JPH03170550A - Photopolymer composition - Google Patents

Abstract

PURPOSE:To obtain a highly sensitive and highly heat-resistant photosensitive polyimide resin composition having good adhesion and low modulus by mixing a copolymer of a silicone-diamine with a polyamic acid with a styryl compound and an oxazolone compound as essential components. CONSTITUTION:A photopolymer composition is formed by mixing a copolymer (A) of 0.5-25wt.% siliconediamine of formula I (wherein (n) is 1-50) with 99.5-75wt.% polyamic acid of formula II (wherein R2 is a tri- or tetra-valent organic group; R3 is a C-C double bond-containing group; and (m) is 1-2) with a sensitizer (B) comprising a styryl compound of formula III (wherein R4 is H, CH3, C2H5 or C6H5; and R5 is benzooxazolyl or the like) and an initiator (C) comprising an oxazolone compound of formula IV (wherein R6 is substituted phenyl or substituted naphthyl). The amounts of the components are such that 1-10 pts.wt. component B and 1-20 pts.wt. component C are used per 100 pts.wt. component A.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a photosensitive polyimide resin composition that has good adhesion, low elastic modulus, high sensitivity, and high heat resistance.

[Conventional technology] Conventionally, surface protection films and interlayer insulating films of semiconductor elements, etc.
Polyimide resin is used because it has excellent heat resistance and outstanding electrical and mechanical properties. However, in recent years, semiconductor devices have become more highly integrated and larger, sealing resin packages have become thinner and smaller, and solder With the shift to surface mounting methods using reflow, there is a demand for significant improvements in heat cycle resistance, heat shock resistance, etc., and conventional polyimide resins have
It has become difficult to respond.

As a countermeasure against this problem, it is known that, for example, a silicone component is introduced into the polyimide resin to increase adhesion and lower the elastic modulus. (JP-A-61-64730, JP-A-62-223228, etc.) On the other hand, a technique for imparting photosensitivity to polyimide resin itself has recently attracted attention.

Using polyimide resins that have been given these photosensitizers not only simplifies the pattern creation process compared to polyimide resins that have not been given photosensitivity, but also eliminates the need to use highly toxic etching solutions, making them safer. It is also excellent in terms of pollution, and photosensitization of Voimide resin is expected to become an even more important technology in the future, along with the development of high adhesion and low elastic modulus of polyimide resin.

As the photosensitive polyimide resin, for example, a polyimide precursor composition to which a photosensitive group is added with an ester group having a structure as shown in the following formula (Japanese Patent Publication No. 55-30207, Japanese Patent Publication No. 55-41422) or the following. A composition obtained by adding a compound containing a carbon-carbon double bond and an amino group or a quaternized salt thereof that can be converted into 2i by actinic radiation or polymerized to a polyamic acid having a structure as shown in the formula (for example, JP-A No. Publication No. 54-145794) is known.

All of these are dissolved in a suitable organic solvent and made into a varnish state (2).After drying, UV irradiation is performed through a photomask, development and rinsing treatment to obtain the desired pattern, followed by further heat treatment. This makes it a polyimide coating.

However, when such conventional photosensitization technology is applied to a polyimide resin component with a silicone resin component, it is difficult to pattern even when irradiated with ultraviolet rays, or the sensitivity is extremely low. This was insufficient for processing with exposure equipment commonly used in the semiconductor industry.

Furthermore, when the film thickness of these photosensitive polyimide resins is increased, the photosensitivity is extremely reduced and the proper exposure time is extremely long.

[Problems to be Solved by the Invention] The purpose of the present invention is to improve adhesion by introducing silicone groups into polyamic acid, and to achieve highly sensitive photocurable properties despite lowering the elastic modulus. It is an object of the present invention to provide a photosensitive resin composition which has the following properties and further has an excellent heat resistance of a film after curing.

[Means for Solving the Problems] The present invention provides a silicone diamine represented by the following general formula (1) in an amount of 0.5 to 25% by weight.
A polyamic acid (A) represented by II), a styryl compound 9j (B) represented by the following general formula (ITI) as a sensitizer, and an oxazolone compound (C) represented by the following general formula (IV) as an initiator. is an essential component and (A) is 100 parts by weight, (B) is a sensitizer (B) is 1 to 10 parts by weight, and is an initiator (C) is 1
-20 parts by weight of the photosensitive resin composition is used.

