JPH03138968A - Heat radiating fin ic package, and its manufacture - Google Patents

Abstract

PURPOSE:To omit sharply cutting process by joining a heat sink and its support integrally. CONSTITUTION:A heat sink 13 and a heat radiating plate support 11 are joined integrally. For positioning of each member and close adhesion of joining planned interface, the heat sink 13, spaces 12 and 14, and a heat transmitting board mounting plate 11 are laminated in order inside a container 32, and a heavy bob 33 is put on the top to apply surface pressure to the joining planed interface. The heat sink 13 is guided with the inwall of the container 32, and the spacers 12 and 14 and the heat transmitting board mounting plate 11 are turned up coaxially with the heat sink 13 by positioning pins 34 and 35 inserted from the air circumferential direction, and the whole members are joined integrally by the soldering with a soldering material fused in a vacuum furnace. Hereby, a heat radiating fin of the dimension that the processing is hard with cutting processing can be obtained.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a heat sink for an IC package and a method for manufacturing the same, and more specifically, to a plurality of annular heat sinks for dissipating heat generated in an IC by air cooling or water cooling. The present invention relates to a fin and a method for manufacturing the same.

(Prior Art) An IC package is the most basic device in which an IC is hermetically sealed. FIG. 1(A) shows a plan view of an example of a typical ceramic package, and FIG. 1(II) shows a schematic cross-sectional view.
It is housed in an airtight space 4 made up of a ceramic cap 3 and a ceramic cap 3, and is fixed to a central concave portion of the ceramic space 2. The mating surfaces of ceramic space 2 and ceramic cap 30 are glass layer 6 with lead 5 sandwiched between them.
It is sealed with. Leads 5 and IC chip 1 are connected by lead wires 7. Here, the materials are selected so that the linear expansion coefficients of the IC chip 11 ceramic space 2, ceramic cap 3, leads 5, and glass layer 6 are approximately the same, and the airtightness and reliability of the package are maintained. The utmost care has been taken.

However, as the degree of integration of ICs increases, it becomes necessary to dissipate heat generated in IC chips to the outside. This is because there is a risk that the IC may malfunction due to heat or the airtightness of the package may be impaired. One method is to manufacture the ceramic space 2 shown in FIG. 1(b) from a material with good thermal conductivity, but there is a limit to its heat dissipation performance. Therefore, ICs equipped with a mechanism that actively dissipates heat
package is used.

An example of this is shown in FIG. 2, which is a bin grid array type ceramic package. IC chip 1 is heat sink 1
2, ceramic plate 9.10, and lid 13
The heat sink 12 is housed in an airtight space 14 and is fixed on the heat sink 12. The heat sink 12, the ceramic plate 9, 1O1, and the lid 13 are integrated, for example, by brazing, and the heat sink 12 has dissipation fins 8 connected to its lower surface. The lead bin 11 on the ICC chip is connected by a lead wire 7 to a conductive circuit drawn on the upper surface 10a of the ceramic plate 1G.

The heat dissipation fin 8 includes a package mounting portion 8a and a plurality of heat dissipation plates 8.
b, and a heat sink support portion 8c. Heat generated in the IC chip 1 is guided to the heat sink 12 to the heat sink 8, and is emitted from the air-cooled or water-cooled heat sink 8b.

The material for the heat sink 12 is selected on the condition that it has excellent thermal conductivity and has approximately the same linear expansion coefficient as the IC chip I, such as molybdenum impregnated with copper, a composite material of copper and Kovar, etc. is used. Naturally, the material for the radiation fins is selected on the condition that it has good thermal conductivity, and aluminum, copper, etc. are used.

There are various shapes of the radiation fins 8, but here, we will explain the rotationally symmetrical shapes as shown in FIG. Needless to say.

In both cases of Fig. 3<4”) and (II+), multiple
Several annular heat sinks 8b are integrally attached to the heat sink support portion 8c, and a package attachment portion 8a is provided at the top. The outer diameter d1 of the heat sink 8b and the width g of the heat sink gap 8f are determined so that the amount of heat transferred from the IC chip and the amount of heat radiated to the air or water are balanced. The outer diameter d of the heat sink is usually approximately the same size as the outer diameter dimension a (FIG. 2) of the IC package. The heat sink thickness tl is 0.5 to 1.5 mm, and the heat sink gap gI is 1.5 to 2°5II11. The width of the heat sink is 5 to 10 times the gap g1. In addition, the number n of heat sinks is 2 to
Seven pieces is common.

The outer diameter d of the package attachment portion 8a is determined to be a size that allows the heat sink 12 shown in FIG. 2 to fit therein.

The heat sink support portion 8c has a rod shape in FIG.
) is tubular. The radiation fin 8 shown in FIG. 3(a) is made of a single metal such as aluminum or copper.

