JPH03149185A - Electrodeposited grindstone and its manufacture - Google Patents

Abstract

PURPOSE:To give elasticy to an electrodeposited grindstone for the absorption of vibration during machining so as to dump shocks applied to a work by using synthetic resin for a substrate. CONSTITUTION:An electroless deposition process is applied to the outer circumference of a conductive synthetic resin substrate 6 in a disk shape having a fitting hole at the center thereof, or to the outer circumference and the inside of the fitting hole 5. Later, an ultrahard grindgrain layer 13 is formed on the elecroless deposite layer of the outer circumference of the substrate 6 by an electroplating process, and thereby an electro-deposited grindstone.

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a novel electrodeposited grindstone and a method for manufacturing the same. More specifically, the present invention has features such as long life and reduced chipping on cut surfaces, and is suitable for grinding various industrial materials, especially cutting and grooving hard and brittle materials such as glass and ceramics. The present invention relates to an electrodeposited grindstone that is suitably used for electrolytic grinding and cutting of difficult-to-grind materials and composite materials, and a method for efficiently manufacturing the same. [Conventional technology 1 Glass, ceramics, ferrite, etc. have been widely used as materials for electronic components, but in many cases, these materials are cut to a certain size or grooved into a certain shape. There is. In addition, in the field of building materials, composite materials of cement and steel whose surfaces are coated with glass, such as those found in PC boards, have been increasingly used in recent years; Simultaneous cutting is often required. In these processes, chipping on the cut surface is required to be small, but for example, when cutting a PC board, which is a cement board with reinforcing steel whose surface is coated with glass, chipping is likely to occur in the glass layer when cutting. It is known that when cutting, the cutting resistance increases and the vibration of the grindstone becomes intense, making it a difficult material that causes maximum chipping. In such processing, metal bond grindstones and electroplated grindstones using steel plates as substrates, resin bond grindstones using synthetic resin plates as substrates, and the like have conventionally been used. However, in general, when cutting or grooving hard and brittle materials, the metal bond and electroplated grindstones have the disadvantage of more chipping than the resin bond grindstones. Although it is small, grindstone wear is large, and when machining grooves of a fixed shape, for example, the predetermined shape of the whetstone changes easily, making it difficult to process the desired groove shape. On the other hand, regarding diamond grinding wheels using conductive synthetic resin substrates, the present applicant previously proposed a metal bond grinding wheel using conductive synthetic resin substrates (Patent Application No. 63
-270008), this product is intended to be lighter and more rust-proof than steel substrates, and is mainly used for chamfering automobile window glass. Due to the relationship, there is a limit to the size of the grindstone that can be manufactured.
The drawback is that it is difficult to apply to grindstones used for cutting and grooving. In addition, we have developed an electroplated grindstone using a conductive synthetic resin substrate in which the entire wire is hardened with synthetic resin (Japanese Patent Laid-Open No. 63-300869), and an electrolytic grinding wheel in which the metal wire is hardened with synthetic resin (
Japanese Patent Application No. 5G-12634) has also been proposed. However, in the former electrodeposited grindstone, diamond abrasive grains are electrodeposited only on the exposed metal parts of the substrate, so the abrasive grain layer inevitably becomes intermittent, resulting in increased chipping on the cut surface. On the other hand, the latter type of electrolytic grinding wheel has a short lifespan because the abrasive grain layer is fixed with resin bond, and has the above-mentioned drawbacks as a resin bonded grinding wheel. On the other hand, in electrodeposited grindstones using conductive synthetic resin substrates, the substrate is usually wire mesh or metal wire hardened with synthetic resin, but in such substrates, the carbide abrasive grains are When the grinding wheel is used as a grinding wheel for electrolytic grinding, the contact resistance between the mounting hole of the substrate and the electrode is large.
In particular, when attaching a grinding wheel to a grinding machine and performing electrolytic grinding, there should be a distance of 1/1 G to 3/R between the mounting hole and the spindle shaft.
Since there is a gap of 8 degrees, the problem often arises that poor contact is likely to occur.

