JPH03138806A - Conductive paste for filling and multi-layer wiring substrate - Google Patents
Conductive paste for filling and multi-layer wiring substrateInfo
- Publication number
- JPH03138806A JPH03138806A JP1276428A JP27642889A JPH03138806A JP H03138806 A JPH03138806 A JP H03138806A JP 1276428 A JP1276428 A JP 1276428A JP 27642889 A JP27642889 A JP 27642889A JP H03138806 A JPH03138806 A JP H03138806A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- filling
- conductor
- weight
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011049 filling Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000000654 additive Substances 0.000 claims abstract description 11
- 239000004014 plasticizer Substances 0.000 claims abstract description 11
- 230000000996 additive effect Effects 0.000 claims abstract description 9
- -1 fatty acid ester Chemical class 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 5
- 239000000194 fatty acid Substances 0.000 claims abstract description 5
- 229930195729 fatty acid Natural products 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 abstract description 12
- 239000007787 solid Substances 0.000 abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011230 binding agent Substances 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 5
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 4
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 4
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 4
- 150000002148 esters Chemical class 0.000 abstract description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 abstract description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 abstract description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005642 Oleic acid Substances 0.000 abstract description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 abstract description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 abstract 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical group CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003349 gelling agent Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241001077660 Molo Species 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
イ０発明の目的
［産業上の利用分野］
本発明は、セラミック多層配線基板用グリーンシートの
ビアホールの充填用導体ペーストおよびこのペーストを
使用して製造したセラミック多層配線基板に関する。Detailed Description of the Invention A. Object of the Invention [Field of Industrial Application] The present invention relates to a conductor paste for filling via holes in a green sheet for a ceramic multilayer wiring board, and a ceramic multilayer wiring board manufactured using this paste. Regarding.
［従来の技術］
セラミック多層配線基板の配線は、セラミックシートを
介して積層された眉間を貫通するビアホール（貫通穴）
を導体ペーストで穴埋めして接続されている。従来この
穴埋用導体ペーストは、固形粉として、平均粒度帆８〜
４μｍのＷ粉末６０重量％（以下重量％は特に指定しな
い限り％という）以上と、必要によりこれとほぼ同じ粒
径のＭＯ粉末５〜２０％や、熱収縮をグリーンシートに
近づけるために、グリーンシートと同じ材料またはそれ
に近い材料を５〜３０％混合している。一方ビヒクルと
して、バインダーは、エチルセルロースやブチラル樹脂
、アクリル樹脂または、その混合系等ル、ブチルカルピ
トールアセテートがあり、これらの固形粉とビヒクルか
らなる混合物を三本ロールでよく混練して導体ペースト
を製造している。[Conventional technology] Wiring on a ceramic multilayer wiring board uses via holes (through holes) that penetrate between the eyebrows of the laminated ceramic sheets.
are connected by filling the holes with conductor paste. Conventionally, this hole-filling conductor paste has been prepared as a solid powder with an average particle size of 8 to 8.
At least 60% by weight of 4μm W powder (hereinafter referred to as % unless otherwise specified), and if necessary, 5 to 20% of MO powder with approximately the same particle size, and green powder to make the heat shrinkage closer to that of green sheet. 5 to 30% of the same material as the sheet or a material close to it is mixed. On the other hand, the binder used as a vehicle is ethyl cellulose, butyral resin, acrylic resin, or a mixture thereof, or butyl carpitol acetate, and a mixture of these solid powders and the vehicle is thoroughly kneaded with three rolls to form a conductor paste. Manufactured.