Copper has excellent thermal conductivity, but aluminum is used when weight is an issue. In the heat dissipation fin 8 shown in FIG. 3(B), a round rod-shaped core member 8d is fitted inside the heat dissipation plate support portion 8c by, for example, press fitting so that there is no gap. Copper is generally used for the core material 8d,
Heat from the heat sink 12 shown in FIG. 2 is efficiently transferred downward. If aluminum is used for parts other than the core material 8d, the weight of the radiation fin 8 as a whole can be reduced. In addition, in the heat radiation fin 8 of FIG. 3 (II), the core material 8
It is also possible to manufacture one without d and use it by fitting the heat sink 12 and core material 8d together by brazing or the like in advance, as shown in the schematic side view in Figure 4. .

(Problem N to be solved by the invention) The radiation fins 8 shown in FIG. 3 are manufactured by cutting using a lathe. There are three problems in cutting.

The first problem is that, as shown in Fig. 5, the round bar-shaped material 9
This is the life of the cutting tool 10 when cutting the heat sink gap 8f. As mentioned above, the heat sink gap g is 1.5 to 2.
．． It has a small dimension of 5-, and its width is 5~ of g+
10 times, it is necessary to use a cutting tool with a narrow width and a long cutting edge.Such cutting tools tend to damage the cutting edge and are difficult to manage.

The second problem is that the number of processing steps per product is large. As shown in FIG. 5, the cutting process is performed by cutting out a heat sink and a package mounting portion for one heat sink from the end face of a long material 9, cutting them off, and then cutting the next heat sink. As is clear from the product shape shown in FIG. 3, there is a large amount of chips, and it is also necessary to limit the cutting speed of the cutting tool so that the shape of the thin heat dissipating plate 8b does not collapse.

As a result, the number of processing steps increases, and when manufacturing in large quantities, a large number of machine tools must be prepared.

The third problem is that the material of the radiation fins must be determined in consideration of machinability. This is to improve the above-mentioned shortcoming of increased processing time. For example, in the case of aluminum heat dissipation fins, pure aluminum has poor machinability, so a free-machining aluminum alloy with Cu and Pb added is used. Alternatively, a hard aluminum alloy to which CuSMn or Mg is added is used. In other words, it is necessary to select a material that increases cost in terms of machinability.

Here, the object of the present invention is to create an I
An object of the present invention is to provide a heat radiation fin for a C package and a method for manufacturing the same.

(Means for Solving Problem R) Thus, in the broadest sense, the gist of the present invention is to provide a mounting portion for an IC package, a heat dissipation plate for dissipating heat to the outside, and a heat dissipation plate for dissipating heat from an IC depth. A heat dissipation fin for an IC package that has a heat dissipation plate support part that conducts conduction to a plate, the heat dissipation fin for an IC package being characterized in that at least the heat dissipation plate and the heat dissipation plate support part are integrally joined. be.

Another aspect of the present invention is that a through hole is formed in the center of a plate-shaped heat dissipation plate, and a rod of the same diameter or a tube of the same outer diameter is passed through the through hole and positioned at a predetermined pitch. This method of manufacturing the heat dissipation fin for an IC package is characterized in that the inner surface of the through-hole of the heat dissipation plate and the outer peripheral surface of the rod or tube are brazed.

(Function) Next, the heat dissipation fin for an IC package and the manufacturing method thereof according to the present invention will be described in more detail with reference to the accompanying drawings.

The heat dissipation fin of the present invention is made into one whole by joining the members constituting each part, for example, by brazing.

FIG. 6 shows an example of the structure of a heat dissipation fin in which all of the heat dissipation plates are joined using the flat parts of the package mounting portions. FIG. 6(a) shows a structure consisting of a disk 11 serving as a package mounting portion, a plurality of circular heat sinks 13, and disk-shaped spacers 12 and 14 sandwiched between these heat sinks.

Fig. 6 (El) shows a package mounting plate 11'' having a concentric hole in the center, spacers 12', 14°, and a heat sink 13' stacked one after another, with a core material 17 passing through the center. It is. If these are made of the same material, a radiation fin of the type shown in FIG. 3(a) will be obtained. In this case, the core material 17 includes the package mounting plate 11'', spacers 12', 14'
, which plays the role of centering the heat dissipation plate 13 degrees, and its diameter is arbitrary.For example, the diameter d is used as the 6-core material 17.
If copper is used in No. 4 and the other parts are made of aluminum, for example, the heat dissipation fin shown in FIG. 3 (rj) will be obtained.

When the heat dissipation fin shown in FIG. 3 (A) is manufactured with the structure shown in FIG. 6 (Il+), the fitting part 15 with the core material 17 is exposed,
Appearance quality may be an issue. In this case, Figure 6 (
As shown in 8), circular package mounting plates 11'' and heat sinks 13'' may be respectively bonded to both end faces of the core material 17.

6(D) and (N) show the case where the package mounting plate 11.11° and the core material 17 in (B) and (8), respectively, are integrated and used as the core material 19. In this case, the flange portion 19a of the core member 19 becomes the package attachment portion.

FIG. 7 shows an example of the structure of a heat dissipation fin that is joined using the side surface of a flat heat dissipation plate.