[Function] The silicone diamine represented by the general formula CI) used in the present invention has the effect of improving the adhesion of the polyimide film and lowering the elastic modulus.

The degree of polymerization n of the silicone diamine needs to be 1 to 50, and when n is less than 1, the adhesion is improved,
The effect of lowering the elastic modulus cannot be obtained, and long-chain silicone diamines with n exceeding 50 are used. If used, the reaction with the tetracarboxylic dianhydride becomes difficult to proceed quantitatively, remains as an unreacted product, and not only does the molecular weight not increase, but flexibility decreases and cracks are likely to occur, which is not preferable.

The amount of silicone diamine used is preferably 0.5 to 25% by weight based on the polyamic acid component.

If it is less than 0.5% by weight, the effects of improving adhesion and lowering the elastic modulus cannot be obtained, and if it exceeds 25% by weight, the heat resistance will be significantly lowered and the characteristics inherent to polyimide resins will not be obtained, which is not preferable.

R2 of the polyamic acid represented by the general formula (II) used in the present invention is composed of a compound having a divalent organic group, and provides various properties in addition to the silicone diamine represented by the above formula CI). Therefore, aromatic diamines listed below can also be used in combination.

For example, m-phenylene diamine, 1-isobrobyl-
2,4-phenylene diamine, ρ-phenylene diamine, 4,4'-diaminodiphenylpropane, 3,
．． 3゜-Diaminodiphenylpropane, 4,4'-diaminodiphenylethane, 3,3'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 4,4 ′−
Diaminodiphenylsulfide, 3,3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ether, 3,3
'-Diaminodiphenyl ether, benzidine, 3,
3'-diaminobiphenyl, 3.3'-dimethyl-4
, 4'-diaminobiphenyl, 3,3'-dimethoxybenzidine, 4.4"-diamino-p-terphenyl, 3.3"-diamino-p-terphenyl, bis(p-
amino-cyclohexyl)methane, bis(p-β-amino-t-butylphenyl)ether, bis(p-β-methyl-δ-aminopentyl)benzene, p-bis(2-
Methyl-4-aminobenthyl)benzene, p-bis(
l,1-dimethyl-5-aminopentyl)benzene,
1.5-diaminonaphthalene, 2.6-diaminonaphthalene, 2,4-bis(β-amino-t-butyl)toluene, 2,4-diaminotoluene, m-xylene-
2.5-diamine, p-xylene-2.5-diamine,
m-xylylene diamine, p-xylylene diamine, 2,6-diamino-pyridine, 2,5-diamino-pyridine, 2,5-diamino-1.3.4-oxadiazole, 1.4- Diamin-cyclohexane, biperazine, methylene-diamine, ethylene-diamine, propylene-diamine, 2,2-dimethyl-propylene-diamine, tetramethylene-diamine, pentamethylene-diamine, hexamethylene-diamine, to 2,5-dimethyl-diamine xamethylene diamine, 3-methoxyhexamethylene diamine, heptamethylene diamine, 2,5-
Dimethyl-hebutamethylene-diamine, 3-methyl-hebutamethylene-diamine, 4,4-dimethylene-71w hebutamethylene-diamine, octamethylene-diamine, nonamethylene-diamine, 5-methylnonamethylene-diamine, 2.5- Dimethylnonamethylene diamine, decamethylene diamine, l,10-diamino l,10
-dimethyl-decane, 2,l1-diaminodecane,
Examples include, but are not limited to, 1,12-diamino-octadecane, 2,12-diamino-octadecane, and 2,17-diamino-7 icosane.

R1 of the polyamic acid represented by the general formula (II) used in the present invention is composed of a compound having a trivalent or tetravalent organic group, and various acid anhydrides are used.