第２図に、この導体ペースト４をグリーンシート１のビ
アホール２に穴埋めし、乾燥した例を示す。従来、第２
図のようにグリーンシート１のビアホールには通常貫通
穴６がみられた。この貫通穴６の出現を防止するため、
例えば特開昭５６１５９００６号（または特公昭６２−
４３５５９号）には、導体ペーストにジベンジリデンソ
ルビトールを０．０８〜２重量％程度添加して導体ペー
ストをゲル化してかなり改善した例があり、第３図にこ
の例を示した。FIG. 2 shows an example in which the via holes 2 of the green sheet 1 are filled with the conductive paste 4 and dried. Conventionally, second
As shown in the figure, a through hole 6 was usually observed in the via hole of the green sheet 1. In order to prevent the appearance of this through hole 6,
For example, JP-A No. 56159006 (or JP-A No. 62-
No. 43559), there is an example in which dibenzylidene sorbitol was added to the conductor paste in an amount of about 0.08 to 2% by weight to gel the conductor paste, resulting in a considerable improvement, and this example is shown in FIG.
しかし、穴埋め充填率（ビアホールの体積に対する導体
ペーストの穴埋め乾燥後の体積率）は十分ではなかった
。なお第２図、第３図で導体としての固形分のＷ量は基
本的に回置であるが、乾燥、焼成後の充填率の相違は、
ジベンジリデンソルビトールを添加した第３図の方がよ
り多孔買になっていることを示す。実用的には、配線と
して導通がとれていれば問題はないが、充填率が低いと
積層後の焼結の際、ビアホールの非充填空隙の空気膨張
のためフクレが発生し、断線の原因となる。However, the filling ratio (the volume ratio of the conductive paste after filling and drying to the volume of the via hole) was not sufficient. Note that in Figures 2 and 3, the amount of solid W as a conductor is basically the rotation, but the difference in the filling rate after drying and firing is
Figure 3, in which dibenzylidene sorbitol was added, shows that the pores are more porous. In practical terms, there is no problem as long as there is continuity in the wiring, but if the filling rate is low, during sintering after lamination, air expansion in the unfilled voids in the via holes will cause blistering, which can cause wire breakage. Become.
このため穴埋め充填率は９０％以上が好ましいとされて
いる。For this reason, it is said that the hole filling rate is preferably 90% or more.
以上説明した導体ペーストの穴埋めは、スクリーン印刷
法によるものであるが、別法としてビアホールのあいた
グリーンシートを数十枚重ねてペースト溜めから圧力を
かけ、ビアホールの中に、ペーストを圧入する圧入法が
用いられている。この方法によればビアホール内にペー
ストは、十分に充填するので問題はないが設備と工数が
かがる欠点を持っていた。The hole filling with conductor paste described above is done by screen printing, but an alternative method is the press-fitting method, in which dozens of green sheets with via holes are stacked, pressure is applied from a paste reservoir, and the paste is press-fitted into the via holes. is used. According to this method, the via hole is sufficiently filled with paste, so there is no problem, but it has the drawback that it requires more equipment and man-hours.
［発明が解決しようとする課題］
従来のセラミック多層配線基板の層間の配線を接続する
ために設けられた充填導体にクラック、大きなボイド（
スルーホール径２５０〜３００μｍで６０μｍ以上の穴
）を発生せず、充填率９０％以上の充填用導体ペースト
を提供することにある。[Problems to be solved by the invention] Cracks and large voids (
An object of the present invention is to provide a filling conductor paste that does not generate through-holes with diameters of 250 to 300 μm and holes of 60 μm or more and has a filling rate of 90% or more.
口１発明の構成
［発明を解決するための手段］
本発明の第１は、固形粉として導体金属が８５〜９０重
量％で、ビヒクルを加えた合計が１００重量％に、添加
剤として２価または３価のＯＨ基を有する多価アルコー
ル０．１〜５重量％および可塑剤として脂肪酸エステル
０．５〜４重量％を含有させたことを特徴とする充填用
導体ペーストである。第２は、固形粉を導体金属および
セラミック質としたほかは第１の発明と同様である。そ
の第３は、充填用導体ペーストをビアホールに用いて製
造されたことを特徴とするセラミック多層配線基板であ
る。1. Structure of the Invention [Means for Solving the Invention] The first aspect of the present invention is that the conductive metal is 85 to 90% by weight as a solid powder, the total amount including the vehicle is 100% by weight, and the divalent metal is added as an additive. Alternatively, it is a filling conductor paste characterized by containing 0.1 to 5% by weight of a polyhydric alcohol having a trivalent OH group and 0.5 to 4% by weight of a fatty acid ester as a plasticizer. The second invention is the same as the first invention except that the solid powder is made of a conductive metal and a ceramic material. The third type is a ceramic multilayer wiring board characterized in that it is manufactured using filling conductor paste in via holes.