Figure 7 (a) shows a donut-shaped disc 20.21 fitted with a bar 22 with an outer diameter of d, which serves as a support for the heat sink, and is integrated with the heat sink fin in figure 3 (a). Become. The donut-shaped disk 20 and the upper end surface 22a of the bar are package attachment parts, and the donut-shaped disk 21 is a heat sink. If a bar 22' having a core material 8d shown in FIG. 8(A) is used instead of the bar 22, the radiation fin of FIG. 3([1)] will be obtained.

By the way, in the heat dissipation fin shown in Fig. 7 (A), the radiation fin shown in Fig. 6 (I)
l+), the donut-shaped disk 20.2
The fitting portion 15' between the rod 1 and the bar 22 is exposed, and the appearance quality may be a problem. In this case, Figure 7 (rl
), the circular package mounting plate 11 and the heat dissipation plate 13 may be joined to both end surfaces of the bar 22.

Figures 7 (8) and (d) show flanged rods in which the donut-shaped disc 20 and bar 22 in Figure 7 (a) are integrated, and the disc 11 and bar 22 in Figure 7 (t+) are integrated. This is the case when material 23 is used. In addition, if the flanged bar 23' having the core material 8d shown in FIG. 8(b) is used instead of the flanged bar 23 shown in FIG. 7(8), the heat dissipation shown in FIG. 3(II+) can be achieved. Becomes a fin.

By the way, the heat dissipation fin shown in FIG. 7 has a drawback that a jig is required as described later when positioning the heat dissipation plates 21 so that the interval between them becomes a predetermined dimension.

FIG. 9 shows an example of a heat dissipation fin that uses a heat dissipation plate having a neck of a predetermined height to facilitate positioning. FIG. 9(a) shows a radiation fin having a structure in which a bar 27 is fitted through the necked flange 24.25 and the donut-shaped disk 21, and shows the upper end surface 24b of the flange 24 and the bar end surface 27a. constitutes the package mounting part, while flange 2
5 and the donut-shaped disk 21 constitute a heat sink, which is integrally joined to the bar 27.

FIG. 9(D) shows a case where a disc-shaped heat sink 13 is used in place of the donut-shaped disc 21 of the ninth [ff1 (<).

Other details are the same as in Figure 9 (a).

FIG. 9(c) shows the neck portion 25a of the heat sink 25.26,
This is a case where the disc-shaped package mounting plate 11 is joined to the upper end surface of the bar 27 with the bar 26a facing upward.

Figure 9 (=) shows the package mounting plate 11 of Figure 9 (c).
This is a case where a flanged bar 28 in which a bar 27 and a bar 27 are integrated is used. For example, FIGS. 9(a) and (rl)
Instead of the bar 27 shown in FIG.
If the flanged bar 28' shown in Fig. 1θ (El) is used instead of the flanged bar 28 shown in Fig. 9(D) for the bar 27' having Figure 3 (
It is also possible to use a heat dissipation fin of type U).

Next, a method of manufacturing the above-mentioned heat dissipation fin will be explained.

In the present invention, at least the heat sink and the heat sink supporting member are integrally joined, preferably by brazing, which means that:
This is not only to facilitate manufacturing, but also to completely connect the bonding interface between the heat sink and other members with metal, thereby smoothing the flow of heat to the heat sink. Welding can be considered as another joining method, but since the gap between the heat sinks is small, the heat sink
Since each piece is welded one by one, it is not suitable for mass production. Therefore, brazing is preferable in practice, and the following explanation will also explain the integral joining method by brazing.

First, a method of manufacturing the radiation fin shown in FIG. 6 will be explained. Package mounting plate 11.11゛, spacer 12.12
It is efficient to manufacture the heat dissipating plates 12.', 14.14° and 13.13" by punching them from plate materials having the respective thicknesses. In order to stack and braze these, at least the spacers 12. 12'', 14, and 14' may be interposed with a brazing material on the upper and lower surfaces. Examples of methods for interposing the brazing material include the following two methods.

The first method, as shown in FIG. 11(a), is to use a plate material 31 with brazing material 30 attached to both sides of a core material 29, and punch it out to form spacers 12.12' and 14.14°. It is. The plate material 31 with brazing material can be manufactured by laminating the core material 29 and the brazing material and joining them by hot rolling.

Alternatively, it can be manufactured by applying a mixture of powdered brazing material and liquid resin adhesive to the surface of the core material and drying it. The adhesive is vaporized and disappears by heating during the brazing process, which will be described later.

A second method of interposing a brazing material at the bonding interface is to punch out a foil-shaped brazing material to have the same dimensions as the spacers 12.12' and 14.14°, and insert this into the interface.

The core material 17 shown in FIGS. 6(Iff) and (n) is a rod-shaped material cut into predetermined dimensions. Also, Figure 6 (d)
It is economical to manufacture the flanged core material 19 of (N) by upsetting a rod-shaped material.

Here, vacuum brazing is suitable for brazing the entire radiation fin assembled as shown in FIGS. 6(a) to 6(see) at once. This is a method in which the temperature is raised to a temperature at which only the brazing material melts in a vacuum furnace, and then cooled and solidified again to integrally join the interface. The reason why brazing is performed in a vacuum is to prevent a decrease in heat conduction performance and a decrease in bonding strength due to air bubbles being mixed into the molten brazing material.