For example, trimellitic anhydride, biromellitic dianhydride, benzene-1.2,3.4-tetracarboxylic dianhydride, 3.3',4.4'-benzophenonetetracarboxylic dianhydride compound, 2.2', 3.3'-benzophenonetetracarboxylic dianhydride, 2,3.3'. 4′
-benzophenonetetracarboxylic dianhydride, naphthalene-2,3,6,7-tetracarboxylic dianhydride, naphthalene-1,2,5,6-tetracarboxylic dianhydride,
Naphthalene-1,2,4,5-tetracarboxylic dianhydride, Naphthalene-1,4,5,8-tetracarboxylic dianhydride, Naphthalene-1,2,6,7-tetracarboxylic dianhydride , 4,8-dimethyl-1.2,3,5,6.
7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,
5,6.7-Hexahydride naphthalene-2.3,6.7
-Tetracarboxylic dianhydride, 2,6-dichloronaphthalene-1.4,5.8-tetracarboxylic dianhydride, 2
, 7-dichloronaphthalene-1.4,5.8-tetracarboxylic dianhydride, 2,3,6.7-tetrachloronaphthalene-1.4,5.8-tetracarboxylic dianhydride,
1,4,5.8-tetrachloronaphthalene-2.
3,6.7-tetracarboxylic dianhydride, 3.3',
4.4'-diphenyltetracarboxylic dianhydride, 2.
2',3.3'-diphenyltetracarboxylic dianhydride, 2,3.3',4'-diphenyltetracarboxylic dianhydride, 3.3'',4.4''-p-terphenyltetracarboxylic dianhydride Acid dianhydride, 2.2", 3.3"-p-terphenyltetracarboxylic dianhydride, 2,3,3",
4”-p-terphenyltetracarboxylic dianhydride, 2
．． 2-bis(2,3-dicarboxyphenyl)-propanihydride, 2,2-pis(3,4-dicarboxyphenyl)-propanihydride, bis(2,3-dicarboxyphenyl)ether dianhydride, Bis(3,4-dicarboxyphenyl)ether dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-
dicarboxyphenyl)methanihydride, bis(2.3
-dicarboxyphenyl)sulfonic anhydride, bis(3
, 4-dicarboxyphenyl)sulfone dianhydride, 1.
1-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)
Ethane dianhydride, berylene-2,:), 8.9-tetracarboxylic dianhydride, berylene-3.4,9.10-tetracarboxylic dianhydride, berylene-4.5, 10.1
1-tetracarboxylic dianhydride, perylene-5.6,1
1.12-tetracarboxylic dianhydride, phenanthrene-1.2,7.8-tetracarboxylic dianhydride, phenanthrene-1,2,6.7-tetracarboxylic dianhydride, phenanthrene-1,2,9 .10-tetracarboxylic dianhydride, cyclobentane-1,2,3.4-tetracarboxylic dianhydride, virazine-2.3,5.6-tetracarboxylic dianhydride, pyrrolidine-2.3, 4.5-
Tetracarboxylic dianhydride, thiophene-2.3,4.
Examples include, but are not limited to, 5-tetracarboxylic dianhydride.

R3 of the polyamic acid represented by the general formula (II) used in the present invention is composed of a compound having a carbon-carbon double bond, and various alcohols are used. For example, 2-hydroxyethyl methacrylate, 2-
Examples include, but are not limited to, hydroxyethyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxypropyl acrylate, allyl alcohol, and ethylene glycol monoallyl ether.

The polyamic acid as component (A) in the present invention has the following formula (II) (where R: a trivalent or tetravalent organic group, R2: a divalent organic group, R3: a carbon-carbon double bond) group, m:l~2
), and its synthesis method includes, for example, the method shown in Example 1 of Japanese Patent Publication No. 55-30207. That is, 8,782 weight parts of biromellitic dianhydride as a carboxylic acid anhydride and 400 volume parts of allyl alcohol as an alcohol having a carbon-carbon double bond were mixed into 0.4 weight parts of p,p.
After stirring for 26 hours at room temperature in the presence of '-bis(dimethylamino)-diphenylmethane, the excess allyl alcohol is distilled off in a water bomb vacuum. This was left at room temperature with 200 weight portions of thionyl chloride and 5 weight portions of dimethylformamide, and then boiled under reflux for 3 hours. Excess thionyl chloride is distilled off in a water pump vacuum. Next, dissolve this in 350 volumes of anhydrous dimethylacetamide and add 80 parts by weight of p.p. A diamino compound containing p'-diaminodiphenyl ether is dissolved and added dropwise to the solution cooled to 0°C so that the temperature of the reaction mixture does not exceed 20°C.