[Problem to be solved by the invention]

The present invention overcomes the drawbacks of such conventional resin bonded grindstones, metal bonded grindstones, and electroplated grindstones, and provides an electroplated grindstone that has a long life, has small chipping, and can be processed with less processing, and has the above-mentioned characteristics. The purpose of this invention is to provide an electrodeposited grindstone that has a high level of corrosion resistance and reduces the contact resistance between the electrode and the mounting hole during the electrodeposition of cemented carbide abrasive grains and during electrolytic grinding. . [Means for Solving the Problems J] As a result of extensive research in order to develop an electrodeposited grindstone having the above-mentioned preferable properties, the inventors of the present invention discovered that using a conductive synthetic resin substrate, the superhard abrasive grains on the outer circumferential surface of the grindstone were By performing electroless plating treatment on the part to be electrodeposited in advance, a layer of carbide abrasive grains is continuously formed, and an electrodeposited grindstone with a long service life, with small chipping and capable of grinding can be obtained. Furthermore, they discovered that by applying electroless plating to the inner surface of the mounting hole of the board, they could reduce the contact resistance between the electrode and the mounting hole during electrodeposition of carbide abrasive grains or during electrolytic grinding. The present invention was completed based on the findings. That is, the present invention provides an electrodeposited grindstone in which a superhard abrasive grain layer is formed by electroplating on the outer peripheral surface of a disk-shaped conductive synthetic resin substrate having a mounting hole in the center. is electrodeposited on a substrate via an electroless plating layer, and if desired, an electroless plating layer is provided on the inner surface of the attachment hole. According to the present invention, the electrodeposited grindstone is provided with electroless plating on the outer peripheral surface of a disk-shaped conductive synthetic resin substrate having a mounting hole in the center, or on the outer peripheral surface and the inner surface of the mounting hole. Thereafter, a superhard abrasive grain layer is formed on the electroless plating layer on the outer circumferential surface of the substrate by electroplating. The present invention will be explained in detail below. In the present invention, a disk-shaped substrate made of conductive synthetic resin and having a mounting hole in the center is used as the substrate. Preferred examples of the resin in this conductive synthetic resin include heat-resistant resins such as thermosetting phenol resins and polyimide resins. There are no particular limitations on the method of manufacturing the conductive synthetic resin substrate, and any method conventionally used in the manufacture of such substrates can be used. For example, a method may be used in which the resin is molded into a desired shape using a hot press together with a conductive wire mesh or metal wire. In the present invention, a super-hard abrasive layer is formed on the outer circumferential surface of the conductive synthetic resin substrate thus obtained by electroplating. At this time, the super-hard abrasive layer is formed in advance. It is necessary to perform electroless plating treatment on the parts. If this electroless plating treatment is not performed, the carbide abrasive grains will be electrodeposited only on the exposed metal parts, and the formed carbide abrasive grain layer will not be a continuous layer, resulting in chipping during the grinding process. However, by performing the electroless plating treatment, the cemented carbide abrasive grain layer forms a continuous layer, the above-mentioned problem is solved, and the object of the present invention is achieved. There are no particular restrictions on the electroless plating process, and methods commonly used for electroless plating on the surface of synthetic resins, such as electroless nickel plating solution, copper plating solution, and chromium plating solution at a temperature of about 10 to 70°C, can be used. The substrate to be processed, if necessary, is coated with resin or masked using a resin jig, except for the areas to be electroless plated, and then immersed in a plating solution for an appropriate amount of time. Can be used. At this time, the roughness of the turned surface of the substrate is usually selected within the range of 1 to 20 μmRmax, since the relatively rougher the substrate, the better the adhesion between the electroless plating layer and the substrate. Regarding the thickness of the electroless plating layer, if it is too thick, the residual stress will increase and the film may crack, or in extreme cases, the film may peel off from the substrate surface. In the next electrodeposition process, the current density of electroplating could not be increased to the desired value,
There is a risk that the electrodeposited layer formed will be non-uniform. Therefore, the thickness of the electroless plating layer is usually selected in the range of 1 to 5 Gpm. Next, on the electroless plating layer provided on the outer peripheral surface of the conductive composite Ilt resin substrate as described above, the masking is removed if necessary, and a superhard abrasive grain layer is formed by electrodeposition. However, there are no particular limitations on this electrodeposition method, and any method conventionally used in the production of electrodeposited grindstones can be used. For example, a super hard abrasive grain layer is provided on the electroless plating layer by a nickel electrodeposition method, a chromium electrodeposition method, a copper electrodeposition method, or the like. At this time, the electroless plating layer may be electrodeposited using the same type of metal or different types of metals, but when electrodeposition is performed using different types of metals,
