JPH03155200A - Circuit board holding device - Google Patents

Abstract

PURPOSE:To enhance freedom of a position for sucking a printed circuit board and enable it to be held positively by controlling a control member on suction operation so that a suction pad is at a level which is equal to or lower than an upper edge level of a supporting pin. CONSTITUTION:A compressed air supply source is connected to a lower compressed air path 25, a flange part 20 of a supporting pin 15 is pressed to the upper wall where a recessed part 21 is formed, and the upper edge of an suction pad 19 is positioned at the upper part compared with the upper part of the supporting pin 15. In this state, when a suction table is allowed to rise and descend by an up/down move device, the suction pad 19 hits against a board 9. After that, the printed circuit board 19 is sucked and held by the supporting pin 15 through a vacuum connection path 14 and an intake path 16. At this time, a compressed air is applied to the flange part 20 from the upper part through a compressed air supply source. However, since suction force is stronger, the suction pad 19 is sucked to a printed circuit board 9 in a cylindrical body 18, namely the supporting pin 15 is at the same level as the upper edge level of the sucking pad 19.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a substrate holding device that holds a substrate by vacuum suction using a vacuum source.

(*) Prior Art This type of substrate holding device is disclosed in Japanese Patent Application Laid-Open No. 58-219054.

In this prior art, the substrate is placed and held directly on the printing table by vacuum suctioning the substrate using a material suction unit connected to the openings on a printing table provided with a number of openings that communicate with each other. .

However, with this method, there is little flexibility in the position where the printed board can be picked up.For this reason, if the degree of upward curvature of the printed circuit board is small, it is fine, but if it is large, it may not be possible to hold it by suction.

(A) Problems to be Solved by the Invention Therefore, the present invention provides a board holding device that increases the degree of freedom in the adsorption position and eliminates the need to press the printed circuit board from above to make it horizontal even if it is warped. It is something to do.

(d) Means for Solving the Problems To this end, the present invention provides a suction base having a vacuum suction path that communicates with a vacuum source, and a suction base that is installed in the suction base and that is suctioned by the vacuum source through the suction path. and a plurality of support pins each having an air intake passage communicating with the suction passage for sucking and holding the back side of the printed circuit board,
a cylindrical body that is vertically disposed in the intake path of the support pin and has a suction pad at its upper end; and a cylindrical body that is positioned such that the suction pad of the cylindrical body is above the upper end of the support pin when suction by the vacuum source is not operating. and a control member for controlling the upper end level of the support pin to be at a level equal to or lower than the upper end level of the support pin in relation to the printed circuit board during the suction operation.

(*) When the suction by the vacuum source is not in operation, the control member is positioned so that the cylindrical suction pad that can be raised and lowered is above the upper end of the support pin, and when the suction is in operation, the control member is connected to the printed circuit board and the suction pad is controlled to be equal to or lower than the upper end level of the support pin.

(v) Embodiment In Fig. 2, (1) is a screen printing machine to which the present invention is applied, (2> is a pole screw rotated by a motor (3), and fitted into a nut (4). The nut (4)
) is attached with a movable squeegee base (5), and the base (5) is moved by forward and reverse rotation of the motor (3).
is moved back and forth.

(7) (7) is a pair of linear guides that guide the movement of the squeegee base (5). (8) is a squeegee that applies cream solder through a screen (11) for mounting electronic components (10) on a printed circuit board (9) with a pattern, and the squeegee base (5)
installed on.

Next, in Fig. 1, (12) is a suction base, and on its top surface, there are base openings (13) (13) for vacuum suction at regular intervals on the front, back, left and right sides, each having a circular shape with the same diameter. It has been established. The opening (13)<13)... is the suction base (
12) is communicated with a vacuum pump (not shown) via a vacuum ventilation passage (14) inside.

(15) is a support pin that is removably fitted into the base openings (13) (13), and
) is formed to penetrate therethrough. The pin (15) is composed of a small diameter part (15A) that fits into the vacuum air passage (14) and a large diameter part (15B) that is larger than the air passage (14), and the small diameter part (15A)
An O-ring (17) is embedded in the outer periphery of the housing to ensure a tight fit.

(18) is a cylindrical body that can move up and down in the intake passage (16), and at its upper end is provided a suction pad (19) made of rubber or the like that expands upward in the shape of a funnel, and the entire outer periphery of the body is provided with a suction pad (19) made of rubber etc. A flange portion 20> is formed around the circumference. Then, a part of the surface of the support pin (15) forming the air intake passage (16) is cut off to form a recess (21), so that the flange (20) can be moved up and down.

Also, a communication path (22) for communicating with the recess (21).
(23) is formed and communicated with a compressed air supply source (not shown) via compressed air passages (24) and (25) provided in the adsorption base (12). The compressed air passages (24) and (25) are switchably connected to the compressed air supply source.