By the way, in order to perform complete brazing and obtain dimensional accuracy after brazing, it is important to position each member and bring the interfaces to be joined into close contact.

FIG. 12 shows an example of the jig 36 used when brazing the heat dissipation fins shown in FIG.
1 are stacked one after another, and a weight 33 is placed from above to apply surface pressure to the interface to be bonded. The heat sink 13 is guided by the inner wall surface of the container 32, and the spacer 12.14 and the package mounting plate 11 are aligned concentrically with the heat sink 13 by positioning pins 34 and 35 inserted from three directions around the circumference.
It is charged into a vacuum furnace.

In the case of the heat dissipation fins shown in Fig. 6 (B) to (N), the core material 1
7 or 19 is at least the spacer 12', 14'
Since the center alignment between the heat dissipation fin 13' and the heat dissipation fin 13' is performed, positioning is easier than with the heat dissipation fin shown in FIG. 6(a).

Note that the molten brazing material also enters the interface between the core material 17, 19 and other members, and all the members are integrally joined by brazing.

Next, a method of manufacturing the radiation fin shown in FIG. 7 will be explained.

In this case, it is efficient to manufacture the donut-shaped disks 20, 21 by punching them from plates having respective thicknesses.

In order to braze the illustrated bar 22, flanged bar 23, and donut-shaped disk 20.21, a brazing material 37 is first applied to the bar side surface 22b and flanged bar side surface 23b as shown in FIG. Just leave it attached.

First, a method for attaching the brazing material to the side surface 22b of the bar will be described. Although the attachment method is not particularly limited, there are three main methods.

The first method is to attach tubular brazing material to a rod-shaped material that will become the core material 38 and join it by hot rolling.The second method is to immerse the core material 38 in molten brazing material to attach it.The third method is to As mentioned above, this is a method of applying powdered brazing material with a resin adhesive.

Methods for manufacturing the flanged bar 23 with brazing agent attached to the side surfaces include a method of upsetting one end of the bar with the brazing agent adhered by the method described above, and a method of manufacturing the flanged bar 23 by cutting or upsetting. There is a method of applying the above-mentioned dipping method or coating method.

In order to join the disk-shaped pan cage mounting plate 11 or the heat sink 13 as shown in FIGS. 7(B) and (D), they should be bonded with a brazing material of 30° on one side as shown in FIG. 11(RL). Punched out from a plate, the surface with the solder material 30゛ is a bar material 22
Alternatively, it may be placed at the joint interface with the flanged bar 23.

By the way, when brazing the radiation fins shown in FIG. 7, it is necessary to position the donut-shaped discs 20 and 21 in the axial direction. This is a donut-shaped disc 20.21 and a bar 22.
Alternatively, even if it is press-fitted into the flanged bar 23, there is a risk that the brazing material on the bar side surface 22b and the flanged bar side surface 23b will melt as the temperature rises, causing the donut-shaped disc 20.21 to fall under its own weight. It is. FIG. 14 shows an example of a jig for this purpose.

FIG. 14 shows the heat dissipation fin jig 39 of FIG. 7(A), in which the distance between the donut-shaped disks 20.21 is set by a half-ring-shaped distance piece 40.41. container 4
2 holds the outer peripheral surface of the distance piece 40.41,
Make handling easier. A ring-shaped groove 42° is provided on the inner bottom surface of the container 42, and serves as a reservoir for the melted and dripped brazing material. In the case of the radiation fin shown in FIG. 7(c), the distance piece 41 is not necessary. In the case of the radiation fins shown in FIGS. 7(D) and (D), a weight 33 is used for brazing the end face of the bar 22 or flanged bar 23 in the same manner as in FIG. 12.

Next, a method of manufacturing the radiation fin shown in FIG. 9 will be explained.

These heat dissipation fins have necked flanges 24.25.
26 are used, and it is economical to manufacture these from plate material by burring. Fig. 15 shows the burring process.

Although the necked flange 25 used as a heat sink will be described here, the same applies to other necked flanges 24 and 26. Figure 15 (a) shows the thickness. A circular blank 46 punched out from a plate material having a through hole 47 in the center is set on a die 44 so that the through hole 47 and the die hole 44a having a circular cross section are concentric, and the blank is lowered from above and held with a temporary presser 45. Board 46
Shows the state where is pressed and held. The outer diameter of the blank plate 46,
The plate thickness t is equal to dl and tl in FIG.

Further, the die inner diameter d2 is equal to d2 in FIGS. 3 and 9.

A punch 43 is set concentrically with the die hole 44a above, and the punch 43 has a tip guide portion 43a that is slightly smaller than the diameter d0 of the blank hole 47, a tapered portion 43b continuous with the tip guide portion 43a, and a straight body. It has a portion 43c. Taper 43
The role of b is to press and expand the blank hole 47 smoothly. Diameter d of the straight body portion 43c! ' is equal to the body diameter d8° of the bar 27 or flanged bar 28 shown in FIG.