Since the coefficients of thermal expansion of the two metals are different, sufficient consideration must be given to the temperature of the electrodeposition solution. Further, the thickness of the electrodeposited layer is usually selected within the range of 1 G = 200 μm. Examples of the carbide abrasive grains used in the present invention include naturally produced or artificial diamond abrasive grains and CBN abrasive grains. These abrasive grains usually have a particle size in the range of 10 to 200 μm. In the present invention, when performing the electroless plating treatment,
If desired, the inner surface of the attachment hole of the conductive synthetic resin substrate may also be subjected to electroless plating treatment to provide an electroless plating layer. As a result, the contact resistance between the electrode and the mounting hole is reduced when the carbide abrasive grains are electrodeposited when producing the electrodeposited grindstone of the present invention, or when the grindstone is used for electrolytic grinding. Electrodeposition and electrolytic grinding of carbide abrasive grains can be performed. In particular, when electrolytically grinding is performed by attaching a grinding wheel to a grinding machine, there is a gap of approximately l/100 to 3/10011II+ between the mounting hole and the spindle shaft, so contact failure is likely to occur if electroless plating is not performed. However, the problem arises that
By performing electroless plating treatment as in the present invention, the above problem can be easily solved. The thickness of the electroless plating layer provided on the inner surface of the mounting hole is usually 1 to 50 μm.
selected within the range of m. Next, one example of a preferred embodiment of the present invention will be described with reference to the accompanying drawings. FIG. ,first,
As shown in (a), a desired synthetic resin powder 2 and a conductive wire mesh 3 are placed in a Venus 1 and heated and formed using a hot press 4 to create a conductive synthetic resin plate, and then in (b). A disc-shaped conductive synthetic resin substrate 6 of a predetermined size having a mounting hole 5 in the center as shown is lathed. . Next, as shown in (c), the substrate 6 is masked with a resin coating or a resin jig 7, except for the part to be subjected to electroless plating, and then this is masked as shown in (d). Then, the masking is removed and an electroless plating layer is formed on the outer peripheral surface and the inner surface of the mounting hole 5 as desired, as shown in (E). 9 is provided. Next, as shown in (f), the electroless plating layer provided on the outer circumferential surface of the substrate as described above is immersed in the electrodeposition plating solution 11 containing the electrodeposition cemented carbide abrasive grains io. The board 6 is arranged in
The electrode 12 and the substrate 6 are rotated in the direction of the arrow.
A current is passed between the two electrodes to form a superhard abrasive electrodeposited layer 13 on the electroless plating layer provided on the outer peripheral surface of the substrate. In this way, the carbide abrasive grain layer is electrodeposited on the outer peripheral surface of the disk-shaped conductive synthetic resin substrate with the mounting hole in the center via the electroless plating layer, and the mounting hole is fixed as desired. The electrodeposited grindstone of the present invention is obtained, the inner surface of which is provided with an electroless plating layer. [Example 1] Next, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited in any way by these examples. Example 1 A conductive phenol resin plate was prepared by heating and forming a commercially available phenol resin together with a 200-mesh conductive wire mesh using a hot press. processed. Next, the board is immersed in a plating bath filled with a commercially available electroless nickel plating solution to perform electroless nickel plating, thereby forming an electroless plating layer with a thickness of 10 μm on the outer peripheral surface of the board and the inner surface of the mounting hole. After that, a particle size of 3G=40 pm (#5
A diamond abrasive layer was formed using the synthetic diamond abrasive grains of No. 00) by a nickel electrodeposition method to produce an electrodeposited grindstone of the present invention. The electrodeposition conditions, liquid composition and physical properties used for electrodeposition are shown below. Electrodeposition conditions Bath temperature: 45°C Cathode current density = 2-8 A/dm Plating time: 2 hours Composition of liquid used for electrodeposition, physical properties Nickel sulfamate = 400g & nickel chloride
= 15 g/l Boric acid = 35 ti/l Sulfamic acid: Small amount pH adjuster: Small amount Brightener: Small amount 9H = 3-7 Surface tension = 28 dyne/cm As a result, a diamond abrasive grain content of 30 vo was applied to the outer peripheral surface of the substrate.
At 1%, an electrodeposited layer with a thickness of 28 μm was formed as a nickel plating layer. The particle size of #500 diamond abrasive grains used was 30 to 40.
pm, the surface of the formed electrodeposited layer has diamond abrasive grains slightly protruding from the nickel surface. When using the thus obtained whetstone of the present invention, a WA500-J whetstone was used, and the whetstone was dressed in advance. In addition, a similar dressing was applied to a resin bonded grindstone for comparison. Example 2 A substrate for a cutting wheel shown in FIG. 2(b) was prepared in the same manner as in Example 1. After applying an electroless plating layer to this substrate in the same manner as in Example 1, a diamond abrasive grain layer was formed by nickel electrodeposition to produce an electrodeposited grindstone of the present invention, which was used for testing. Example 3 An electrodeposited grindstone of the present invention was produced in exactly the same manner as in Example 1 except that #120 diamond abrasive grains were used instead of #500 diamond abrasive grains in Example 1. Example 4 In the same manner as in Example 1, flat grindstone substrates shown in FIGS. 2(c) and 2(d) were created. This substrate 1 was subjected to electroless copper plating treatment in an electroless copper plating tank using the same method as in Example 1. At this time, a commercially available electroless copper plating solution was used, the solution was heated to about 50°C, and the substrate was immersed in this solution for about 2 hours to perform electroless copper plating with a film thickness of 2 Gpm. A layer was formed on the outer peripheral surface of the substrate and the inner surface of the mounting hole. Next, on the electroless copper plating layer provided on the outer peripheral surface of the substrate, particles with a particle size of 105 to 1
