JPH03142969A - Solid-state image sensing device - Google Patents

Solid-state image sensing device

Info

Publication number
JPH03142969A
JPH03142969A JP1282106A JP28210689A JPH03142969A JP H03142969 A JPH03142969 A JP H03142969A JP 1282106 A JP1282106 A JP 1282106A JP 28210689 A JP28210689 A JP 28210689A JP H03142969 A JPH03142969 A JP H03142969A
Authority
JP
Japan
Prior art keywords
transfer
solid
electrode
state imaging
imaging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1282106A
Other languages
Japanese (ja)
Inventor
Yasuyuki Toyoda
泰之 豊田
Shiyunei Nobusada
俊英 信定
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1282106A priority Critical patent/JPH03142969A/en
Publication of JPH03142969A publication Critical patent/JPH03142969A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To eliminate residual images by installing a transfer electrode serving as a reading electrode stretching on both surfaces from photoelectric conversion side toward a transfer part. CONSTITUTION:When light enters an N-type impurity region 1 as the light sensitive part, electric charge is generated and stored. When a reading pulse is applied on a transfer electrode 4 in the vertical blanking period, the potential of a transfer part just under the transfer electrode becomes deeper from the light sensitive part side toward the transfer part side in a potential profile along the A-A' section. This is based on what is called narrow channel effect, and the change stored in the N-type impurity region 1 is read in an N-type impurity region 2 as the transfer part. Thereby the potential of the transfer part just under the transfer electrode can be made deeper from the light sensitive part side toward the transfer part side, so that residual images can be eliminated.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、イメージセンサ−やイメージスキャナーなど
に用いることができる固体撮影装置に関するものである
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-state imaging device that can be used for image sensors, image scanners, and the like.

[従来の技術] 固体撮像装置は、光電変換素子として固体素子を用いる
方式であり、たとえばホトトランジスタまたはホトダイ
オードを用いた光電変換素子を多数集積化し、光が当た
ると光電流が流れる原理を応用して、ファクシミリなど
画像信号処理などに用いられる。
[Prior Art] A solid-state imaging device uses a solid-state element as a photoelectric conversion element. For example, it integrates a large number of photoelectric conversion elements using phototransistors or photodiodes, and applies the principle that a photocurrent flows when exposed to light. It is used for image signal processing such as facsimiles.

近年、固体撮像装置は、産業用、家庭用を問わず、撮像
管に替わり急速に普及してきた。しかしながら、光が入
射していない時でも発生する電荷が、信号として取り出
されるいわゆる暗電流については、改善すべき点である
。この暗電流に対して、埋め込みホトダイオード構造が
有効であると考えられている。
In recent years, solid-state imaging devices have rapidly become popular, replacing image pickup tubes, both for industrial and home use. However, so-called dark current, in which charges generated even when no light is incident, is extracted as a signal, is an issue that needs improvement. It is believed that a buried photodiode structure is effective against this dark current.

以下、図面を参照しながら、上述したような従来の固体
撮像装置について説明する。
Hereinafter, a conventional solid-state imaging device as described above will be described with reference to the drawings.

第3図は、従来の固体撮像装置の感光部および電荷転送
部を示すものである。
FIG. 3 shows a photosensitive section and a charge transfer section of a conventional solid-state imaging device.

第3図において、1は受光領域である。2は電荷転送部
である。3は転送電極である。4は読み出し電極を兼ね
た転送電極である。5は分離領域である。6は読み出し
領域である。
In FIG. 3, 1 is a light receiving area. 2 is a charge transfer section. 3 is a transfer electrode. 4 is a transfer electrode that also serves as a readout electrode. 5 is a separation area. 6 is a readout area.

以上のように構成された固体撮像装置について、以下そ
の動作を説明する。
The operation of the solid-state imaging device configured as described above will be described below.