Figure 15 (b) shows the punch 43 being lowered and the hole 4 in the blank plate being lowered.
7 is expanded to the outer diameter d2 of the punch 43 to form a neck portion 47a. The neck height H at this time is equal to the distance g1 between the heat sinks in FIG. 3 or 9. Since the flange 47f of the necked flange 47 is restrained by the temporary presser 45, it does not deform, and its outer diameter is equal to the outer diameter D0 of the blank plate 46.

By the way, the gap C between the punch 43 and the die hole 44a shown in FIG. 15(a) is set as follows. In the burring process, the thickness of the material directly above the die hole shown by diagonal lines in FIG.
As a result, for example, if the gap C is made equal to the thickness of the base plate t, the neck 47a after burring becomes tapered as shown in the same schematic cross section in FIG. 16, and is inclined with respect to the axis. If the necked flange 47, that is, the heat sink 25 is fitted onto the bar 27 or the flanged bar 28 as shown in FIG. Hateful.

To prevent this, burring process 47a in FIG.
All you have to do is add some strain to the whole thing.

The through hole of the blank plate should be determined so that the predetermined neck height H can be obtained under these conditions.Of course, the neck height can be made slightly higher than the predetermined dimension and the cutting process can be performed in the post-process. It is also possible to finish it to a predetermined size.

The disc-shaped package mounting plate 11, the heat sink 13, and the donut-shaped disc-shaped heat sink 13 in FIG. 9 can be manufactured by punching out plates of respective thicknesses, such as a bar 27 or a bar with a flange. The method of manufacturing 28 is the same as that for the rod 22 or flanged rod 23 of the radiation fin shown in FIG. 7, respectively.

Next is the 9th Tj! We will explain how to braze the heat dissipation fins of J.

Introduction Flange with neck 24, 25, 26 and bar 27
Alternatively, the flanged bar 28 may be brazed, but in this case there are two methods for intervening the brazing material at the joining interface. One method is to attach brazing material to the side surface of the bar 27 or the flanged bar 28 in advance. It is similar to

Another method is to attach brazing material to the inner surfaces of at least the necks 24a, 25a, and 26a of the necked flanges 24, 25, and 26. The neck 24 can be formed from a plate by burring, and the neck 24 after burring can be formed.
A mixture of powder brazing material and resin liquid may be applied to the inner surfaces of a, 25a, and 26a.

The heat dissipation fin shown in FIG. 9(a) has a structure in which a donut-shaped disc-shaped heat dissipation plate 21 is joined to a bar 27.
In the heat radiation fins shown in FIGS. 9(o) and (A), it is best to attach brazing material to the side surface of the bar 27. In the heat radiation fins shown in FIGS. In this case, the package mounting plate 11 and the heat dissipation plate 13 are manufactured by punching out a plate material with brazing material adhered to one side as shown in FIG. Alternatively, a mixture of powdered brazing material and resin liquid may be applied to the joint end surface of the bar 27.

Next, the assembly process will be explained. Flange with neck 24.2
5.26 is press-fitted into the bar 27 or flanged bar 28. Since the spacing between the flanges at this time is automatically set based on the neck height, distance pieces 40 and 41 as shown in FIG. 14 are unnecessary.

Figure 17 is the 9th rj! It shows a jig set in a vacuum furnace to braze the heat dissipation fins of J, and it is designed so that it will not join with the jig even if a plate with brazing metal is used as the material for the netted flange 24 and 25. It is.

FIG. 17(A) is a jig 48 for the heat dissipation fin in FIG. 9(A), and is a zero cylinder in which the donut-shaped disk-shaped heat dissipation plate 21 to which no brazing material is attached is set facing downward. A ring-shaped groove 49' is provided on the inner bottom surface of the container-shaped container 49, which serves as a reservoir for the brazing material dripping from the bonding interface with the rod 27. Centering of the radiation fins inside the container is performed using positioning pins 50 inserted in three circumferential directions from the outer surface of the container. This jig 48 is shown in FIG.
) can also be applied to heat dissipation fins.

FIG. 17 (El) shows a jig 5I for the heat dissipation fin of FIG. 9 (C), which is set with the surface of the package mounting plate 11 to which the brazing material is not attached facing downward. Centering of the package mounting plate 11 and the threaded flange 25 or 26 is performed using positioning pins 53 and 54 inserted from the outer surface of the cylindrical container 52 in three circumferential directions. In this case, surface pressure is applied by the weight 55 to join the package mounting plate 11 and the bar 27.

The jig 51 can also be used for the heat dissipation fin shown in FIG. 9(d), but the weight 55 is not particularly necessary in this case.

Next, the thickness of the brazing material will be explained. The thickness of the brazing material may be the minimum required.

FIG. 18 is a partially schematic cross-sectional view showing the joining of the heat sink and its support member when brazing is ideally performed.