A CBN abrasive layer was formed by a copper electrodeposition method using CBN abrasive grains of 2.5 μm (suzo) to produce an electrodeposited grindstone of the present invention. The electrodeposition conditions at this time and the liquid composition used for electrodeposition,
The physical properties are shown below. Electrodeposition conditions Bath temperature: 50°C Cathode current density = 2-5A/dm'' Plating time = 3 hours Composition and physical properties of the liquid used for electrodeposition Pyrodone Conc (trade name): O-51/1 ammonia
= 5 ccl & leveling agent, brightening agent: 5 cc / Tragic specific gravity: l, 3 9H = 8.6 Surface tension = 77 dy ■ e / Cm As a result, the thickness of the copper plating layer on the outer peripheral surface of the board is about 90 μm, An electrodeposited layer was formed in which CBN abrasive grains protruded by about 20 pm from the surface of the plated layer. Application example 1 The processing of quartz glass as shown in Fig. 3 was carried out using a diamond abrasive layer of 500 mm, a grindstone outer diameter of 100 mm, a grindstone thickness of 3 mm,
Using a conventional resin pound grindstone with a V-shaped outer circumference, a metal bond grindstone, and an electroplated grindstone of the present invention obtained in Example 1, the grindstone rotation speed was 8.00 Or-pm-, and the workpiece feed rate was 10 su+. The performance was compared under the conditions of: /min, depth of cut: 0.8 mm, and grinding fluid (tap water) flow rate: l/min. As a result, the resin bonded whetstone had good sharpness and the chipping at the peak was as small as lO ~ 20pm, but when grooving the lO line, the tip of the whetstone wore out in a semicircular shape, and the bottom of the quartz glass groove became rounded. Ta. In addition, in the case of the metal bonded whetstone, there was almost no wear on the whetstone, but chipping at the top of the mountain was large, and chipping with a size of 50 to 1007 wm frequently occurred. On the other hand, when the electrodeposited grindstone of the present invention is used,
Both have high wear resistance, similar to metal bonded grinding wheels.
The tip of the grinding wheel does not become semicircular, and the chipping at the top of the quartz glass is extremely small, ranging from NG to 20 μm.
One. Application example 2 PC with reinforcing steel whose surface is covered with glass and has a thickness of 15 mm
The plate has a diamond abrasive layer of 120 mm and a grindstone outer diameter of 200 mm.
xya, a conventional metal bonded grindstone with a grindstone thickness of 4 dragons, and an electroplated grindstone of the present invention obtained in Example N3, and a grindstone rotation speed of 600 Or-p, m. , workpiece feed speed 2m/min
Electrolytic grinding cutting was carried out under conditions of a grinding fluid (nitrate aqueous solution) flow rate of 8ffi/min. At this time, the reinforcing bar in the workpiece is used as an anode,
Cutting was performed by pouring a nitrate aqueous solution using the grindstone as a cathode. As a result, in electrolytic grinding cutting using a metal bond grindstone, chipping of the glass layer during cutting of reinforcing bars was reduced to 0.5 to 1.0+m+w, which was smaller than in the case of general cutting. On the other hand, when cutting by electrolytic grinding with this electroplated grindstone, 0.3 to 0-
6rxxs and chipping was further reduced. Application Example 3 Using the electrodeposited grindstone of the present invention obtained in Example 4 and the conventional resin bonded grindstone, SKH-51 (HRC: 60) was wet-ground using a surface grinder under the following conditions, and its performance was evaluated. compared. Grinding conditions Grinding wheel circumferential speed = 1600 m/min Table feed speed = 10 m/min Table longitudinal feed amount =
3mm/pass cutting = 20μm/times The size of the grindstones is that both grindstones have an outer diameter of 180+m. As a result, the grinding ratio of the resin bonded grindstone was about 450, whereas the grinding ratio of the electrodeposited grindstone of the present invention was about 2000. Regarding the roughness of the grinding surface, both grindstones have Rmax (2 to 3)
No difference was observed in μm. [Effects of the Invention] The electrodeposited grindstone of the present invention uses a synthetic resin for the substrate, so it is elastic and absorbs vibrations during processing, and is more effective against the workpiece than a grindstone with a steel substrate, which is difficult to absorb vibrations. The applied impact is alleviated, resulting in less chipping and less noise. In addition, since the abrasive grain layer is continuously formed, chipping can be reduced even though it is an electroplated grindstone, especially when grinding materials that are prone to chipping, especially when grooving or cutting. Since the abrasive grain layer is electrodeposited with a metal bond, it has superior wear resistance and a longer life than resin bonded grindstones. Furthermore, since the grinding wheel of the present invention has electrical conductivity, it can be used to process steel materials that are unsuitable for diamond grinding wheels.
This problem can be solved by electrolytic grinding, and the metal contained in the substrate is not only conductive but also serves as a reinforcing material. Furthermore, the grinding wheel of the present invention has an electroless plating layer on the inner surface of the mounting hole of the substrate, so that the reliability of power supply to the grinding wheel is improved when cutting brittle materials including reinforcing bars, such as PC boards, by electrolytic grinding. Because it is higher and the reinforcing bars can be easily cut,
Vibration is reduced, and as a result, chipping is reduced even in composite materials including difficult-to-cut materials such as PC boards, and the reliability of the power supply is improved even when electrodepositing carbide abrasive grains when making electrodeposited grinding wheels. Since the electrodeposition becomes high, electrodeposition can be carried out efficiently.