まず、感光部としてのn型不純物領域1に、光が入射す
ると、電荷が発生し蓄積される。そして、垂直ブランキ
ング期間内に転送電極4に読み出しパルスが加えられる
と、第3図A−A ’断面にそったポテンシャルプロフ
ァイルは第4図のようになる。そして、読み出し部6を
通ってn型不純物領域1に蓄積された電荷は、転送部と
してのn型不純物領域2に読み出される。
First, when light enters the n-type impurity region 1 as a photosensitive portion, charges are generated and accumulated. When a read pulse is applied to the transfer electrode 4 during the vertical blanking period, the potential profile along the cross section AA' in FIG. 3 becomes as shown in FIG. 4. The charges accumulated in the n-type impurity region 1 through the readout section 6 are read out to the n-type impurity region 2 as a transfer section.

[発明が解決しようとする課題] しかしながら、上記のような構成では、第4図のaに示
すことから明らかなように、読み出しパルスを加えた場
合に、読み出し部直下に、ポテンシャルの山が生じるた
めに、感光部から電荷転送部へ信号電荷を、完全には、
読み出すことができない。このために、残像が生じると
いう欠点を有していた。
[Problems to be Solved by the Invention] However, in the above configuration, as is clear from a in FIG. In order to completely transfer the signal charge from the photosensitive section to the charge transfer section,
Unable to read. For this reason, it has had the disadvantage of producing an afterimage.

本発明は上記従来技術の課題を解決するため、残像をな
くすることのできる固体撮像装置を提供するものである
In order to solve the problems of the prior art described above, the present invention provides a solid-state imaging device that can eliminate afterimages.

[課題を解決するための手段] 上記目的を達成するために、本発明は下記の構成からな
る。すなわち本発明は、一導電型の半導体領域の表面に
、前記一導電型と反対導電型の領域で形成された光電変
換部と、前記光電変換部で形成された信号電荷を転送す
る反対導電型の領域で形成された転送部が設けられてな
る固体撮像装置において、前記光電変換部から前記転送
部に信号電荷を読み出すための読み出しと転送を兼用し
た電極の形状が、前記光電変換部側から前記転送部へ向
かって、両側に広がっていることを特徴とする固体撮像
装置である。
[Means for Solving the Problems] In order to achieve the above object, the present invention has the following configuration. That is, the present invention includes a photoelectric conversion section formed on the surface of a semiconductor region of one conductivity type by a region of a conductivity type opposite to the one conductivity type, and a photoelectric conversion section of the opposite conductivity type that transfers signal charges formed in the photoelectric conversion section. In a solid-state imaging device provided with a transfer section formed in a region, the shape of an electrode serving both readout and transfer for reading signal charges from the photoelectric conversion section to the transfer section is such that The solid-state imaging device is characterized in that it extends on both sides toward the transfer section.

さらに本発明においては、前記読み出し電極が、転送用
電極とは独立であることが好ましい。
Furthermore, in the present invention, it is preferable that the readout electrode is independent of the transfer electrode.

[作用] 前記した本発明の構成によれば、読み出し電極直下の読
み出し部のポテンシャルが、いわゆる狭チャネル効果に
よって、転送部側が深くなるために、蓄積された信号電
荷は、完全に読み出されることとなる。したがって従来
技術の欠点であった、残像が残るという問題は解消され
る。
[Function] According to the configuration of the present invention described above, the potential of the readout section directly under the readout electrode becomes deeper on the transfer section side due to the so-called narrow channel effect, so that the accumulated signal charges are not completely read out. Become. Therefore, the problem of remaining afterimages, which was a drawback of the prior art, is solved.

[実施例] 以下、実施例を用いて本発明をさらに具体的に説明する
。なお本発明は下記の実施例に限定されるものではない
[Examples] Hereinafter, the present invention will be explained in more detail using Examples. Note that the present invention is not limited to the following examples.

第1図は、本発明の実施例における固体撮像装置の感光
部および電荷転送部を示すものである。
FIG. 1 shows a photosensitive section and a charge transfer section of a solid-state imaging device in an embodiment of the present invention.

第■図において、1は受光領域である。2は電荷転送部
である。3は転送電極である。4は読み出し電極を兼ね
た転送電極である。5は分離領域である。6は読み出し
領域である。
In Fig. 2, 1 is a light receiving area. 2 is a charge transfer section. 3 is a transfer electrode. 4 is a transfer electrode that also serves as a readout electrode. 5 is a separation area. 6 is a readout area.

