JPH031534U - - Google Patents
Info
- Publication number
- JPH031534U JPH031534U JP6117689U JP6117689U JPH031534U JP H031534 U JPH031534 U JP H031534U JP 6117689 U JP6117689 U JP 6117689U JP 6117689 U JP6117689 U JP 6117689U JP H031534 U JPH031534 U JP H031534U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- runner
- gates
- back sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 3
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の第１実施例を示す平面図、第
２図は、第１図−線拡大断面図、第３図は、
第１図−線拡大断面図、第４図は本考案に係
る分離型の第２実施例を示す要部拡大平面図、第
５図は第４図−線断面図、第６図は、第４図
に示す分離型の方向を１８０゜回転させて金型本
体に再装着した状態を示す要部拡大平面図、第７
図は、第６図−線断面図、第８図は従来の樹
脂モールド装置を示す、一部省略部分を含む平面
図、第９図は、第８図−線拡大断面図である
。
Ａ……下金型、イ……衝合面、２０……金型本
体、２５……分離型、２５ａ……分離型の表面、
２５ｂ……分離型の裏面、３０……カル、３１…
…ランナ、３２……ゲート、３３……キヤビテイ
。
Fig. 1 is a plan view showing the first embodiment of the present invention, Fig. 2 is an enlarged sectional view taken along the line of Fig. 1, and Fig. 3 is a
FIG. 1 is an enlarged cross-sectional view taken along lines in FIG. 4, FIG. 7 is an enlarged plan view of the main parts showing a state in which the direction of the separated mold shown in FIG.
The figures are a sectional view taken along the line in FIG. 6, FIG. 8 is a plan view showing a conventional resin molding apparatus, with some parts omitted, and FIG. 9 is an enlarged sectional view taken along the line in FIG. A...Lower mold, A...Abutment surface, 20...Mold body, 25...Separated mold, 25a...Surface of separated mold,
25b...Back side of separated type, 30...Cal, 31...
... Runner, 32... Gate, 33... Cavity.
Claims (1)
締めし、金型のポツト内に供給され、加熱された
樹脂をプランジヤにて押圧し、衝合面間に形成さ
れたランナ、ゲートを介してキヤビテイへ圧送す
る樹脂モールド装置に於いて、上記ランナとキヤ
ビテイ間を、金型とは別体かつ、表裏面反転装着
可能な分離型とし、この分離型の表裏両面にゲー
トを形成したことを特徴とする樹脂モールド装置
。 The facing surfaces of the upper and lower molds are brought into contact with each other and the molds are clamped, and heated resin is supplied into the pot of the mold and pressed by a plunger to form runners and gates between the butt surfaces. In the resin molding device that pressure-feeds the resin to the cavity via the runner, the space between the runner and the cavity is a separate type that is separate from the mold and can be installed with the front and back sides reversed, and gates are formed on both the front and back sides of this separate type. A resin molding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117689U JPH031534U (en) | 1989-05-25 | 1989-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6117689U JPH031534U (en) | 1989-05-25 | 1989-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031534U true JPH031534U (en) | 1991-01-09 |
Family
ID=31589193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6117689U Pending JPH031534U (en) | 1989-05-25 | 1989-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031534U (en) |
-
1989
- 1989-05-25 JP JP6117689U patent/JPH031534U/ja active Pending