JPH0314776Y2 - - Google Patents
Info
- Publication number
- JPH0314776Y2 JPH0314776Y2 JP1984024812U JP2481284U JPH0314776Y2 JP H0314776 Y2 JPH0314776 Y2 JP H0314776Y2 JP 1984024812 U JP1984024812 U JP 1984024812U JP 2481284 U JP2481284 U JP 2481284U JP H0314776 Y2 JPH0314776 Y2 JP H0314776Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- bottom plate
- circuit board
- cover
- fluorescent lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000630 rising effect Effects 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 230000000670 limiting effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Circuit Arrangements For Discharge Lamps (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
本考案は口金を備えた外囲器内に、けい光ラン
プおよびこのけい光ランプを点灯させるための高
周波点灯回路を一体的に収容し、既存の白熱電球
用ソケツトにそのまま差し込んで使用できるよう
にしたけい光ランプ装置に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention integrates a fluorescent lamp and a high-frequency lighting circuit for lighting the fluorescent lamp in an envelope equipped with a base. This invention relates to a fluorescent lamp device that can be used by directly inserting it into an incandescent lamp socket.
従来、この種の装置の点灯回路としては、チヨ
ークバラスト形の安定器を用いたものが一般的で
あつたが、最近では点灯回路の小形軽量化および
点灯効率の改善を図るために、上記チヨークバラ
スト形安定器に代つて高周波点灯回路を用いる試
みがなされている。
Conventionally, the lighting circuit for this type of device generally used a chiyoke ballast type ballast, but recently, in order to make the lighting circuit smaller and lighter and improve lighting efficiency, the above-mentioned type of ballast has been used. Attempts have been made to use high frequency lighting circuits in place of choke ballast type ballasts.
この高周波点灯回路としては、第1図に示した
回路構成のものが考えられているが、このような
高周波点灯回路では、その高周波変換回路101
を構成する回路素子、特に主電流が流れる出力ト
ランス102や限流トランス103等のインダク
タ装置から一般に電波として利用されている周波
数に近い放射ノイズが発生し、電波障害を招来す
る等の問題がある。この放射ノイズの防止策とし
ては、一般に雑音発生源の周囲を金属性のカバー
で完全に覆い、このカバーを接地することが知ら
れているが、上述の如く白熱電球との置換え使用
を目的とするけい光ランプ装置においては、容易
に接地することは不可能に近い。 As this high-frequency lighting circuit, a circuit configuration shown in FIG. 1 is considered, but in such a high-frequency lighting circuit, the high-frequency conversion circuit 101
There is a problem in that radiated noise close to the frequency generally used as radio waves is generated from circuit elements constituting the circuit, particularly inductor devices such as the output transformer 102 and the current limiting transformer 103 through which the main current flows, leading to radio wave interference. . As a measure to prevent this radiated noise, it is generally known to completely cover the area around the noise source with a metal cover and ground this cover. In a fluorescent lamp device, it is nearly impossible to ground it easily.
しかも、雑音発生源となるインダクタ装置をカ
バーによつて密封状態に覆つてしまうと、通気性
や放熱性が悪化するので、回路動作中の自己発熱
によりインダクタ装置のコアや巻線あるいはトラ
ンジスタ等が過熱して巻線間の絶縁破壊やコアの
磁束飽和あるいはトランジスタの熱暴走を起す虞
れがあり、かつまたその他のコンデンサや半導体
等の各種回路素子に対する熱影響も大きくなる不
具合がある。 Moreover, if the inductor device, which is a source of noise, is hermetically covered with a cover, air permeability and heat dissipation will deteriorate, so self-heating during circuit operation will damage the core, windings, transistors, etc. of the inductor device. There is a risk that overheating will cause dielectric breakdown between the windings, magnetic flux saturation of the core, or thermal runaway of the transistor, and there is also a problem that the thermal influence on various circuit elements such as other capacitors and semiconductors will be increased.