そしてかかる固体撮像装置の、光電変換部から転送部に
信号電荷を読み出すための読み出しと転送を兼用した電
極4の形状を、光電変換部側から転送部へ向かって、両
側に広がるように設ける。
In such a solid-state imaging device, the shape of the electrode 4, which serves both for reading and transferring signal charges from the photoelectric conversion section to the transfer section, is provided so as to spread on both sides from the photoelectric conversion section toward the transfer section.

以上のように構成された固体撮像装置について、以下そ
の動作を説明する。
The operation of the solid-state imaging device configured as described above will be described below.

まず、感光部としてのn型不純物領域1に、光が入射す
ると、電荷が発生し蓄積される。そして、垂直ブランキ
ング期間内に、転送電極4に読み出しパルスが加えられ
ると、第1図A−A−断面に沿ったポテンシャルプロフ
ァイルは、第2図aに示したように、転送電極直下の転
送部のポテンシャルは、感光部側から転送部側に向かっ
て深くなっていく。これは、いわゆる狭チャネル効果に
よるものである。そして、n型不純物領域1に蓄積され
た電荷は、転送部としてのn型不純物領域2に読み出さ
れる。
First, when light enters the n-type impurity region 1 as a photosensitive portion, charges are generated and accumulated. Then, when a read pulse is applied to the transfer electrode 4 during the vertical blanking period, the potential profile along the cross section A-A in FIG. 1 changes as shown in FIG. The potential of the area becomes deeper from the photosensitive area side to the transfer area side. This is due to the so-called narrow channel effect. The charges accumulated in n-type impurity region 1 are read out to n-type impurity region 2 as a transfer section.

以上のように、本実施例によれば、光電変換部側から転
送部へ向かって、両側に広がった読み出し電極を兼ねた
転送電極4を設けることにより、転送電極直下の転送部
のポテンシャルを、感光部側から転送部側に向かって深
くすることが可能となるために、残像をなくすることが
できる。
As described above, according to this embodiment, by providing the transfer electrode 4 that also serves as a readout electrode and extending from the photoelectric conversion unit side toward the transfer unit, the potential of the transfer unit directly below the transfer electrode can be increased. Since the depth can be increased from the photosensitive section side to the transfer section side, afterimages can be eliminated.

また前記実施例において、読み出し電極4は転送用電極
3とは独立に設けてもよい。残像が残ることを解消でき
る点間−の効果を達成できるからである。
Further, in the embodiment described above, the readout electrode 4 may be provided independently of the transfer electrode 3. This is because it is possible to achieve a point-to-point effect that can eliminate residual afterimages.

なお、本実施例では、信号電荷として電子を用いる固体
撮像装置であるが、この装置を構成するP空領域をn型
領域に、n型領域をP空領域に入れ替えて、正孔を信号
電荷とする固体撮像装置であってもよい。
Although this example is a solid-state imaging device that uses electrons as signal charges, the P-vacancy region constituting this device is replaced with an n-type region, and the n-type region is replaced with a P-vacancy region to convert holes into signal charges. It may also be a solid-state imaging device.

[発明の効果] 以上のように本発明は、光電変換部側から転送部へ向か
って両面に広がった読み出し電極を兼ねた転送電極を設
けることにより、残像をなくすることができ、その実用
的効果は大なるものがある。
[Effects of the Invention] As described above, the present invention can eliminate afterimages by providing a transfer electrode that also serves as a readout electrode that spreads on both sides from the photoelectric conversion unit side toward the transfer unit, and has practical advantages. The effects are huge.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の第1の実施例における固体撮像装置
の構造図、第2図は本発明の実施例における動作を説明
するための図、第3図は従来の装置の構造図、第4図は
従来の装置における動作を説明するための図である。 1・・・受光領域 2・・・電荷転送部 3・・・転送電極 4・・・読み出し電極を兼ねた転送電極5・・・分離領
域 6・・・読み出し領域 第1図 第3図
FIG. 1 is a structural diagram of a solid-state imaging device according to a first embodiment of the present invention, FIG. 2 is a diagram for explaining the operation in the embodiment of the present invention, and FIG. 3 is a structural diagram of a conventional device. FIG. 4 is a diagram for explaining the operation of the conventional device. 1... Light receiving area 2... Charge transfer section 3... Transfer electrode 4... Transfer electrode 5 which also serves as a readout electrode... Separation area 6... Readout area Fig. 1, Fig. 3

