JPH0316338U - - Google Patents

Info

Publication number
JPH0316338U
JPH0316338U JP1989077167U JP7716789U JPH0316338U JP H0316338 U JPH0316338 U JP H0316338U JP 1989077167 U JP1989077167 U JP 1989077167U JP 7716789 U JP7716789 U JP 7716789U JP H0316338 U JPH0316338 U JP H0316338U
Authority
JP
Japan
Prior art keywords
wire
wedge
bonding
bonding surface
guided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989077167U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989077167U priority Critical patent/JPH0316338U/ja
Publication of JPH0316338U publication Critical patent/JPH0316338U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/07551
    • H10W72/07553
    • H10W72/50
    • H10W72/531
    • H10W72/5363
    • H10W72/5366
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1989077167U 1989-06-29 1989-06-29 Pending JPH0316338U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989077167U JPH0316338U (cg-RX-API-DMAC10.html) 1989-06-29 1989-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989077167U JPH0316338U (cg-RX-API-DMAC10.html) 1989-06-29 1989-06-29

Publications (1)

Publication Number Publication Date
JPH0316338U true JPH0316338U (cg-RX-API-DMAC10.html) 1991-02-19

Family

ID=31619300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989077167U Pending JPH0316338U (cg-RX-API-DMAC10.html) 1989-06-29 1989-06-29

Country Status (1)

Country Link
JP (1) JPH0316338U (cg-RX-API-DMAC10.html)

Similar Documents

Publication Publication Date Title
JPH0316338U (cg-RX-API-DMAC10.html)
JPS63178342U (cg-RX-API-DMAC10.html)
JPH01121929U (cg-RX-API-DMAC10.html)
JPH0186245U (cg-RX-API-DMAC10.html)
JPH0316337U (cg-RX-API-DMAC10.html)
JPH0249134U (cg-RX-API-DMAC10.html)
JP2524429B2 (ja) ボンディング装置用リ―ドフレ―ム押さえ
JPH0474460U (cg-RX-API-DMAC10.html)
JPH0367431U (cg-RX-API-DMAC10.html)
JPH0390444U (cg-RX-API-DMAC10.html)
JPS6042614B2 (ja) 半導体装置のボンデイング方法
JPH031433U (cg-RX-API-DMAC10.html)
JPS6221549U (cg-RX-API-DMAC10.html)
JPS6442731U (cg-RX-API-DMAC10.html)
JPH0468551U (cg-RX-API-DMAC10.html)
JPH0381641U (cg-RX-API-DMAC10.html)
JPH03101523U (cg-RX-API-DMAC10.html)
JPS63172149U (cg-RX-API-DMAC10.html)
JPS6133440U (ja) ボンデイングワイヤ
JPH0178058U (cg-RX-API-DMAC10.html)
JPS63187332U (cg-RX-API-DMAC10.html)
JPH01161332U (cg-RX-API-DMAC10.html)
JPH0328731U (cg-RX-API-DMAC10.html)
JPH01120354U (cg-RX-API-DMAC10.html)
JPH032640U (cg-RX-API-DMAC10.html)