そこで、上記カバーの周面に通気孔を開設する
ことが考えられる。ところが、このようにすると
回路素子に対する通気性はある程度確保されるも
のの、孔の位置によつてはノイズ防止効果が不充
分となるとともに、孔を開ける分製造工数が増
し、コスト高となる難点がある。 Therefore, it is conceivable to provide ventilation holes in the circumferential surface of the cover. However, although this method ensures ventilation to the circuit elements to some extent, the noise prevention effect may not be sufficient depending on the position of the holes, and the number of manufacturing steps required to make the holes increases, resulting in higher costs. be.
本考案はこのような事情にもとづいてなされた
もので、単一の導電部材によつて回路素子の放熱
を妨げることなく放射ノイズを低減することがで
き、構造簡単で安価なけい光ランプ装置の提供を
目的とする。
The present invention was developed based on these circumstances, and it is possible to reduce radiation noise without interfering with the heat dissipation of circuit elements using a single conductive member, and to develop a fluorescent lamp device with a simple structure and low cost. For the purpose of providing.
すなわち、本考案は上記目的を達成するため、
口金を有する透光性の外囲器と、この外囲器内に
収容されたけい光ランプと、上記外囲器内に収容
された一面にインダクタ装置を含むランプ点灯用
の高周波点灯回路素子を配置した回路基板と、こ
の回路基板の上記回路素子を配置した面と反対側
の面に対向して設けられた底板部、およびこの底
板部の外周部に周方向に部分的に設けられ上記回
路素子を取着した面の方向に向かつて立ち上がる
立ち上がり壁、この立ち上がり壁の先端に設けら
れ上記回路素子を覆うように屈曲された覆い壁と
を有する導電部材とを具備し、上記回路素子のう
ちインダクタ装置を上記導電部材の覆い壁によつ
て覆われる部分でしかも上記回路基板の外周部側
に配置したことを特徴とする。
That is, in order to achieve the above purpose, the present invention
A transparent envelope having a base, a fluorescent lamp housed in the envelope, and a high-frequency lighting circuit element for lighting the lamp that includes an inductor device on one side housed in the envelope. The placed circuit board, a bottom plate portion provided opposite to the surface of the circuit board opposite to the surface on which the circuit elements are placed, and a bottom plate portion provided partially in the circumferential direction on the outer periphery of the bottom plate portion, and the above-mentioned circuit A conductive member having a rising wall that rises toward the surface on which the element is attached, and a cover wall that is provided at the tip of the rising wall and is bent so as to cover the circuit element. The present invention is characterized in that the inductor device is disposed in a portion of the conductive member covered by the cover wall and on the outer peripheral side of the circuit board.
以下本考案の一実施例を、第2図ないし第7図
にもとづいて説明する。
An embodiment of the present invention will be described below with reference to FIGS. 2 to 7.
図中1は合成樹脂製のカバーであり、周面が回
転放物面状をなした椀形に形成されている。カバ
ー1の一端頂部には口金2が取着されているとと
もに、他端の開口部には透光性を有する合成樹脂
又はガラス製のグローブ3が被冠されている。グ
ローブ3は略球状をなし、このグローブ3の被冠
によりポール電球形の外囲器4が構成されてい
る。そして、この外囲器4内には曲管形のけい光
ランプ5およびこのけい光ランプ5を点灯させる
ための高周波点灯回路6が一体的に収容されてい
る。このけい光ランプ5は、両端に電極7を封着
した直管形ガラスバルブを、その両端部8,8間
の中央で略U字状に曲成せしめて曲成部9を形成
するとともに、この曲成部9と両端部8,8との
間を、上記U字形を含む平面と略直交する方向に
略U字状に曲成することにより、両端部8,8と
曲成部9とを互いに隣接して同方向に位置させた
もので、その全体形状が乗馬用の鞍に似ているこ
とから鞍形けい光ランプと称している。そしてけ
い光ランプ5のバルブ内には所定量の水銀と不活
性ガスが封入されているとともに、内面にはけい
光体被膜が被着されている。このようなけい光ラ
ンプ5は、その両端部8,8および曲成部9をカ
バー1側に向けた姿勢で支持されており、この支
持構造については詳図しないが、本実施例の場合
は両端部8,8および曲成部9を、カバー1の一
端頂部側から導出された一対の支持壁10,10