FIG. 18(A) shows the case of the heat dissipation fin of FIG. 6(A), in which the brazing material is attached to the corner 56 formed by the heat dissipation plate 13 and the spacer 14 as if it were rounded. , which improves the bonding strength. Figure 18 (b) is the 7th
The case of the heat dissipation fin shown in FIG. FIG. 18(c) shows the case of the heating fin of FIG. 9(a), which includes the two inner parts 47b of the flange formed by the burring process of FIG. 15, the bar 27, and the neck tip of the adjacent necked flange. The space 57 formed by the bar 27 is filled with brazing material, thereby ensuring a transfer area from the bar 27 to the heat sink.

If the brazing material is too thin, such ideal brazing will not be achieved, and if it is too thick, the melted brazing material will partially fill the gaps between the heat sinks, making it impossible to secure the necessary heat dissipation area. Not only that, but the product value is also lost.

For example, the spacer 12.1 of the radiation fin in Fig. 6(a)
4 from the plate material to which the brazing material is adhered as shown in FIG. 11(a), the appropriate thickness t of the brazing material is 70 to 100 pm. In the case of the rod 22 of the radiation fin in Fig. 7 (a), the first
The appropriate thickness t- of the brazing material shown in Figure 3 is 30 to 70 microns. The same applies to the case where brazing material is preliminarily attached to the side surface of the bar in the heat dissipating fin shown in FIG. 9(a).

Examples are shown below to explain the effects of the present invention in more detail.

Example 1 As shown in FIG. 6(A), a package mounting plate 11 with a diameter of 25 mm was punched out of a plate of aluminum alloy 6063 with a thickness of 1 ms, a heat dissipation plate 13 with a diameter of 40 mm, and a plate with a thickness of 21 mm.
111, brazing material B with a film thickness of 90 μm is applied to both sides of the core material 3003.
A spacer 12.14 with a diameter of 14 mm punched from an aluminum plating sheet having A4004 is used as the 12th
They were laminated using the jig 36 shown in the figure, pressure was applied to the contact interface with a 5 kg weight, and the brazing was completed by heating and cooling at 600'C in a vacuum furnace.

Example 2 As shown in FIG. 6 (rl), a donut-shaped disk 11'' with an outer diameter of 25 mm and an inner diameter of 5 m was punched from the same aluminum alloy 6063 plate material as in Example 1, and a donut-shaped disk with an outer diameter of 40 mm and an inner diameter of 12 m. A donut-shaped heat sink of 13 degrees, an outer diameter of 14 punched from the same aluminum plating sheet as in Example 1.
5m, donut-shaped spacer 12', 14 with an inner diameter of 5mm
' into an aluminum 1100 core material 17 with a diameter of 5cm and a length of 16m5, and each member 11', 12', 13'
, 14' were brought into close contact with each other, and brazing was performed in a vacuum furnace under the same conditions as in Example 1.

Example 3 As shown in FIG. 6 (rl), a donut-shaped disk 11' having an outer diameter of 25mm and an inner diameter of 10*- was punched from the same aluminum alloy 6063 plate material as in Example 1, an outer diameter of 40mm, Donut-shaped heat sink 13゜ with an inner diameter of 10 mm, outer diameter 1 punched from the same aluminum plating sheet as in Example 1
4 ■-2 Donut-shaped spacer 12゛, 1 with an inner diameter of 10 m
4° is sequentially enlarged to a pure copper wire with a diameter of 10 mg and a length of 16 m + m, and each member is 11°, 12', 13', 14'.
were brought into close contact with each other, and brazing was performed in a vacuum furnace under the same conditions as in Example 1.

Example 4 As shown in FIG. 6(d), the same donut-shaped heat sink 13'' and donut-pear-shaped spacers 12' and 14'' as in Example 3 were processed by abset processing from an aluminum 1100 bar with a diameter of 10 mm. The core material 19 having a total length of 16+ms and having a flange 19a with an outer diameter of 25+a+ and a thickness of 1mm, which has been finished by cutting, is press-fitted one after another, and each member 19a is pressed with a weight of 5kg.
12', 13', and 14' were brought into close contact with each other, and brazing was performed in a vacuum furnace under the same conditions as in Example 1.

Example 5 A radiation fin was manufactured in the same manner as in Example 4, except that the core material 9 of Example 4 was made of pure copper with the same dimensions.

Example 6 As shown in FIG. 7(a), a piece with an outer diameter of 25 m++e, punched from the same aluminum alloy 6063 plate material as in Example 1,
Donut-shaped circle 120 with inner diameter 14III, outer diameter 40ie
l+, a donut-shaped heat sink 21 with an inner diameter of 14- is placed on the side of an aluminum 3003 core material with an aluminum 4 thickness of 50 μm.
0040 Clad bars 22 having a diameter of 14 mm and a length of 16 m were sequentially press-fitted using a jig 39 shown in FIG. 14, and brazed in a vacuum furnace under the same conditions as in Example 1. .