Claims (2)

【特許請求の範囲】[Claims] (1)一導電型の半導体領域の表面に、前記一導電型と
反対導電型の領域で形成された光電変換部と、前記光電
変換部で形成された信号電荷を転送する反対導電型の領
域で形成された転送部が設けられてなる固体撮像装置に
おいて、前記光電変換部から前記転送部に信号電荷を読
み出すための読み出しと転送を兼用した電極の形状が、
前記光電変換部側から前記転送部へ向かって、両側に広
がっていることを特徴とする固体撮像装置。
(1) On the surface of a semiconductor region of one conductivity type, a photoelectric conversion section formed of a region of a conductivity type opposite to the one conductivity type, and a region of the opposite conductivity type that transfers the signal charge formed in the photoelectric conversion section. In a solid-state imaging device provided with a transfer section formed of:
A solid-state imaging device characterized in that the solid-state imaging device extends on both sides from the photoelectric conversion unit side toward the transfer unit.
(2)読み出し電極が、転送用電極とは独立であること
を特徴とする請求項1記載の固体撮像装置。
(2) The solid-state imaging device according to claim 1, wherein the readout electrode is independent of the transfer electrode.
JP1282106A 1989-10-30 1989-10-30 Solid-state image sensing device Pending JPH03142969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1282106A JPH03142969A (en) 1989-10-30 1989-10-30 Solid-state image sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1282106A JPH03142969A (en) 1989-10-30 1989-10-30 Solid-state image sensing device

Publications (1)

Publication Number Publication Date
JPH03142969A true JPH03142969A (en) 1991-06-18

Family

ID=17648204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1282106A Pending JPH03142969A (en) 1989-10-30 1989-10-30 Solid-state image sensing device

Country Status (1)

Country Link
JP (1) JPH03142969A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110057A (en) * 1991-10-15 1993-04-30 Matsushita Electron Corp Solid-state imaging device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181063A (en) * 1983-03-31 1984-10-15 Toshiba Corp Mos type semiconductor device
JPS624362A (en) * 1985-07-01 1987-01-10 Victor Co Of Japan Ltd Solid-state image pickup device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181063A (en) * 1983-03-31 1984-10-15 Toshiba Corp Mos type semiconductor device
JPS624362A (en) * 1985-07-01 1987-01-10 Victor Co Of Japan Ltd Solid-state image pickup device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110057A (en) * 1991-10-15 1993-04-30 Matsushita Electron Corp Solid-state imaging device

Similar Documents

Publication Publication Date Title
GB2103876A (en) Solid state image sensors
US6876019B2 (en) Charge transfer apparatus
JP4394783B2 (en) 3-transistor active pixel sensor structure with correlated double sampling and manufacturing method thereof
JP2008109154A (en) Color active pixel sensor with electronic shutter, which is anti-blooming and of low cross-talk
US6259124B1 (en) Active pixel sensor with high fill factor blooming protection
JPH0118629B2 (en)
TWI235606B (en) Solid state image pick up device
JPH04312082A (en) Solid-state image pick-up device
JP4761491B2 (en) Solid-state imaging device and imaging system using the same
KR20010014981A (en) Solid-state imaging device
JPH03142969A (en) Solid-state image sensing device
JPH03240379A (en) Solid-state image pickup element
Oda et al. A CCD image sensor with 768× 490 pixels
JPS63143862A (en) Solid-state image sensing device
JPH05190828A (en) Solid-state image-sensing element
JP3901320B2 (en) Solid-state imaging device with on-chip microlens and manufacturing method thereof
JPH05243546A (en) Solid-state image sensing device
JPH0318059A (en) Manufacture of solid-state image sensor
JP2884195B2 (en) Solid-state imaging device
JPS5825628Y2 (en) Charge-coupled imaging device
JPH04234172A (en) Solid-state image sensing element for x-ray
JPH0414257A (en) Solid-state image sensor
KR100475134B1 (en) Solid state image sensor
JP2000188387A (en) Ccd-type solid-state image pickup device
JPH0318058A (en) Manufacture of solid-state image sensor