JPH03154357A - Carrier tape for tab and its manufacture - Google Patents

Abstract

PURPOSE:To reduce a bend of a carrier tape itself for TAB to facilitate handling such as package, assembly and a test by reducing the number of holes while eliminating an electrolyte plating line cut hole. CONSTITUTION:After performing pattern exposure, developing and etching, electrolyte plating is performed on the upper surface of a patterned metal foil 1 in order to form a plurality of wiring patterns 3 whereon electrolytic plating is performed, an integrated electrolytic plating line 4, in which these are concentrated to be connected respectively, and a main electrolytic plating line 5 connected to this plating line 4 are formed respectively. At this time, the integrated electrolytic plating line 4 is positioned inside an unprocessed part 1a' while being positioned outside a main electrolytic plating line 5 sprocket hole 1a. Thereby, the sprocket hole 1a is also used as a plating line cut hole so as to reduce a bend of a carrier tape 7 itself for TAB(Tape Automated Bonding) while taking an effective area of a metal foil 1 more speciously.

Description

[Detailed Description of the Invention] [Object of the Invention] (Field of Industrial Application) The present invention is directed to TA B (Tape Automated
This invention relates to a carrier tape for TAB used in the bonding method, more specifically, a carrier tape for TAB that can reduce the bending of the tape itself and make the effective area of metal foil as wide as possible, and a method for manufacturing the same. .

(Prior Art) A conventional general carrier tape for TAB was constructed as shown in FIG.

That is, as shown in FIG. 5(a), a wide polyimide film or the like is cut to form a long base tape 1 with a width of, for example, 35 m, and a predetermined portion of the base tape 1 is punched. is applied, and a predetermined pitch p1 is formed on both edges in the length direction.
For example, a sprocket hole 1a for conveyance and positioning with a spacing of 4.75 mm (p -4,75 mm) is punched, a device hole 1b is punched in the center, and an outer lead slit 1c is punched around the device hole 1b.

Next, as shown in FIG. 2B, a metal foil 2 such as copper foil is laminated inside the sprocket hole 1a on the surface of the base tape 1.

After pattern exposure, development, and etching, electrolytic plating is applied to the upper surface of the patterned metal foil to form a plurality of electrolytically plated wiring patterns 3', as shown in FIG. A concentrated electrolytic plating line 4' in which these wiring patterns 3' are concentrated and connected to each other, and a main electrolytic plating line 5' located inside the sprocket hole 1a and connected to this concentrated electrolytic plating line 4', respectively. Form.

In addition, these concentrated electrolytic plating line 4' and main electrolytic plating line 5' perform electrolytic plating on each of the above-mentioned patterned wirings to form electroplated wiring patterns 3.
′.

Thereafter, as shown in FIG. 3(d), the concentrated electrolytic plating line 4' is cut off by punching along the plating line cut hole 6, and each wiring pattern 3' is cut off.
By making all or part of the independent pattern,
A carrier tape for TAB was constructed.

(Customer to be Solved by the Invention) However, in the above carrier tape for TAB, the number of holes increases due to the need to punch plating line cut holes along the concentrated electrolytic plating line.
Because the B carrier tape itself becomes easily bent,
Trouble may occur due to this bending during transportation or handling.

Furthermore, in addition to the presence of the plating line cut hole mentioned above, the main electrolytic plating line is located inside the sprocket hole, which limits the effective metal foil area and reduces the degree of freedom in wiring, which is disadvantageous for multi-bin applications. In addition, there was a problem in that socket sharing was limited.

In view of the above-mentioned problems, an object of the present invention is to provide a carrier tape for TAB which has less deflection and which allows the effective area of metal foil to be wider even if the tape has the same width. shall be.

[Structure of the invention]

(Means for Solving the Three Problems) In order to achieve the above object, the TAB carrier tape according to the present invention is provided mainly on the outside of sprocket holes arranged at equal intervals on both sides of a long base tape. While positioning the electrolytic plating line, each wiring pattern is extended to the side of the sprocket hole, and the tip of each wiring pattern is electrically separated by the sprocket hole to make part or all of the wiring pattern independent. The manufacturing method is to apply metal to the entire surface of a long base tape while leaving some unprocessed parts of the sprocket holes arranged at equal intervals on both sides of the base tape. The foil is laminated, a concentrated electrolytic plating line for electrolytic plating is placed on the metal foil on this unprocessed part, patterning is performed, and after the electrolytic plating is completed, the unprocessed part is punched. A TAB carrier tape is constructed by using part or all of the wiring pattern formed on the base tape as an independent pattern.