Example 7 As shown in FIG. 7(0), a package mounting plate 11 with a diameter of 25 mm and an outer diameter of 40111I and an inner diameter of 14 m was punched from the same aluminum alloy 6063vi as in Example 1.
A doughnut-shaped heat sink 21 with a diameter of 4011mm, a circular heat sink 13 with a diameter of 4011II, and a powder of aluminum 40040 material glued onto the entire surface of an aluminum 3003 material with a diameter of 13.9 mm and a length of 1G-1 and a paste made with resin as a binder. The bar material 22 coated and dried to a thickness of 50 μm is
Assemble using the jig 39 shown in Figure 4, and press 1 with a 5 kg weight.
1, 13 and 14 were brought into close contact with each other, and brazing was performed in a vacuum furnace under the same conditions as in Example 1.

Example day As shown in FIG. 7 (c), aluminum core material 3003
A donut pear-shaped heat sink 21 with an outer diameter of 40vw and an inner diameter of 14m punched from a plating sheet with a thickness of 1 carbon having aluminum 40040 pieces with a film thickness of 50μ on both sides, and an aluminum bar with a diameter of 14m5. A flanged bar 23 with a total length of 17a+s and a flange 23a with an outer diameter of 25+wm and a thickness of 1, which has been upset-processed and finished by cutting, is assembled into a distance piece 41 using the jig 39 shown in Fig. 14.
It was assembled by omitting the above steps, and brazing was performed in a vacuum furnace under the same conditions as in Example 1. The brazing material on the heat sink 21 is the heat sink 21
It entered the joint interface between the flanged bar 23 and the brazing was in good condition.

Example 9 As shown in Fig. 9(a), an outer diameter of 25 m-1 and an inner diameter of 9.5 mm were punched from an aluminum 1100 plate with a thickness of 1 mm.
A flange 24.mm, and a flange 24 having a neck with an inner diameter of 12.6+*m and a height of 2II@ obtained by burring shown in FIG. 25 and a donut-shaped heat sink 21 punched from the same aluminum plate material with an outer diameter of 40ss+ and an inner diameter of 12.6+wm, and a diameter of 12.2mm with a 50μ thick aluminum 40040 piece on the side of an aluminum 3003 core material. fl+wm, 16mm length clad bar 27
17(a), and brazing was performed in a vacuum furnace under the same conditions as in Example 1.

Example 10 Instead of the cladding bar 27 in Example 9, the 10th
Aluminum 40 with 50μ warm thickness on the side as shown in figure (a)
A 27° clad bar made by integrating an aluminum tube with an outer diameter dz' = 12.6 mm and a pure copper rod 8d with a diameter dn-8 m- was used, and the rest was waxed under the same conditions as in Example 9. I attached it.

Example 11 As shown in FIG. 9(d), aluminum core material 3003
A donut-shaped disk with an outer diameter of 40 mm and an inner diameter of 9.5 Ilm was punched out from a brazing seal with a thickness of 1+u+ having aluminum 40040 pieces with a film thickness of 50 μm on one side of the blank, and the blank was obtained by the burring process shown in Fig. 15. A flange 25.26 having an inner diameter of 12.6 mm and a height of 2 cm with brazing material on the inner surface is attached to an aluminum 11 with a diameter of 25 m5.
Diameter 25mm, thickness 1 made by cutting from 00 dedicated material
Body diameter dz' with flange 28a of mm+ = 1
They were sequentially press-fitted into flanged bars 2B with a total length of 2.6 mm and 16 mm, and brazed under the same conditions as Example 1 in a vacuum furnace using the jig 48 shown in FIG. 17 (a). Ta.

Example 12 As shown in FIG. 9(c), the same necked flange 25 as in Example 11 was press-fitted into an aluminum 1100 bar 27 with a diameter of 12.6 seconds and a length of 165 m, and the same aluminum ram core material was used. A package mounting plate 11 with a diameter of 25III punched from a plating sheet with a thickness of 1 mm and having an aluminum 40040 piece with a film thickness of 50 u+m on one side, and the solder side with the aluminum bar 27
Assemble it toward the end face side as shown in Figure 17 (■),
Brazing was performed in a vacuum furnace under the same conditions as in Example 1.

(Effects of the Invention) As described above, in the IC package/7 cage heat dissipation fin of the present invention, since at least the heat dissipation plate is manufactured by punching a plate material, the thickness and spacing can be freely set, and the heat dissipation area can be freely set. Therefore, it is possible to obtain a heat dissipation fin having a heat dissipation plate with dimensions that are difficult to process using conventional cutting processes. Further, since the heat sink and other members are integrally joined by brazing or the like, heat is smoothly transferred to the heat sink, and the function as a heat sink is extremely good.

