩＩＮグリーンシート１１■上に挿入穴ｌ４が開口
された第３のＡｇＮグリーンシート１１，を重ねた後、
加熱加圧して積層した。つづいて、ネールヘッド部なし
で先端に突起ＩＢを有する ０．３ｍｍ径の３００本の
ビン１５を、前記グリーンシート積層体の第３のＡｊ７
Ｎグリーンシートｌｈの複数の挿入穴１４を通して各ビ
ンｌ５の突起ｌ６をＡｊ７Ｎグリーンシート１１２の導
体ペーストｌ２に差し込んだ。ひきつづき、脱脂後、窒
素雰囲気中、１８００℃で１時間常圧焼威して同図（Ｂ
）に示す３０Ｉｌｍ角のＰＧＡパッケージを製造した。First, the thickness is 100 to 400 using the doctor blade method.
For example, the first to third Aj7N green sheets ll
+ to 113 were produced. A via hole l3 passing vertically through the second AfiN green sea 1-112 is opened, a conductive paste l2 containing W as a main component is embedded therein, and a conductive paste l2 containing W as a main component is filled in the via hole l3, and a conductor paste l2 containing W as a main component is filled in the via hole l3. conductor paste l2
, and a conductor paste l2 containing W as the main component is also formed on the back side.
take shape For example, 300 pin insertion holes 14 having a diameter of 0.22 mm were formed in the third AfIN green sheet 113 by punching. Next, the first and second AIN green sheets 11■, 11■ are stacked, and then the second
After stacking the third AgN green sheet 11 with the insertion hole l4 on top of the AIIN green sheet 11,
They were laminated by heating and pressurizing. Next, 300 bottles 15 having a diameter of 0.3 mm and having a protrusion IB at the tip without a nail head part were placed in the third Aj7 of the green sheet laminate.
The protrusion l6 of each bottle l5 was inserted into the conductor paste l2 of the Aj7N green sheet 112 through the plurality of insertion holes 14 of the N green sheet lh. Subsequently, after degreasing, the same figure (B
) A 30 lm square PGA package was manufactured.
得られたＰＧＡパッケージのビン強度をクロスヘッドス
ピードｌＯ一一／ｓｉｎの条件の引張り試験により測定
した。その結果、８．１ｋ ｇ ｆ ／ビンと極めて高
いビン強度を有することが確認された。The bottle strength of the obtained PGA package was measured by a tensile test at a crosshead speed of 10/sin. As a result, it was confirmed that the bottle had an extremely high bottle strength of 8.1 kg f/bin.
［発明の効果］
以上詳述した如く、本発明によれば外部端子強度が高く
、かつ多端子で高密度導体回路を有するＰＧＡパッケー
ジ等のセラミクス回路基板、並びにかかる回路基板を簡
単かつ量産的に製造し得る方法を提供できる。[Effects of the Invention] As detailed above, according to the present invention, a ceramic circuit board such as a PGA package, which has high external terminal strength, multiple terminals, and a high-density conductor circuit, and such a circuit board can be easily and mass-produced. A manufacturing method can be provided.
第１図は本発明のＰＧＡパッケージの製造途中を示す断
面図、第２図は本発明の他のＰＧＡパッケージの製造途
中を示す断面図、第３図（Ａ）、（Ｂ）は本発明の更に
他のＰＧＡパッケージの製造工程を示す断面図、第４図
及び第５図は夫々従来のＰＧＡパッケージを示す断面図
である。
１１１〜１１３・・・Ａ４７Ｎグリーンシート、ｌ２・
・・導体ペースト、１３・・・ビアホール、１４・・・
ピン挿入穴、１５・・・ピン、１５ａ・・・ネールヘッ
ド部、１６・・・突起、２１・・・ＡＩＮ基材、２２・
・・導体回路、２３・・・ビアホール部。FIG. 1 is a cross-sectional view showing the PGA package of the present invention in the middle of manufacturing, FIG. 2 is a cross-sectional view showing another PGA package of the present invention in the middle of manufacturing, and FIGS. 3(A) and (B) are the PGA packages of the present invention. Further, FIGS. 4 and 5 are cross-sectional views showing the manufacturing process of another PGA package, and FIGS. 4 and 5 are cross-sectional views showing conventional PGA packages, respectively. 111-113...A47N green sheet, l2.
... Conductor paste, 13... Via hole, 14...
Pin insertion hole, 15... Pin, 15a... Nail head part, 16... Protrusion, 21... AIN base material, 22...
... Conductor circuit, 23... Via hole part.
Claims (2)
結されたことを特徴とするセラミックス回路基板。(1) A ceramic circuit board characterized in that an external terminal is directly connected to a conductor circuit of a ceramic base material.
パターンを形成する工程と、この導体ペーストパターン
に外部端子を当接させ、前記グリーンシートの焼成と同
時に外部端子の接合を行う工程とを具備したことを特徴
とするセラミックス回路基板の製造方法。(2) It is characterized by comprising a step of forming a pattern of conductive paste on a ceramic green sheet, and a step of bringing an external terminal into contact with the conductive paste pattern and joining the external terminal at the same time as firing the green sheet. A method for manufacturing a ceramic circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31137589A JPH03171761A (en) | 1989-11-30 | 1989-11-30 | Ceramic printed-circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31137589A JPH03171761A (en) | 1989-11-30 | 1989-11-30 | Ceramic printed-circuit board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03171761A true JPH03171761A (en) | 1991-07-25 |
Family
ID=18016423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31137589A Pending JPH03171761A (en) | 1989-11-30 | 1989-11-30 | Ceramic printed-circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03171761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299559A (en) * | 1992-04-20 | 1993-11-12 | Kyocera Corp | Electronic component with lead |
-
1989
- 1989-11-30 JP JP31137589A patent/JPH03171761A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299559A (en) * | 1992-04-20 | 1993-11-12 | Kyocera Corp | Electronic component with lead |
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