Once this is done and after stirring for 1 hour at room temperature, 5 volumes of aniline are added to the solution, stirred for 15 minutes and filtered.

The reaction product was precipitated dropwise into 4 liters of boiling water, washed with boiling water and a 1:1 acetone aqueous solution, and concentrated in vacuo for 8 hours.
Dry at 0°C to obtain a polymer.

The sensitizer of component CB) in the present invention is represented by the following formula (rII) It is a styryl compound with an amino group shown by

Sensitizers used in the photosensitive resin composition include penzophenone, acetophenone, anthrone, p. p'-tetramethyldiaminobenzophenone (Michler's ketone),
Phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, penzoquinone, N-acetyl-p-nitroaniline, p-nitroaniline, 2-ethylanthraquinone, 2-tert-butylanthraquinone, N-acetyl-4-nitro-1-naphthylamine, Biclamide, 1,2-penzuanthraquinone, 3-methyl-1.3
-diaza 1,9-penzanthrone, p,p'-tetraethyldiaminobenzophenone, 2-chloro-4-nitroaniline, dibenzalacetone, 1,2-naphthoquinone, 2,5-bis-(4'-diethylaminoben monocyclopentane, 2,6-bis-(4'-jethylaminobenzal) monocyclohexanone, 2,6-bis-
(4'-dimethylaminobenzal)-4-methyl-cyclohexanone, 2,6-bis-(4'-diethylaminobenzal)-4-methyl-cyclohexanone, 4.4'
-bis(dimethylamino)monochalcone, 4,4'-bis(jethylamino)monochalcone, p-dimethylaminobenzylideneindanone, 1,3-bis(4'-dimethylaminobenzal)monoacetone, 1,3 - Bisou (
Examples include 4'-diethylaminobenzal)-acetone, N-phenylene/k diethanolamine, N-p-}-lyrugethylamine, and the styryl compound discovered in the present invention is used as an initiator in the present invention. It shows a surprisingly good sensitizing effect only when used in combination with oxazolone compounds. It is currently unclear why this surprising synergistic effect occurs.

In addition, the blending amount of the styryl compound is polyamic acid 100
It is most preferably 1 part by weight or more and 10 parts by weight or less based on the weight part, and sensitizers other than styryl compounds may also be used in combination.

If the amount of the styryl compound is less than 1 part by weight, the amount of light energy absorbed will be insufficient, resulting in insufficient crosslinking, and
If the amount exceeds 10 parts by weight, the amount of light energy transmitted is insufficient, and photocuring in deep areas does not progress rapidly, which is not preferable.

The initiator of component (C) in the present invention has the following formula R7:
-H, -C H:x, -C, d{5, -C3I{7,
-C4H9. -C sH 5, -O I{ , -O C
H:l, -○C2Ii5, -OC3H7
, -OC 4H9, -OC 6H 5. -CH
2C8H 5, -C H2C H2C6H 5, -C
I 20 H , -C H 2C H 20H, -C
I■2C H3, 1C ■■(C H3)2. -C(C
H3)3,-COCH3,-COC2H5. -OCO
CH3. -O C O C 2H 5, -C H 2N
H2. -C H 2C H 2N H2, -C O
N H 2, -C O N H C H3, -C O
N (C H3)2. -CONHC2H5, -CON
(C2H5)2,-N H C H3,-N (C H
3) 2,-N(C2H5)2. ) is an oxazolone compound with an aromatic group.

As an initiator used in the photosensitive resin composition, 2.2-
Dimethoxy-2-phenyl-acetophenone, l-hydroxy-hexyl-phenyl ketone, 2-methyl-14-(methylthio)phenyl 1-2-morpholino-1-propane, 3.3',4.4'-tetra (t
-butylperoxycarbonyl)penzophenone, benzyl, penzoin-isopropyl ether, penzoin-isobutyl ether, 4,4'-dimethoxybenzyl, 1,4-dibenzoylbenzene, 4-penzoylbiphenyl, 2-penzoylnaphthalene, methyl- O-penzoylbenzoate, 2.2'-bis(0-chlorophenyl)-4.4', 5.5'-tetraphenyl-1,
2'-biimidazole, l-butyl-2-chloroacridone, ethyl-4-dimethylaminobenzoate, dibenzoylmethane, 2,4-diethylthioxanthone,
3,3-dimethyl-4-methoxypenzophenone, 2
-Hydroxy-2-methyl-1-phenylpropane-1
-one, 2-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-phenyl -1,2-butanedione-2-(O-methoxycarbonyl)oxime, l-phenylpropanebutanedione-2=(0-benzoyl)oxime, 1,2-diphenylethanedione-1-(O
-benzoyl)oxime, 1,3-diphenylpropanetrione-2-(O-benzoyl)oxime, l-phenyl-3-ethoxypropanetrione-2-(o-
(bezoyl) oxime, etc., but the oxazolone compound discovered in the present invention, in combination with a styryl compound as a sensitizer, showed a remarkable photoreaction initiation effect compared to other initiators.