(Function) According to the present invention configured as described above, the sprocket hole can also serve as the plating line cut hole, thereby reducing the number of holes and reducing the bending of the tape itself. By locating the main electrolytic plating line outside the sprocket hole, the effective metal foil area can be made as wide as possible.

(Example) An embodiment of the present invention will be described below with reference to FIG.

First, as shown in Figure (a), a wide polyimide film or the like is cut to form a long base tape 1 with a width of, for example, 35 mm, and punching is performed at predetermined locations on the base tape 1. For example, if the predetermined pitch p is 4.75 mm, then the pitch p' is twice the predetermined pitch p, for example, 9.5 mm (p'
-2p-9, 5mm) sprocket holes 1a for conveyance and positioning in the center, and device hole 1 in the center.
b, and outer lead slit ICs are punched around this device hole 1b, respectively.

In this way, by forming sprocket holes 1a every few pitches (every two pitches in the figure), unprocessed portions 1a' are left where sprocket holes should originally be formed.

Next, as shown in FIG. 2B, a metal foil 2 such as copper foil is laminated on the entire surface of the base tape 1.

Then, as shown in FIG. 2C, after pattern exposure, development, and etching, electrolytic plating is applied to the upper surface of the patterned metal foil, and a plurality of electrolytically plated wiring patterns 3 are formed. A concentrated electrolytic plating line 4 in which these wiring patterns 3 are concentrated and connected to each other, and a main electrolytic plating line 5 continuous to this concentrated electrolytic plating line 4 are respectively formed.At this time, the concentrated electrolytic plating The line 4 is located inside the unprocessed portion 1a', and the main electrolytic plating line 5 is
It is positioned outside the spiroceratohole 1a.

By doing so, the tip of the wiring pattern 3 can be extended to the side of the sprocket hole 1a, and the effective metal foil area can be expanded as much as possible.

The concentrated electrolytic plating line 4 and the main electrolytic plating line 5 are for electrolytically plating each patterned wiring to form an electrolytically plated wiring pattern 3.

After that, as shown in the same figure (d), the above-mentioned unprocessed part 1
A' is punched to form sprocket holes 1a, thereby obtaining sprocket holes 1a lined up in a straight line at a predetermined pitch p, and the concentrated electrolytic plating line 4 is punched into this unprocessed part 1a'. The TAB carrier tape 7 is constructed by cutting off the sprocket holes 1a provided and making all or part of each wiring pattern 3 into an independent pattern.

By doing so, the sprocket hole 1a can also serve as a conventional plating line cut hole, thereby eliminating the need for providing a plating line cut hole.

〔Effect of the invention〕

Since the present invention has the above-described configuration, by eliminating the electrolytic plating line cut hole and reducing the number of holes, T
The deflection of the AB carrier tape itself can be reduced, thereby facilitating handling during packaging, assembly, testing, etc. of the TAB carrier tape.

Furthermore, the effective area of the metal foil can be made as wide as possible,
This makes it possible to increase the number of pins without expanding the width of the tape, reducing the cost of the tape itself, and making it possible to share sockets between different types, reducing socket costs. It has the effect of being able to do something like this.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an example of manufacturing a carrier tape for TAB according to the present invention in the order of steps, and Fig. 2 is a plan view showing a conventional general TAB carrier tape.
FIG. 3 is a plan view showing an example of manufacturing a carrier tape for use in the order of steps. 1...Base material tape, 1a...Same sprocket hole, 1a'...Same unprocessed part, 1...Metal foil, 3...
・Wiring pattern, 4...Intensive electrolytic plating line, 5.
...Main electrolytic plating line, 7...Carrier tape for TAB.

Claims (1)

[Claims] 1. The main electrolytic plating line is located outside the sprocket holes arranged at equal intervals on both sides of the long base tape, and each wiring pattern is extended to the side of the sprocket hole. A carrier tape for TAB, characterized in that the leading end of each wiring pattern is electrically separated by the sprocket hole to make a part or all of the wiring pattern an independent pattern. 2. Laminate metal foil over the entire surface of the long base tape, leaving unprocessed parts in some of the sprocket holes arranged at equal intervals on both sides of the base tape, and add metal foil to the unprocessed parts. A wiring pattern is formed on the base tape by positioning and patterning a concentrated electrolytic plating line for electrolytic plating on the metal foil, and punching out the unprocessed portion after electrolytic plating is completed. A method for manufacturing a carrier tape for TAB, characterized in that part or all of the tape is formed as an independent pattern.