に係止させる構成となつている。 In the figure, reference numeral 1 denotes a cover made of synthetic resin, which is formed into a bowl shape with a circumferential surface shaped like a paraboloid of revolution. A base 2 is attached to the top of one end of the cover 1, and an opening at the other end is covered with a light-transmitting synthetic resin or glass globe 3. The globe 3 has a substantially spherical shape, and the cap of the globe 3 forms an envelope 4 in the shape of a pole bulb. A curved tube-shaped fluorescent lamp 5 and a high-frequency lighting circuit 6 for lighting the fluorescent lamp 5 are integrally housed within the envelope 4. This fluorescent lamp 5 is constructed by bending a straight glass bulb with electrodes 7 sealed at both ends into a substantially U-shape at the center between both ends 8, 8 to form a curved portion 9. By bending the curved portion 9 and both end portions 8, 8 into a substantially U-shape in a direction substantially perpendicular to a plane including the U-shape, the curved portions 9 and 9 They are called saddle-shaped fluorescent lamps because their overall shape resembles a horseback saddle. A predetermined amount of mercury and an inert gas are sealed inside the bulb of the fluorescent lamp 5, and a phosphor coating is coated on the inner surface. Such a fluorescent lamp 5 is supported with its both ends 8, 8 and curved portion 9 facing the cover 1 side, and although this support structure is not shown in detail, in the case of this embodiment, Both end portions 8, 8 and bent portion 9 are connected to a pair of support walls 10, 10 led out from the top side of one end of the cover 1.
It is configured to be locked in place.
一方、高周波点灯回路6は第4図にブロツク図
で示したように、ラインフイルタ回路11、全波
整流回路12、電源平滑用コンデンサ13および
高周波変換回路14を主として構成され、交流電
源15の交流サイクルを雑音吸収用のラインフイ
ルタ回路11を通して全波整流回路12に入力す
るとともに、この全波整流回路12で直流化して
出力し、さらにこの出力電圧を高周波変換回路1
4で高周波電圧に変換して出力するようになつて
いる。そしてこのような高周波点灯回路6は、口
金2および限流トランス16を介してけい光ラン
プ5に接続されている。 On the other hand, as shown in the block diagram in FIG. The cycle is inputted to a full-wave rectifier circuit 12 through a line filter circuit 11 for noise absorption, and the full-wave rectifier circuit 12 converts it into direct current and outputs it, and further converts this output voltage into a high-frequency converter circuit 1.
4, it is converted to a high frequency voltage and output. The high frequency lighting circuit 6 is connected to the fluorescent lamp 5 via the cap 2 and the current limiting transformer 16.
高周波点灯回路6の各回路11〜14は、平板
状をなした回路基板17の一面上に配置されてお
り、このため回路基板17の同一面上には各種の
回路素子、つまり高周波変換回路14の限流トラ
ンス16や出力トランス18およびその他の回路
のトランジスタ、抵抗、コンデンサ等の回路素子
19…が取付けられ、図示しないプリント配線層
によつて所定の回路構成に接続されている。そし
てこれらの回路素子16,18,19…のうち、
主な雑音発生源となる限流トランス16および出
力トランス18等のインダクタ装置は、回路基板
17の外周端部側に片寄つた位置に配置されてい
る。また回路基板17における上記回路素子1
6,18,19…が配置された面とは反対側の裏
面には、シリコン接着剤20を介して例えば厚さ
が1mm程度のアルミ板からなる導電性の底板部2
1が密着されており、この底板部21は回路基板
17の裏面全面を覆つている。底板部21の両端
外囲部の2箇所は、回路基板17の一面側に向つ
て一体に折り返されており、これら折り返し部2
2,22の立ち上がり壁23,23の先端部に
は、回路基板17の一面と略平行に離間対面され
る覆い壁24,24が形成されている。したがつ
て底板部21及び折り返し部22,22は一体的
に形成された導電部材である。そして、上記立ち
上がり壁23,23は底板部21の両端部から延
長されており、底板部21の周縁部の他の部分に
立ち上がり壁がなく、すなわち底板部21の周縁
部にあつてはこれら立ち上がり壁23,23間が
開放されている。また覆い壁24,24は回路基
板17上において離間されており、これら覆い壁
24,24間には回路基板17上に連なる〓間が
形成されている。そしてこのような折り返し部2
2,22は、上記回路基板17上の限流トランス
16や出力トランス18に対応して位置してお
り、その立ち上がり壁23,23および覆い壁2
4,24の内面が上記各トランス16,18に近
接し、これら限流トランス16および出力トラン
ス18の周囲を上記裏面側の底板部21との間で
覆つている。 Each of the circuits 11 to 14 of the high frequency lighting circuit 6 is arranged on one surface of the flat circuit board 17, and therefore various circuit elements, that is, the high frequency conversion circuit 14 are arranged on the same surface of the circuit board 17. A current limiting transformer 16, an output transformer 18, and other circuit elements 19 such as transistors, resistors, and capacitors are attached and connected to a predetermined circuit configuration by a printed wiring layer (not shown). Of these circuit elements 16, 18, 19...