The reason for how this surprising effect is expressed is currently not clear.

The amount of the oxazolone compound to be blended is essentially 1 to 20 parts by weight per 100 parts by weight of the polyamic acid, and initiators other than the oxazolone compound may also be used in combination.

If the amount of the oxazolone compound used as an initiator is less than 1 part by weight, the photosensitivity will be insufficient, which is not preferable.

Moreover, if it exceeds 20 parts by weight, the film properties after heat treatment and curing will deteriorate.

The present invention will be specifically explained below using Examples.

Example 1 Pyromellitic dianhydride 65.5g (0.30 mol)
and 225.5 g (0.70 mol) of 3.3',4.4'-benzophenonetetracarboxylic dianhydride 91,
2-hydroxyethyl methacrylate-1- 270.7g
After esterification with (2.08 mol), 4.4′-
Diaminodiphenyl ether 170.2g (0.85
128.7 g (0.10 mol, 15 mol) of silicone diamine represented by the following formula in polyamic acid
% by weight) to obtain a polymer.

Next, to 100 parts by weight (solid content) of the polymer, 3 parts by weight of 2-(p-dimethylaminostyryl)penzoxazole as a sensitizer, 6 parts by weight of 3-phenyl-5-isoxazolone as an initiator, etc. , 15 parts by weight of tetraethylene glycol diacrylate, 1 part by weight of 1-phenyl-5-mercapto-IH-tetrazole, 21 parts of 3-methacrylate-trimethoxysilane, 0.1 part by weight of p-tertiary abutylcatechol. Add N- at room temperature
Dissolved in methylpyrrolidone.

The obtained solution was applied onto an aluminum plate using a swinner and dried at 80°C for 1 hour using a drier.

Kodak Photographic Step Tablet No. 2 was attached to this film. 21 steps (In this gray scale, each time the number of steps increases, the amount of transmitted light increases by one step from the previous step.)
/ f2, so the larger the residual stage after development, the better the sensitivity), irradiated with 500 mj/ca+2 ultraviolet rays, and developed with a spray using a developer containing 60% by weight of N-methylpyrrolidone and 40% by weight of xylene. When the pattern was further rinsed with isopropyl alcohol, the pattern remained up to 14 steps, indicating high sensitivity.

Next, the coating was applied onto a silicone wafer in the same manner as described above, the entire surface was exposed, development and rinsing steps were performed, and then
Heat curing was carried out in nitrogen at 50, 250, 350 and 400°C for 30 minutes each.

For the adhesion test, 100 pieces were cut into 1 mm square pieces and an attempt was made to peel them off using cellophane tape, but none of them came off, indicating that they had high adhesion.

Separately, it was coated on an aluminum plate, exposed to light over the entire surface, developed, rinsed, and cured with heat, and then the aluminum plate was removed by etching to obtain a film.

Tensile modulus of the obtained film (JIS K-6760
) was as low as 110Kg/+no+2, and the thermal decomposition onset temperature was as high as 440°C.

In this way, the extremely excellent effects of high sensitivity, high adhesion, low elastic modulus, and high heat resistance were simultaneously obtained.

Comparative Examples 1 to ■0 Following the method of Example 1, the number of siloxane bonds in silicone diamine and the amount added, the type and amount of sensitizer and initiator added were changed, and similar experiments were conducted to obtain the results shown in Table 1. .

In Comparative Example 1, the amount of initiator added was 0.6 parts by weight, and the photosensitivity was extremely low.

