JPH0316288Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a heating element heat dissipation device for dissipating heat from a high-output transistor, thyristor, or the like.

[Background technology]

Conventionally, as a heat dissipating device of this kind, a heat dissipating plate has been used as a heat dissipating device for each heat dissipating device, such as a high output transistor or a thyristor. However, it is wasteful to provide a heat sink for each heat generating element that does not operate at the same time and requires heat dissipation, even if the heat generating elements are operating at the same time.
The space occupied by the heat dissipation plate was considerable and was a major obstacle to miniaturization of equipment.

[Purpose of invention]

The present invention has been developed in view of the above points, and its purpose is to provide a heating element heat dissipation device that can effectively utilize heat dissipation and contribute to the miniaturization of equipment. .

[Disclosure of invention]

(Example) Figure 1 shows an example of the present invention.
This figure shows a state in which, for example, a thyristor TH for AC control and transistors Q ₁ and Q ₂ of an inverter circuit 2 are mounted on a heat sink 1 of a heat dissipating device for a heating element. A non-contact switching type lighting circuit will be described as an example, in which lights etc. are lit using commercial power supply Vs during normal times, and are lit using storage battery B etc. in emergencies such as power outages. In this lighting circuit, under normal conditions, the bidirectional thyristor SBS is triggered by the voltage induced in the primary winding of the power transformer PT by the commercial power supply Vs, and the ignition of the bidirectional thyristor SBS ignites the thyristor TH. , emergency lights, etc., and the thyristor TH generates heat due to power loss due to on-resistance. Here, a diode bridge DB is connected to the secondary winding of the power transformer PT, and the storage battery B is charged with this rectified voltage. At this time, if a power outage etc. occurs and the supply of commercial power Vs stops,
The voltage of storage battery B is converted to alternating current by an inverter circuit to light emergency lights and the like. Here, the reason why the inverter circuit does not work normally is that the switching transistor _Q3 prevents bias from being applied to the transistors _Q1 and _Q2 of the inverter circuit.

As mentioned above, in such a circuit a thyristor
Even if heat dissipation devices are provided for transistors Q ₁ and Q ₂ in the TH and inverter circuits, transistors Q ₁ and Q ₂
The inverter circuit 2 performs switching and operates only in emergencies such as power outages. Therefore, providing a heat dissipation device for each of the transistors Q ₁ and Q ₂ causes various wastes. For this reason, the thyristor
If transistors Q ₁ and Q ₂ are mounted together on a heat sink 1 having a heat dissipation area necessary for heat dissipation of TH, the heat sink 1 can be shared and waste is reduced.

[Effect of idea]

As mentioned above, the present invention mounts two or more heating elements that are not used simultaneously and that generate a large amount of heat and require heat radiation onto a single heat sink with a heat radiation area corresponding to approximately one heating element. Since multiple heating elements that do not need to radiate heat at the same time are radiated by a heating element heat radiating device equipped with a heat sink with a heat radiating area corresponding to approximately one heating element, By sharing the equipment, the utilization efficiency of the heating element heat dissipation device is improved, and the space occupied by the heat generating element heat dissipation device can be reduced compared to providing a heat dissipation plate for each semiconductor, which is highly effective in downsizing equipment. .

[Brief explanation of the drawing]

FIG. 1 is an installation explanatory diagram showing an embodiment of the present invention;
FIG. 2 is a circuit diagram showing an actual circuit using the above heating element heat dissipation device. 1 is a heat sink, TH is a thyristor, and Q ₁ and Q ₂ are transistors.

Claims (1)

[Scope of utility model registration request] A heating element that radiates heat by mounting two or more heating elements that are not used simultaneously and that generate a large amount of heat and require heat radiation on a single heat sink with a heat radiation area corresponding to approximately one heating element. Heat dissipation device.