[Brief Description of the Drawings] Figures 1 (<) and (0) are a plan view and a sectional view of an IC package, respectively; Figure 2 is a sectional view of a pin grid array type ceramic package; Figure 3 (I) is a sectional view of an IC package; ), (ff) are side views showing a partial cross section of the heat sink; Figure 4 is an explanatory diagram of the mounting form of the heat sink and core material; Figure 5 is an explanatory diagram of how the heat sink is cut out. : FIGS. 6(a) to 6(d) are schematic cross-sectional views of the radiation fins according to the present invention; FIG. 7(a) to (d) are different! ! Figure 8 () and (b) are schematic cross-sectional views of a bar and a flanged bar, respectively; Figures 9 (a) to (d) are A schematic cross-sectional view of a radiation fin according to the present invention of another am; Fig. 1θ (<) and (IT) are schematic cross-sectional views of a bar and a flanged bar, respectively; Fig. 11 ((), (Il+ ) is a schematic cross-sectional view showing the structure of the plate material to which the brazing material is attached as shown in the perspective view: No. 12
The figure is a schematic cross-sectional view illustrating how a heat dissipation fin according to the present invention is brazed using a jig: Figure 13 is a partial cross-sectional view of the side surface of a bar to which brazing material is attached; , a schematic cross-sectional view showing an example of a jig used for brazing the radiation fin according to the present invention; FIG. 15 ((), (I
Fig. 16 is a schematic sectional view of a flange with a neck; Figs. A schematic cross-sectional view showing an example of another jig: and FIGS. 18(A) to 18(C) are schematic explanatory views of brazing and joining. 1: IC chip, 2: Ceramic space, 3: Ceramic cap, 4: Airtight space, 5: Lead, 11: Package mounting part, 12.14 Varnish spacer, 13: Heat sink, 17.19: Core material 15: Fitting part,

Claims (13)

[Claims] (1) A heat dissipation fin for an IC package that is integrated with an attachment part to the IC package, a heat dissipation plate that dissipates heat to the outside, and a heat dissipation plate support part that conducts heat from the IC chip to the heat dissipation plate, the heat dissipation fin comprising: A heat dissipation fin for an IC package, characterized in that a heat dissipation plate and a heat dissipation plate support are integrally joined. (2) A spacer having a smaller area than the heat sink is further provided between the plate-shaped heat sink and the heat sink to set a gap between these heat sinks, and a contact plane between the heat sink and the spacer is integrally joined. The IC according to claim 1, characterized in that the IC comprises:
Heat dissipation fin for packages. (3) A through hole is drilled in the center of the plate-shaped heat sink, and a bar material of the same diameter or a pipe material of the same outer diameter constituting the heat sink support portion is passed through the hole and positioned at a predetermined pitch. 2. The method of manufacturing a heat dissipation fin for an IC package according to claim 1, wherein the inner surface of the through hole of the heat dissipation plate and the outer peripheral surface of the heat dissipation plate support are brazed. (4) Load heat sinks manufactured by burring plate materials and having neck portions with a height approximately equal to the gap between the heat sinks, and fill the through holes formed by the neck portions of the heat sinks stacked one after another. A rod material having the same diameter or a tube material having the same outer diameter constituting the heat sink support portion is passed through the inner diameter portion of the neck portion, and the inner surface of the neck portion and the outer peripheral surface of the heat sink support portion are brazed. A method for manufacturing a heat radiation fin for an IC package according to claim 1. (5) A through hole with the same diameter is provided in the center of all spacers and heat sinks, or except for the heat sink that is farthest from the IC package mounting area, and a core with the same diameter is formed in the through hole to form the heat sink support section. 3. The method of manufacturing a heat dissipation fin for an IC package according to claim 2, wherein the spacer and the heat dissipation plate are sequentially laminated and assembled by penetrating the material and then brazed. (6) Claim 3 characterized in that the heat sink that is farthest from the IC package mounting portion is one without a through hole, and the heat sink and the end face of the bar constituting the heat sink support portion are brazed. Alternatively, the method for manufacturing a heat dissipation fin for an IC package according to 4. (7) The IC according to claim 5, wherein the contact plane between the plate-shaped IC package mounting portion and the spacer is brazed.
A method for manufacturing heat dissipation fins for packages. (8) The heat dissipation fin for an IC package according to any one of claims 3, 4, 5, and 6, characterized in that the end surfaces of the rods constituting the plate-shaped IC package mounting portion and the heat dissipation plate support portion are brazed. manufacturing method. (9) Manufacturing a heat dissipation fin for an IC package according to claim 5, wherein a core material constituting a heat dissipation plate support portion having the same diameter is passed through the through hole of the plate-shaped IC package mounting portion having a through hole. Method. (10) The IC according to claim 3, characterized in that a rod material having the same diameter or a tube material having the same outer diameter that constitutes the heat sink support portion is passed through the through hole of the plate-shaped IC package mounting portion having the through hole. A method for manufacturing heat dissipation fins for packages. (11) A flange with a neck manufactured from a plate material by burring processing is used as the IC package mounting part, and a bar or tube material constituting the heat sink support part is fitted and passed through this neck part, and the inner surface of the neck part and the heat sink support part are fitted and penetrated. 5. The method of manufacturing a heat dissipating fin for an IC package according to claim 4, wherein the outer circumferential surface of the fin is brazed. (12) The method of manufacturing a heat dissipation fin for an IC package according to claim 5, characterized in that a core material having a flange serving as an IC package attachment part is used as a heat dissipation plate support part. (13) The heat dissipation fin for an IC package according to any one of claims 3, 4, and 6, characterized in that a bar or tube material having a flange serving as an IC package attachment part is used as a support part of the heat dissipation plate. Production method.