Inductor devices such as the current limiting transformer 16 and the output transformer 18, which are the main sources of noise, are arranged at positions offset toward the outer peripheral end of the circuit board 17. Further, the circuit element 1 on the circuit board 17
A conductive bottom plate part 2 made of an aluminum plate with a thickness of about 1 mm is attached to the back surface opposite to the surface on which 6, 18, 19... are arranged, with a silicone adhesive 20 interposed therebetween.
1 is in close contact with the circuit board 17, and this bottom plate portion 21 covers the entire back surface of the circuit board 17. Two parts of the outer surrounding part at both ends of the bottom plate part 21 are integrally folded back toward one side of the circuit board 17, and these folded parts 2
Covering walls 24, 24 are formed at the tips of the rising walls 23, 23 of No. 2, 22, and are spaced apart and facing each other substantially parallel to one surface of the circuit board 17. Therefore, the bottom plate portion 21 and the folded portions 22, 22 are integrally formed electrically conductive members. The rising walls 23, 23 extend from both ends of the bottom plate 21, and there are no rising walls on other parts of the periphery of the bottom plate 21. The space between the walls 23 is open. Further, the cover walls 24, 24 are spaced apart on the circuit board 17, and a gap that continues on the circuit board 17 is formed between these cover walls 24, 24. And this kind of folded part 2
2 and 22 are located corresponding to the current limiting transformer 16 and the output transformer 18 on the circuit board 17, and the rising walls 23, 23 and the cover wall 2
The inner surfaces of the transformers 4 and 24 are close to the transformers 16 and 18, and cover the current limiting transformer 16 and the output transformer 18 with the bottom plate 21 on the back side.
なお、底板部21を回路基板17に取付けるに
当つては、予め底板部21の両端部に折り返し部
22,22をプレス等により一体成形しておき、
この後、折り返し部22,22間に側方から各種
回路素子16,18,19…を備えた回路基板1
7を挿入し、この回路基板17の表面を底板部2
1に対しシリコン接着剤20で固着することによ
り取付けが完了する。また第4図中符号26はけ
い光ランプ5の始動回路であり、上記回路基板1
7上に高周波点灯回路6とともに配置されてい
る。 In addition, when attaching the bottom plate part 21 to the circuit board 17, the folded parts 22, 22 are integrally molded on both ends of the bottom plate part 21 by pressing etc. in advance.
After this, the circuit board 1 is equipped with various circuit elements 16, 18, 19, etc. from the side between the folded parts 22, 22.
7 and insert the surface of this circuit board 17 into the bottom plate part 2.
1 with silicone adhesive 20 to complete the installation. Further, reference numeral 26 in FIG. 4 is a starting circuit for the fluorescent lamp 5, and the circuit board 1
7 together with the high frequency lighting circuit 6.
