JPH03163890A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the cost of manufacturing the title device by forming a surface to be bonded having almost the same shape as that of the bonding surface of a light emitting element on a heat sink and, at the same time, forming a groove around the surface to be bonded. CONSTITUTION:A light emitting element 201 is provided with a conductive layer 203 formed on one side of the surface of the element 201 and the light emitting surface of the element 201 is formed by opening a light transmitting window 204 through the layer 203. The other side bonding surface of the element 201 is bonded and fixed to the conductive layer 205 on the surface of a heat sink 202 with a conductive solvent adhesive 213 having a high coefficient of thermal conductivity. Thus this element 201 is constituted. A surface 207 to be bonded having almost the same shape as that of the bonding surface of the element 201 is formed on the heat sink 202 and, at the same time, a groove 206 is formed around the surface 207. Therefore, the manufacturing cost of this optical semiconductor device can be reduced, because flowing out of the adhesive 213 can be prevented by the groove 206 and it becomes unnecessary to pattern the conductive layer 205 on the surface of the heat sink 202.

Description

[Detailed Description of the Invention] [Summary] Regarding a surface-emitting type optical semiconductor device, the purpose of this invention is to reduce manufacturing costs by eliminating the need for a pattern shape. In an optical semiconductor device including a light emitting element that serves as an adhesion surface to a surface of a conductive layer, the heat sink is provided with a surface to be adhered having a shape that substantially matches the shape of the surface to be adhered to the light emitting element, and a groove is formed around the surface to be adhered. It is characterized by the fact that it has been formed.

[Industrial application field]

The present invention relates to an optical semiconductor device, and particularly to a surface-emitting type optical semiconductor device.

Optical communication using the wavelength region of light has many characteristics such as large data transmission capacity, high speed, and high transmission quality, and has become rapidly popular in recent years.

Light emitting sources for optical communication systems are required to be small, highly reliable, and low in power consumption, and optical semiconductor devices such as semiconductor lasers can fully meet these demands.

By the way, since optical semiconductor devices have unfavorable temperature dependence in that their light emitting characteristics change due to heat, heat dissipation measures are important.

[Conventional technology]

FIG. 5.6 is a diagram of a conventional optical semiconductor device, and is a diagram showing a surface-emitting type optical semiconductor device.

In Fig. 5.6, 101 is a light emitting element, 102 is a heat sink, and the light emitting element 101 has a conductive layer 10 on one side.
A light transmitting window 104 is formed in the conductive layer 103, and the other side is adhesively fixed to the conductive layer 105 on the surface of the heat sink 102. Note that as the adhesive fusing material, one having electrical conductivity and high thermal conductivity is used.

In such a structure, power is supplied to the light emitting element 101 by bonding wires 106 and 107 connected to a pair of conductive layers 103 and 105.

In addition, the heat generated in the light emitting element 101 is transmitted to the heat sink 102 with a large surface area through the adhesive fusing material with high thermal conductivity and the conductive layer 105, and is effectively radiated, so that the temperature of the light emitting element 101 changes. can be suppressed, and the light emission operation can be stabilized.

[Problem to be solved by the invention]

However, in such a conventional optical semiconductor device, a flat conductive layer 105 is formed on the surface of the heat sink 102, and an adhesive is poured onto the conductive layer 105 to connect the light emitting element 101 and the heat sink 102. Since it was designed to be fixed with adhesive, bonding pad 1 of adhesive fusing material was used.
In order to prevent the leakage to the conductive layer 105, a narrow gap 109 must be patterned in the conductive layer 105, which poses an issue to be solved in terms of manufacturing cost.

[Purpose of the invention]

The present invention has been made in view of such problems, and aims to reduce manufacturing costs by eliminating the need for pattern formation.

[Means to solve the problem]

In order to achieve the above object, the present invention provides an optical semiconductor device including a light emitting element having one side as a light emitting surface and the other side as an adhesive surface to the conductive layer surface of a heat sink.
The heat sink is characterized in that a surface to be bonded is formed in a shape that substantially matches the shape of the surface to be bonded to the light emitting element, and a groove is formed around the surface to be bonded.

