JPH031440U - - Google Patents
Info
- Publication number
- JPH031440U JPH031440U JP5957489U JP5957489U JPH031440U JP H031440 U JPH031440 U JP H031440U JP 5957489 U JP5957489 U JP 5957489U JP 5957489 U JP5957489 U JP 5957489U JP H031440 U JPH031440 U JP H031440U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holes
- semiconductor package
- conductive circuit
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989059574U JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989059574U JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031440U true JPH031440U (ko) | 1991-01-09 |
| JPH0727631Y2 JPH0727631Y2 (ja) | 1995-06-21 |
Family
ID=31586188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989059574U Expired - Lifetime JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727631Y2 (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628672U (ko) * | 1985-07-02 | 1987-01-19 | ||
| JPS63142659A (ja) * | 1986-12-04 | 1988-06-15 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
-
1989
- 1989-05-23 JP JP1989059574U patent/JPH0727631Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628672U (ko) * | 1985-07-02 | 1987-01-19 | ||
| JPS63142659A (ja) * | 1986-12-04 | 1988-06-15 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727631Y2 (ja) | 1995-06-21 |