このような構成によれば、回路基板17の裏面
を覆う底板部21の折り返し部22,22を一体
に設け、この折り返し部22,22の各壁23,
24で囲まれる空間部分に、雑音発生源となる限
流トランス16および出力トランス18等を配置
したので、単一の底板部21で各トランス16,
18のコアの周囲を覆うことができる。このた
め、回路動作中に生じる磁界を効率良く遮蔽する
ことができ、放射ノイズの漏洩が少なくなつて電
波障害等の周囲機器に対する悪影響を抑えること
ができる。そして、この磁界を遮蔽するための折
り返し部22,22は、導電性部材の外周端部を
単に折り返すのみで形成されるので、従来の如き
格別な孔開け作業は不要となるとともに、個々の
トランス16,18を遮蔽カバーで覆う場合に比
べて部品点数が少なくて済む。このため、簡単な
構造でかつまた少ない面積で以つて大きなシール
ド効果が得られ、コストの低減や軽量化に寄与す
る。 According to such a configuration, the folded parts 22, 22 of the bottom plate part 21 covering the back surface of the circuit board 17 are integrally provided, and the respective walls 23, 22 of the folded parts 22, 22,
In the space surrounded by
It can cover around 18 cores. Therefore, the magnetic field generated during circuit operation can be efficiently shielded, the leakage of radiated noise is reduced, and adverse effects on surrounding equipment such as radio wave interference can be suppressed. The folded parts 22, 22 for shielding this magnetic field are formed by simply folding back the outer peripheral end of the conductive member, so there is no need for special hole-drilling work as in the past, and the individual transformers are The number of parts can be reduced compared to the case where 16 and 18 are covered with a shielding cover. Therefore, a large shielding effect can be obtained with a simple structure and a small area, contributing to cost reduction and weight reduction.
さらに底板部21には、折り返し部22,22
以外回路基板17上の各種回路素子16,18,
19…を覆うような部分は全く存在しないので、
これら回路素子16,18,19…が密封される
こともなく、特に本実施例の場合は折り返し部2
2,22間にも〓間が存在するので、回路素子1
6,18,19…に対する通気性を充分に確保で
きる。したがつて、回路素子16,18,19…
の放熱が妨げられずに済むから、トランス類の磁
束飽和や絶縁破壊はもちろん、その他のコンデン
サや半導体類の熱損傷を防止でき、回路動作の信
頼性が増す利点がある。 Further, the bottom plate portion 21 includes folded portions 22, 22.
Various circuit elements 16, 18 on the circuit board 17 other than
Since there is no part that covers 19...
These circuit elements 16, 18, 19... are not sealed, and especially in the case of this embodiment, the folded portion 2
Since there is a space between 2 and 22, circuit element 1
6, 18, 19... can be sufficiently ensured. Therefore, the circuit elements 16, 18, 19...
Since the heat dissipation of the circuit is not hindered, it is possible to prevent magnetic flux saturation and dielectric breakdown of transformers, as well as thermal damage to other capacitors and semiconductors, which has the advantage of increasing the reliability of circuit operation.
なお、本考案者らは底板部21の折り返し部2
2,22で各トランス16,18を覆つた点灯回
路、および単に回路基板17の裏面のみを底板部
21で覆つた点灯回路、さらには何らの対策も施
さない点灯回路を外囲器4内に収容し、回路動作
時に夫々の回路から発生する放射ノイズの強度を
測定したところ、第7図に示される如き結果を得
た。この第7図中符号AないしCは各点灯回路の
放射ノイズを上記した順で示しており、この第7
図からも明らかなように、単に回路基板17の裏
面に底板部21を被着しただけでもある程度の放
射ノイズの低減は認められるが、これに折り返し
部22,22を付加すると、放射ノイズが急激に
低下することが認められ、折り返し部22,22
による磁界の遮蔽効果が充分に発揮されているこ
とが分る。 In addition, the inventors of the present invention
2 and 22, a lighting circuit that covers each transformer 16 and 18, a lighting circuit that simply covers only the back side of the circuit board 17 with the bottom plate part 21, and a lighting circuit that does not take any measures are placed inside the envelope 4. When the intensity of radiation noise generated from each circuit was measured during circuit operation, the results shown in FIG. 7 were obtained. The symbols A to C in FIG. 7 indicate the radiation noise of each lighting circuit in the above order.
As is clear from the figure, radiated noise can be reduced to some extent by simply attaching the bottom plate part 21 to the back surface of the circuit board 17, but when the folded parts 22 are added to this, the radiated noise sharply increases. It was observed that the folded portions 22, 22
It can be seen that the magnetic field shielding effect is sufficiently exhibited.
