JPH03158772A - Inspection device for ic socket - Google Patents

Abstract

PURPOSE:To accurately inspect an IC socket in a short time by discriminating and processing with an electric signal whether contact pins are properly set through probe pins when the IC socket is mounted on a socket receptacle. CONSTITUTION:The subject device consists of the socket receptacle 6 having the probe pins 4 correspondingly arranged so as to receive a pressing pressure of the contact pins when the IC socket provided with the contact pins in column is mounted, and a detected signal processing part 7. Then, an ON/OFF signal according to the condition that the probe pins 4 are subjected to receive the pressing pressure of contact pins on the IC socket, is taken out, and the discrimination and display are made by the processing part 7 whether the specified contact pins are arranged on the main body of socket or not. By this procedure, defective products caused by erroneous insertion, omission, breakage, height irregularity, etc., of the contact pins can be accurately inspected in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an inspection device for an IC socket on which electronic components such as IC elements are mounted and electrically connected to an external circuit.

[Conventional technology]

I used for mounting electronic components such as IC elements
In a C socket, contact pins to be connected to leads of an IC element are arranged in a row on the socket body. and,
In the so-called lead insertion type IC socket shown in Fig. 6, the IC to be mounted has a common socket body.
It may be used by changing the number and arrangement of contact pins depending on the device model. As a result, there were problems with product defects such as incorrect insertion or omission of contact pins or breakage and bending of the contact pin legs as IC sockets, as well as variations in height due to contact pins not being inserted in accurate positions. . To solve this problem, conventionally, as shown in Figure 6, an inspection tool plate is used that has a predetermined number of insertion holes formed in a predetermined position to match the regular contact pins of the IC socket. The presence or absence of contact pins, height variations, etc. can be confirmed from the back side of the inspection tool plate through which the pins are inserted.

[Problem to be solved by the invention]

However, with the conventional confirmation method using the inspection tool board, it is difficult to visually judge whether all the small contact pins are correctly set in the socket body, and misidentifications often occur. was.

SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide an IC socket inspection device that can easily and reliably confirm whether or not contact pins are set correctly.

(Means and effects for solving the problem) I according to the present invention
The C-socket inspection device is equipped with an IC element having a row of contact pins to be connected to the lead terminals of the IC element, and probe pins arranged corresponding to the contact pins so that the contact pins can exert a pressing action. is connected to the above probe pin, and is ON/OFF from the above probe pin which receives the action of the contact pin.
It consists of a detection signal processing section that can extract the OFF signal and, based on this signal, determine and display whether or not a predetermined contact pin is provided in the socket body.

According to the present invention, by attaching the IC socket to the socket receiver, it is possible to determine whether or not the contact pin is set correctly via the probe pin as an electrical signal.
processing and displaying the results,
The risk of misidentification by visual inspection can be completely eliminated (
All it takes is a simple confirmation operation.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC socket inspection device according to the present invention will be described below with reference to FIGS. 1 to 5.

In the figure, ■ indicates a guide frame having a receiver portion 1a that matches the external shape of the socket body of the IC socket and a guide hole 1b formed to correspond to the contact pin, and 2 corresponds to the guide hole 1b. The insertion holes 2a are arranged concentrically.
(See Fig. 4) is formed, and a conductive film 2b made of a thin copper plate plated with gold is laid in the center of the surface opposite to the guide frame l, 3 is a base, 4 is a base. The probe pin is implanted in the stand 3, and has a head 4b that can move forward and backward with respect to the main body frame 4a, and is arranged in each of the insertion holes 2a so as to come into elastic contact with the conductive film 2b. The guide frame 1, conductive board 2, and base 3 are fixed to each other by fixing screws 5, and these constitute an IC socket receiver 6.

