JPH03146259A - Jet type soldering device - Google Patents

Abstract

PURPOSE:To carry out a high quality soldering equally in the front and rear end parts thereof in the advancing direction thereof with the jet type soldering device by fitting a perforated plate in the aperture part of nozzles for ejecting molten solder and oscillating the perforated plate back and forth in the transporting direction of the work at the speed higher than the transporting speed of the work. CONSTITUTION:The primary nozzle 12 and the secondary nozzle 13 are provided in a solder tank 11 contg. the molten solder and the molten solder is ejected from the tops of the nozzles 12, 13 by the effect of a pump 16 which is driven by the rotation of a motor 14. The perforated plate 21 provided with the many small holes 15 is placed in the upper aperture of the primary nozzle 12 and the work 24a to be treated is so transported obliquely upward in an arrow direction that the waves 22 of the molten solder ejected from the small holes 25 and the waves 23 of the solder ejected from the secondary nozzle 13 come into contact with the work. The perforated plate 21 is oscillated in the transporting direction of the work at the higher speed than the transporting speed of the work 24a by the reciprocating motion of a rod 37 generated by the rotation of a motor 32. The front end and rear end of the work 24a are struck by the molten solder waves, by which the front and rear end parts are uniformly soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention is a jet soldering device using a perforated plate.

(Prior Art) As shown in Japanese Unexamined Patent Publication No. 58-218368, a perforated plate is fitted into the upper opening of a nozzle provided inside a solder bath body, and solder waves are jetted through the perforated plate. There is a jet soldering device that transports the workpiece by a jet.

(Problem to be Solved by the Invention) Solder waves jetted through this type of perforated plate are suitable for soldering extremely small workpieces such as chip components;
The advancing end (front end) of the workpiece is relatively hit with molten solder from the opposite side, while the opposite end (front end) of the workpiece is
Since the rear end (rear end) moves to escape from the solder wave, the soldering characteristics differ between the advancing end and the opposite end of the workpiece.

SUMMARY OF THE INVENTION An object of the present invention is to provide a jet soldering device that can provide equally good soldering properties at the advancing end and the opposite end of the workpiece.

[Structure of the invention]

(Means for Solving the Problems) In the present invention, a perforated plate 21 is fitted into an upper opening of a nozzle 12 provided inside a solder tank main body 11.
Warpage on solder waves jetted through 1 24.241
In a jet soldering device in which a perforated plate 2 is conveyed,
1 is loosely fitted in the perforated plate 21 so as to be movable back and forth in the workpiece conveyance direction, and a vibration mechanism 31 that vibrates the perforated plate 21 in the fore-and-aft direction is connected to the perforated plate 21.

(Function) In the present invention, since the perforated plate 21 is vibrated back and forth in the workpiece conveyance direction at a higher speed than the workpiece conveyance speed, the molten solder wave 22 vibrated together with the perforated plate 21 is caused to move forward of the workpiece 248. Not only the side end (front end) but also the opposite end (rear end) are energized and collided from the opposing sides to ensure reliable soldering.

(Examples) Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings.

As shown in FIGS. 1 and 2, the solder bath body 1
A primary nozzle 12 and a secondary nozzle 13 are provided inside the nozzle 1 . This secondary nozzle 12 and secondary nozzle 13
The molten solder is pumped through each duct 17 by the action of a pump 1G driven by each motor 14 via a belt transmission mechanism 15.

A perforated plate 21 is fitted into the upper opening of the primary nozzle 12,
A primary solder wave 22 is jetted through this porous plate 21,
so as to come into contact with this second solder wave 22 and the shaping secondary solder wave 23 jetted from the secondary nozzle 13.
A workpiece (substrate) 24 is conveyed in an upwardly inclined manner. A large number of small holes 25 are bored in the perforated plate 21 in a fixed pattern.

The perforated plate 21 is loosely fitted onto the upper part of the nozzle 12 so as to be movable back and forth in the workpiece conveyance direction.
1 is connected to a vibration mechanism 31 that vibrates the perforated plate 21 in the longitudinal direction. This vibration mechanism 31 has a pair of discs 35 fixed to a rotating shaft 34 driven by a motor 32 via a belt transmission mechanism 33.
A crank pin 36 is provided protrudingly at an eccentric position, and one end of a rod 37 is rotatably fitted onto this crank pin 36.
The other end of this rod 37 is rotatably fitted onto pins 38 protruding from both ends of the porous plate 21.

Then, when the motor 32 is driven, the rotating shaft 34 and the pair of discs 35 are rotated via the belt transmission mechanism 33, and the rod 37 is reciprocated by the rotation of the crank pin 36 at an eccentric position. The plate 21 is vibrated back and forth in the workpiece conveyance direction at a higher speed than the conveyance speed of the workpiece 24 at the opening surface of the nozzle 12 .

Therefore, the primary solder wave 22 jetted through the perforated plate 21 is also vibrated in the fore-and-aft direction. Therefore, as shown in FIG. 3, the -th solder wave 22 is applied not only to the forward end (front end) of the workpiece (chip component under the board) 24a but also to the opposite end (rear end) of the workpiece (chip component under the board) 24a. 24g of chip components such as tantalum capacitors and chip inductors are reliably soldered.

〔Effect of the invention〕

According to the present invention, the perforated plate is loosely fitted so as to be movable back and forth in the workpiece conveyance direction, and the vibration mechanism that vibrates the perforated plate in the back and forth direction is connected to the perforated plate.
The molten solder waves vibrated together with the perforated plate are energized and hit not only the forward end (front end) of the workpiece but also the opposite end (rear end) from the opposite side, causing the forward end of the workpiece and the opposite side to collide. Equally good solderability is obtained at the ends.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing one embodiment of the jet soldering apparatus of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a cross-sectional view of the upper part of the nozzle showing the operation during soldering. 11... Solder bath body, 12... Nozzle, 21... Perforated plate, 24.241... Workpiece, 31... Vibration mechanism. 2f Rinku S1 Shiko Work 37 Excitation God Umi

Claims (1)

[Claims] (1) In a jet soldering device in which a perforated plate is fitted into the upper opening of a nozzle provided inside the solder bath body, and a workpiece is conveyed on solder waves jetted through the perforated plate, the perforated plate is 1. A jet soldering device, characterized in that a vibration mechanism is connected to the perforated plate, the perforated plate being loosely fitted so as to be movable in the longitudinal direction in the direction of conveying the workpiece, and vibrating the perforated plate in the longitudinal direction.