In Comparative Example 2, the amount was 36 parts by weight, contrary to Comparative Example 1, and in this case, the initiator remained in the film, resulting in a low thermal decomposition initiation temperature.

Comparative Example 3 used an initiator other than the one according to the invention, had low photosensitivity, and was not practical.

．． In Comparative Example 4, the amount of sensitizer added was 0.3 parts by weight, and in this case, the photosensitivity was extremely low and the crosslinking was insufficient.

In Comparative Example 5, the amount of sensitizer was 33 parts by weight, and in this case, the amount of light transmitted to the deep part was insufficient, curing in the deep part was insufficient, voids were generated, and a uniform film was not obtained. .

Comparative Example 6 used a sensitizer other than the one of the present invention and had low photosensitivity, making it impractical.

In Comparative Example 7, the amount of silicone diamine added was 0.2% by weight, and in this case, the elastic modulus could not be lowered.

In Comparative Example 8, the amount of silicone diamine added was 38% by weight.
In this case, the film became brittle.

In Comparative Example 9, the number of siloxane bonds in the silicone diamine was n=0, and in this case, cracks occurred during film formation due to lack of flexibility.

In Comparative Example IO, the number of siloxane bonds in the siloxane diamine was n = too, and in this case, the reactivity was low, unreacted silicone was exposed at the time of film formation, and the sensitivity was not increased.

Table 1 shows the performance results obtained in the Examples and Comparative Examples.

[Effects of the Invention] Attempts have been made to improve adhesion and reduce elastic modulus by introducing siloxane bonds into the main chain structure of polyimide resins.

However, with conventional photosensitization techniques, it has not been possible to obtain a good pattern because there is no suitable sensitizer or initiator to improve the photosensitivity of silicone-modified polyimide resin.

However, in the present invention, by employing a combination of a special sensitizer with extremely high photosensitivity and an initiator, it has become possible to obtain a good pattern with a small amount of irradiation. Furthermore, it has excellent heat resistance, and since it is modified with silicone, it has a low elastic modulus and high adhesion, which are extremely excellent effects.

Claims (1)

[Claims] (1) Silicone diamine represented by the following formula [I] ▲ There are mathematical formulas, chemical formulas, tables, etc. Polyamic acid (A) represented by the following formula [II] ▲ Numerical formulas, chemical formulas, tables, etc. are available▼‥‥[II] (In the formula, R_1: trivalent or tetravalent organic group, R_2: divalent organic group, R_3: group having a carbon-carbon double bond, m: 1-2) Styryl compound (B) represented by the following formula [III] ▲ Numerical formulas, chemical formulas, tables, etc. are available▼‥‥[III] :-H, -CH_3, -C_2H_5, -
C_6H_5, R_5: ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ Mathematical formulas, There are chemical formulas, tables, etc.▼,▲mathematical formulas, chemical formulas,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ , ▲ Mathematical formulas, chemical formulas,
There are tables etc.▼(R:H, CH_3, C_2H_5)
Oxazolone compound (C) represented by the following formula [IV] ▲There are mathematical formulas, chemical formulas, tables, etc.▼‥‥…[IV] (R_6 in the formula: ▲There are mathematical formulas, chemical formulas, tables, etc.▼,▲
There are mathematical formulas, chemical formulas, tables, etc. ▼R_7: -H, -CH
_3, -C_2H_5, -C_3H_7, -C_4H_
9, -C_6H_5, -OH, -OCH_3, -OC_
2H_5, -OC_3H_7, -OC_4H_9, -O
C_6H_5, -CH_2C_6H_5, -CH_2C
H_2C_6H_5, -CH_2OH, -CH_2CH
_2OH, -CH_2CH_3, -CH(CH_3)_
2, -C(CH_3)_3, -COCH_3, -COC
_2H_5, -OCOCH_3, -OCOC_2H_5
, -CH_2NH_2, -CH_2CH_2NH_2,
-CONH_2, -CONHCH_3, -CON(CH
_3)_2, -CONHC_2H_5, -CON(C_
2H_5)_2, -NHCH_3, -N(CH_3)_
2, -N(C_2H_5)_2) is an essential component, and (A
) (B) 1 to 10 parts by weight, (C) per 100 parts by weight
A photosensitive resin composition comprising 1 to 20 parts by weight.