そしてこのような折り返し部22,22を設け
る場合には、第8図に示した他の実施例のように
覆い壁24,24の先端部を互に突き合わせ、各
トランス16,18の周囲をループ状に覆うよう
にしても良い。この時の放射ノイズを測定する
と、第7図中符号A′で示すように一段と低下す
ることが認められ、これはトランス16,18の
周囲がループ状に覆われたことによつて磁界の遮
蔽効果がより高められているためと考えられる。 When such folded portions 22, 22 are provided, the tips of the covering walls 24, 24 are brought into contact with each other as in the other embodiment shown in FIG. 8, and a loop is formed around each transformer 16, 18. It may be covered in a shape. When the radiation noise was measured at this time, it was found that it decreased further as shown by the symbol A' in Fig. 7, and this was because the transformers 16 and 18 were covered in a loop to shield the magnetic field. This is thought to be because the effect is further enhanced.
なお、上述した実施例ではけい光ランプを鞍形
状としたが、例えばU字形であつても良いととも
に、外囲器の形状もボール電球形に特定されな
い。 In the embodiments described above, the fluorescent lamp has a saddle shape, but it may be U-shaped, for example, and the shape of the envelope is not limited to the ball bulb shape.
以上詳述したように本考案は、回路基板の回路
素子を囲む導電部材は、上記回路基板の回路素子
を設置した面と反対側の面に対向して設けられた
底板部、この底板部の外周部に周方向に沿つて部
分的に設けられ上記回路素子を取着した面の方に
向かつて立ち上がる立ち上がり部およびこの立ち
上がり部の先端に設けられ上記底板部に対して離
間対向するように屈曲された覆い部とを備え、上
記回路素子のうちインダクタ装置を上記覆い部に
よつて覆われる部分でかつ上記回路基板の外周部
側に配置したことを特徴とするもので、このよう
な構成によば、回路動作中に生じるインダクタ装
置から発する磁界を上記導電部材の底板部、立ち
上がり部および覆い部で効率よく遮蔽することが
でき、放射ノイズを低く抑えることができる。ま
た、上記立ち上がり部は底板部の全周に設けられ
るのではなく部分的に形成されるから、導電部材
は側方が開放され、よつて回路素子の放熱を妨げ
ることはない。しかも、上記磁界の遮蔽に寄与す
る立ち上がり部および覆い部は、単に導電部材の
底板部から延長して折り返し成形すればよいの
で、格別な後加工や部品は不要であり、部品点数
の削減および構造の簡素化が可能となり、コスト
の低減および軽量化が可能になる。
As detailed above, in the present invention, the conductive member surrounding the circuit elements of the circuit board is connected to a bottom plate portion provided opposite to the surface of the circuit board opposite to the surface on which the circuit elements are installed; A rising portion that is partially provided along the circumferential direction on the outer periphery and rises toward the surface on which the circuit element is attached, and a rising portion that is provided at the tip of this rising portion and is bent so as to face away from the bottom plate portion. and a cover portion of the circuit board, and the inductor device of the circuit element is disposed in a portion covered by the cover portion and on the outer peripheral side of the circuit board. Accordingly, the magnetic field generated from the inductor device during circuit operation can be efficiently shielded by the bottom plate portion, the rising portion, and the cover portion of the conductive member, and radiation noise can be suppressed to a low level. Further, since the rising portion is not provided all around the bottom plate portion but is formed partially, the conductive member is left open on the sides, and therefore does not impede heat dissipation from the circuit elements. Moreover, the rising part and the cover part that contribute to shielding the magnetic field can be simply extended from the bottom plate part of the conductive member and folded back, so no special post-processing or parts are required, and the number of parts can be reduced and the structure It becomes possible to simplify the process, reduce costs and reduce weight.