7 is connected to the above probe pin 4, and the IC
An ON/OFF signal is extracted from the probe pin that is affected by the contact pin of the IC socket attached to the socket receiver 6, and based on this signal, it is determined and displayed whether or not the specified contact pin is provided in the socket body. The detection signal processing section is configured to be able to perform the following operations, and this configuration will be explained with reference to FIG. The logic circuit to which the probe pins 4 are connected via the lead wire 8 is configured to receive the activation signal of each probe pin 4 and detect when only all of the probe pins 4 corresponding to a predetermined contact pin are activated. It has a logical configuration, and information regarding the model of the IC socket (the number and arrangement of contact pins) that is installed at this time is input manually from the changeover switch. Furthermore, in a discrimination circuit that receives signals from the logic circuit and the changeover switch, these two signals are compared and verified to determine whether or not it is a predetermined probe pin signal, and this determination result is displayed via a display circuit. Passage or failure is indicated by an indicator lamp or the like. In addition, a buzzer sounds when the product passes the test.
There is no need to visually check the lamp display every time.

Since the IC socket inspection device according to the present invention is constructed as described above, when the socket body of the IC socket to be inspected is inserted into the receiving part la of the socket receiver 6, the contact pin is inserted into the conductive board from the guide hole 1b. 2 into the insertion hole 2a. At this time, if the contact pin is bent, etc., the contact pin cannot be inserted into the prescribed insertion hole 2a, so the socket body will not fit into the receiving part 1a.
At this point, the contact pin can be found to be defective. Contact pin is inserted into hole 2
a, the head 4b of the probe pin 4, which had been in elastic contact with the conductive film 2b of the conductive substrate 2, is pushed into the main body 4a as shown in FIG. 4 and the conductive film 2b is cut off. By mounting the IC socket in this way, ON/OFF signals are sent to the detection signal processing unit 7 and the probe bin 4. However, there are variations in the height of the contact pins, and for example, the contact pins may not be inserted into the insertion holes 2a. Also probe pin 4
If the probe pin 4 does not have a sufficient length to allow the head 4b of the probe pin 4 to be pushed in, that is, if it is shorter than the specified size, the ON/OFF signal of the probe pin 4 will not be generated. Therefore, only when all the contact pins are arranged at predetermined positions and there are no bends, height variations, etc., the corresponding probe pin 4
An ON/OFF signal is obtained, and based on this signal, the logic circuit and discrimination circuit of the detection signal processing unit 7 determine that the contact pin is correctly installed in the IC socket, and "OK" is displayed. On the other hand, if any one of the contact pins is not arranged in a predetermined arrangement position or there are variations in height, a normal ON/OFF signal of the probe pin 4 cannot be obtained, and this is determined to be defective by the logic circuit and discrimination circuit.

The result display lamp displays "NG" and an alarm buzzer is activated, so that if there is a failure, the abnormality can be immediately detected visually and audibly.

In the above embodiment, at least two guide bins are installed in the base 3 instead of the guide frame l, and
By forming a guide hole in the C socket that can fit into the guide bin, positioning may be performed when mounting the IC socket.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to quickly and accurately check product defects caused by incorrect or forgotten insertion of contact pins in this type of IC socket, broken legs of contact pins, variations in height, etc. It also has the advantage of eliminating oversights in inspections.

[Brief explanation of the drawing]

FIG. 1 is an overall configuration diagram of an embodiment of an IC socket inspection device according to the present invention, FIG. 2 is a plan view of an IC socket receiver according to the present invention, and FIG. 3 is a detection signal processing section according to the present invention. FIGS. 4 and 5 are partial longitudinal sectional views illustrating the operation of the probe pin according to the present invention, and FIG. 6 is a perspective view of a conventional IC socket and its inspection tool. ■... Guide frame, 2... Conductive board, 3...
Base, 4...probe pin, 5...fixing screw,
6...Socket receiver, 7...Detection signal processing section,
8... Lead wire. Figure 1 Figure 2 Figure h Figure 3

Claims (1)

[Claims] a socket receiver equipped with an IC socket having a row of contact pins to be connected to lead terminals of an IC element, and equipped with probe pins arranged corresponding to the contact pins so that the contact pins can act; Retrieving an ON/OFF signal from the probe pin connected to the probe pin and subjected to the action of the contact pin,
This IC socket inspection device includes a detection signal processing section that can determine and display whether or not a predetermined contact pin is provided in the socket body based on this signal.