The operation of the above configuration will be described below. First, when the printed circuit board (9) is in the position indicated by the solid line on the left side of Fig. 2, the compressed air supply source is connected to the lower compressed air path (25).
The support pin (15) communicates with the support pin (15) through the communication path (23).
The flange portion (20) of the suction pad (19) is pressed against the upper wall forming the recess (21), and the upper end of the suction pad (19) is pressed against the support pin (15).
) is located above the top of the

In this state, when the suction table (12) is raised by the vertical movement device, the suction pad <19> comes into contact with the substrate (9) (see FIG. 3).

After that, a vacuum source is used to open the vacuum ventilation path (14) and the intake path (1).
6), the printed circuit board (9) is connected to the support pin (15)
At this time, compressed air is applied from above to the flange portion (20) from a compressed air supply source through the compressed air path (24) and the communication path (22). However, since the suction force is stronger, the cylindrical body (18) is a suction pad.
19) is attracted to the printed circuit board (9), that is, the upper ends of the support pin (15) and the suction pad (19) are at the same level (see FIG. 4).

Thereafter, the motor (3) operates, the ball screw (2) rotates, and the squeegee base (5) fixed to the nut (4) moves forward. Along with this, the squeegee (8) attached to the squeegee base (5) applies cream solder onto the printed circuit board (9>) through the screen (11).

After that, the suction base (12) may be lowered and transported downstream.

The operation when the printed circuit board (9) has an opening (9A) will be described based on FIG. 5. In this case, due to the vacuum source and the compressed air supply source, the cylindrical body (18) is lowered until its lower end touches the stepped part of the intake path (16), the vacuum path is cut off, and other suction pads are No leaks.

Next, a second embodiment will be explained based on FIGS. 6 and 7. In this case, the parts with the same number have the same function, and the explanation will be omitted.

In this embodiment, there is only a compressed air passage (25) communicating with a compressed air supply source, and a coil spring (30) is provided on a flange (20) within the recess (21).

In this case, when suction is not being performed by the vacuum source, the suction pad (19) is made to protrude upward from the support pin (15) against the coil spring (30) by pressurization by the compressed air supply source, and the printed circuit board (9) When the support pin (15) is suctioning, the supply of compressed air is stopped.Then, the suction operation by the vacuum source can reliably suction and hold.The opening (9A) in the printed circuit board (9)
If there is, the cylindrical body (18) comes into contact with the stepped portion of the intake passage (16), as described above.

In addition, if the chip-shaped electronic component (10) is already mounted on the back side of the printed circuit board (9), the component (10)
Since the support pin (15) cannot be placed directly under the
A lid (27) is press-fitted into the base opening (13).

Next, a third embodiment will be described based on FIG. This third embodiment does not have compressed air passages (24) (25),
This is an example in which a coil spring (31) is housed below the flange portion (20) within the recess (21). That is, when the vacuum source is not suctioning, the upper end of the cylindrical body (18) is positioned above the upper end of the support pin (15) by the biasing force of the coil spring (31), and the suction pad (19) Makes it easy to hold. Regarding subsequent adsorption, etc.
Same as above.

Can be applied to mounters, dispensers, etc.

(G) Effects of the Invention As described above, the present invention increases the degree of freedom in the position where a printed circuit board can be sucked, and even if the printed circuit board is warped, the printed circuit board does not need to be pressed from above to make it horizontal. , can be reliably adsorbed and held.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention, FIG. 2 is a schematic plan view of a screen printing machine, and FIGS. 3 to 5 are longitudinal sections showing each operation of the first embodiment. Figures 6 and 7
The figure shows a longitudinal sectional view of the second embodiment, and FIG. 8 shows a longitudinal sectional view of the third embodiment. (1)...Screen printing machine, (12)...Suction base, (13)...Base opening, (14>...
・Vacuum ventilation path, (15)...Support pin, (16)・
...Intake path, (18)...Cylindrical body, (19>...
・Intake pad, (20)...Flange part, (21>
... recess, (22) (23) ... communication path, (
24)(25)...Compressed air path, ゛(3
0)(31)...Coil spring.

Claims (1)

[Claims] (1) A suction base having a vacuum suction path communicating with a vacuum source, and a suction base installed in the suction base to suction and hold the back side of a printed circuit board when it is suctioned by the vacuum source through the suction path. A substrate holding device comprising a plurality of support pins each having a communicating suction passage formed therein, a cylindrical body provided vertically in the suction passage of the support pin and having a suction pad at an upper end; When the suction is not in operation, the suction pad of the cylindrical body is positioned above the upper end of the support pin, and when the suction is in operation, the suction pad is positioned at a level equal to or lower than the upper end of the support pin in relation to the printed circuit board. A substrate holding device comprising: a control member.