[Brief explanation of the drawing]

FIG. 1 (a) to (a) to (c) are explanatory diagrams showing one example of the manufacturing process of the electrodeposited grindstone of the present invention, and FIGS. 2 (a), (b) and (
e) is a cross-sectional view showing examples of different forms of the electrodeposited grinding wheel of the present invention, FIG. 2(d) is an enlarged perspective view of the abrasive grain layer of the grinding wheel (c), and FIG. FIG. 3 is a diagram for explaining groove machining. In the figure, 3 is a wire mesh, 5 is a mounting hole, 6 is a substrate, 7 is a resin coating film or a resin jig, 8 is an electroless plating solution, 9 is an electroless plating layer, 10 is an abrasive grain for electrodeposition, 11 is a Electroplating solution, 1
3 is a cemented carbide abrasive grain layer, 14 is an electrolyte penetration groove, 15 is a grinding wheel, 1
6 is quartz glass.

Claims (1)

[Scope of Claims] 1. An electrodeposited grindstone in which a layer of carbide abrasive grains is formed by electroplating on the outer peripheral surface of a disk-shaped conductive synthetic resin substrate having a mounting hole in the center, the carbide abrasive grains An electrodeposited grindstone characterized in that the layer is electrodeposited on a substrate via an electroless plating layer. 2. In an electrodeposited grindstone in which a superhard abrasive grain layer is formed by electroplating on the outer peripheral surface of a disc-shaped conductive synthetic resin substrate with a mounting hole in the center, the superhard abrasive grain layer is an electroless plating layer. 1. An electrodeposited grindstone, characterized in that the grindstone is electrodeposited on a substrate through a mounting hole, and an electroless plating layer is provided on the inner surface of the mounting hole. 3 After electroless plating is applied to the outer peripheral surface of a disc-shaped conductive synthetic resin substrate with a mounting hole in the center, or to this outer peripheral surface and the inner surface of the mounting hole, an electroless plating layer is applied to the outer peripheral surface of the substrate. 3. The method for manufacturing an electrodeposited grindstone according to claim 1, wherein a layer of superhard abrasive grains is formed on the electrodeposited grindstone by electroplating.