[Effect]

In the present invention, a groove is formed around the surface of the heat sink to be adhered, and this groove prevents the adhesive flux from flowing out.

Therefore, manufacturing costs can be reduced without patterning the conductive layer on the surface of the heat sink (corresponding to the conductive layer 105 in the conventional example).

(Example〕 Hereinafter, the present invention will be explained based on the drawings.

1 to 4 are diagrams showing an embodiment of the optical semiconductor device according to the present invention, which is an example applied to a surface-emitting type semiconductor laser.

First, the configuration will be explained. In FIG. 1, 201 is a light emitting element, 202 is a heat sink, the light emitting element 201 has a conductive layer 203 laminated on one side, and a light transmitting window 204 is formed on this conductive layer 203 to form a light emitting surface. , the adhesive surface on the other side is bonded to the conductive layer (for example, a certain metallized layer from 3N of Tj/Pt/Au) 20 on the surface of the heat sink 202 using a predetermined adhesive fusing material that is electrically conductive and has high thermal conductivity.
Glue and fix it to 5.

FIG. 2 is a plan view of the conductive layer 205, and the conductive layer 205 has a plurality of grooves (for example, a V-shaped groove or a U-shaped groove).
206 is formed. The portion surrounded by the groove 206 forms a bonded surface 207 having a shape that substantially matches the shape of the bonded surface of the light emitting element 201 .

Further, as shown in the sectional view of FIG. 3, the groove 206 is formed to reach the main body 208 of the heat sink 202 (made of ceramic material or Si material, for example). Note that 209 and 210 in FIG. 1 are bonding wires, respectively.
Bonding wire 209 connects to bonding pad 211 on conductive layer 203, and bonding wire 210 connects to bonding pad 211 on conductive layer 203.
connects to bonding band 212 on conductive layer 205.

FIG. 4 is a sectional view showing a state in which the light emitting element 201 is adhesively fixed to the heat sink 202. Adhesion between the two is performed by melting and applying an adhesive fusing material 213 to the surface 207 of the conductive layer 205 to be adhered, and positioning and placing the light emitting element 201 thereon.

During this bonding process, the molten adhesive flux 213 applied to the surface to be bonded 207 is applied to the grooves 213 around the surface to be bonded 207.
06 prevents its outflow. Therefore, it is not necessary to form a narrow part (the narrow part 109 in the conventional example) in the conductive layer 205, and the process of forming a pattern for the narrow part can be omitted and manufacturing costs can be reduced.

Moreover, in this embodiment, the position of the surface to be adhered 207 is set to the groove 20.
6, the light emitting element 201 can be reliably identified, and the positioning of the light emitting element 201 can be made accurate and easy.

〔Effect of the invention〕

According to the present invention, the heat sink is formed with a bonded surface having a shape that substantially matches the bonded surface shape of the light emitting element, and a groove is formed around the bonded surface, so that the bonding material flows out through the groove. can be prevented. Therefore, it is not necessary to form a pattern on the conductive layer on the surface of the heat sink, and manufacturing costs can be reduced.

[Brief explanation of the drawing]

1 to 4 are diagrams showing an embodiment of the optical semiconductor device according to the present invention, in which FIG. 1 is a perspective view of its appearance, FIG. 2 is a plan view of its heat sink 202, and FIG. 3 is its heat sink 202. FIG. 4 is a cross-sectional view of the optical semiconductor device. 5 and 6 are diagrams showing a conventional example, with FIG. 5 being an external perspective view thereof, and FIG. 6 being a sectional view thereof. 20 1 ・ 202 ・ 206 ・ 207 ・ 2 13 ・ ・Light emitting element, ・Heat 1 sink, ・Groove, ・Glued surface, ・Adhesive melting material.

Claims (1)

[Scope of Claims] In an optical semiconductor device comprising a light emitting element having one surface as a light emitting surface and the other surface as an adhesive surface to a conductive layer surface of a heat sink, the heat sink has a shape substantially matching the shape of the adhesive surface of the light emitting element. What is claimed is: 1. An optical semiconductor device comprising: a surface to be adhered having a shape of a shape, and a groove formed around the surface to be adhered.