第1図は考案の技術的背景を示す高周波点灯回
路の回路図、第2図ないし第7図は本考案の一実
施例を示し、第2図は装置全体の断面図、第3図
は第2図中−線に沿う断面図、第4図は高周
波点灯回路のブロツク図、第5図は高周波点灯回
路の平面図、第6図は第5図中−線に沿う断
面図、第7図は特性図、第8図は本考案の他の実
施例を示す断面図である。
2……口金、4……外囲器、5……けい光ラン
プ、6……高周波点灯回路、16,18,19…
…回路素子(限流トランス、出力トランス)、1
7……回路基板、21……底板部、22……折り
返し部、23……立ち上がり壁、24……覆い
壁。
Fig. 1 is a circuit diagram of a high-frequency lighting circuit showing the technical background of the invention, Figs. 2 to 7 show an embodiment of the invention, Fig. 2 is a sectional view of the entire device, and Fig. 3 is a circuit diagram of a high-frequency lighting circuit showing the technical background of the invention. FIG. 4 is a block diagram of the high-frequency lighting circuit, FIG. 5 is a plan view of the high-frequency lighting circuit, FIG. 6 is a cross-sectional view taken along the line in FIG. 5, and FIG. 8 is a characteristic diagram, and FIG. 8 is a sectional view showing another embodiment of the present invention. 2...Base, 4...Envelope, 5...Fluorescent lamp, 6...High frequency lighting circuit, 16, 18, 19...
...Circuit element (current limiting transformer, output transformer), 1
7...Circuit board, 21...Bottom plate portion, 22...Folding portion, 23...Rising wall, 24...Covering wall.
Claims (1)
に収容されたけい光ランプと、上記外囲器内に収
容され一面にインダクタ装置を含むランプ点灯用
の高周波点灯回路素子を配置した回路基板と、こ
の回路基板の上記回路素子を配置した面と反対側
の面に対向して設けられた底板部、この底板部の
外周部に周方向に沿つて部分的に設けられ上記回
路素子を取着した面の方向に向かつて立ち上がる
立ち上がり部およびこの立ち上がり部の先端に設
けられ上記回路素子を覆うように屈曲された覆い
部とを有する導電部材とを具備し、上記回路素子
のうちインダクタ装置を上記導電部材の覆い部に
よつて覆われる部分でかつ上記回路基板の外周部
側に配置したことを特徴とするけい光ランプ装
置。 A translucent envelope having a base, a fluorescent lamp housed in the envelope, and a high-frequency lighting circuit element for lamp lighting housed in the envelope and including an inductor device on one side are arranged. a circuit board, a bottom plate portion provided opposite to the surface of the circuit board opposite to the surface on which the circuit elements are disposed, and a bottom plate portion provided partially along the circumferential direction on the outer periphery of the bottom plate portion; a conductive member having a rising portion rising toward the surface on which the element is attached, and a cover portion provided at the tip of the rising portion and bent so as to cover the circuit element; A fluorescent lamp device characterized in that an inductor device is disposed in a portion covered by the cover portion of the conductive member and on the outer peripheral side of the circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2481284U JPS60136468U (en) | 1984-02-23 | 1984-02-23 | fluorescent lamp device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2481284U JPS60136468U (en) | 1984-02-23 | 1984-02-23 | fluorescent lamp device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60136468U JPS60136468U (en) | 1985-09-10 |
JPH0314776Y2 true JPH0314776Y2 (en) | 1991-04-02 |
Family
ID=30519315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2481284U Granted JPS60136468U (en) | 1984-02-23 | 1984-02-23 | fluorescent lamp device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60136468U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004501798A (en) * | 2000-06-29 | 2004-01-22 | ペ.ドゥブルヴェ.エフ. グループ | Plate pre-cut to form volume, especially packaging box, method of manufacturing the same, and formed packaging box |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731725B2 (en) * | 1976-01-21 | 1982-07-06 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6111849Y2 (en) * | 1980-07-31 | 1986-04-14 | ||
JPS5890654U (en) * | 1981-12-15 | 1983-06-20 | 株式会社東芝 | fluorescent lamp device |
-
1984
- 1984-02-23 JP JP2481284U patent/JPS60136468U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731725B2 (en) * | 1976-01-21 | 1982-07-06 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004501798A (en) * | 2000-06-29 | 2004-01-22 | ペ.ドゥブルヴェ.エフ. グループ | Plate pre-cut to form volume, especially packaging box, method of manufacturing the same, and formed packaging box |
Also Published As
Publication number | Publication date |
---|---|
JPS60136468U (en) | 1985-09-10 |
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