本発明は、導体ペーストをダーリンシートに形成された
ビアホールに注入すると、ペースト中の液相成分が殆ど
グリーンシート壁に吸収され、その流れに乗って固相粒
子も移動し、そのため液相の吸収（移動）速度が速い程
第２図のように収縮が大きく貫通穴ができ易いという知
見に基づき生まれたものである。In the present invention, when conductive paste is injected into the via hole formed in the Darling sheet, most of the liquid phase components in the paste are absorbed by the green sheet wall, and the solid phase particles also move along with the flow, so that the liquid phase is absorbed. This was created based on the knowledge that the faster the (movement) speed is, the greater the contraction is and the easier it is to form a through hole, as shown in Figure 2.
本発明者等は、添加剤としてゲル化剤の研究を進め、−
最北したゲル効果剤と、このゲル化ペーストを実際のス
クリーン印刷可能となるように、見掛けの粘度を柔らか
くする可塑剤を研究しその添加により、ビアホール内の
空間占有率をほぼ９０％以上とすることができた。The present inventors have proceeded with research on gelling agents as additives, and -
By researching the most advanced gel effect agent and a plasticizer that softens the apparent viscosity of this gel paste so that it can be used for actual screen printing, we were able to increase the space occupancy within the via hole to over 90%. We were able to.
本発明の導体ペーストのビヒクルとして、バインダーは
、従来通常使用されている例えば、エチルセルロースま
たはブチラル樹脂、アクリル樹脂等をもしくはこれらの
混合系を１．５〜２．５％、さらに溶剤は、テルピネオ
ール、ブチルカビトールアセテート等を８．５〜１２．
５％含む。As a vehicle for the conductor paste of the present invention, the binder is 1.5 to 2.5% of conventionally used conventional materials such as ethyl cellulose, butyral resin, acrylic resin, etc., or a mixture thereof, and the solvent is terpineol, Butyl cavitol acetate etc. 8.5 to 12.
Contains 5%.
［作用］
本発明は、上述の固形粉、バインダー、溶剤の導体ペー
ストに添加剤として０）１基を有する多価アルコールの
ゲル化の効果を試験したところ第１表の結果を得た。即
ち、２価または３価のアルコールによりゲル化した。ゲ
ル化のし易さは、グリセリン〉エチレングリコール〉ジ
エチレングリコ−ル〉トリエチレングリコールの順であ
った。ゲル化剤の量の最適範囲は、グリセリンの場合０
．１〜１％、エチレングリコールは１〜２％、ジエチレ
ングリコールは１〜３％、トリエチレングリコールは１
〜５％である。なお炭素数の多いものほど、ゲル化に時
間がかかった。何れも０．１％以下の添加は効果はなく
、５％より多い場合効果は変わらないが、ペーストの液
相量が増加するだけで乾燥に時間を要するなど悪影響が
あるので範囲を０．１〜５％とした。ゲル化効果の試験
結果を第１表にまとめて示す。[Function] In the present invention, the results shown in Table 1 were obtained when the gelling effect of a polyhydric alcohol having 0 or 1 group as an additive was tested on the conductive paste of the solid powder, binder, and solvent described above. That is, it was gelled with dihydric or trihydric alcohol. The ease of gelation was in the following order: glycerin>ethylene glycol>diethylene glycol>triethylene glycol. The optimal range for the amount of gelling agent is 0 for glycerin
．． 1-1%, ethylene glycol 1-2%, diethylene glycol 1-3%, triethylene glycol 1
~5%. Note that the larger the number of carbon atoms, the longer it took to gel. In either case, adding less than 0.1% has no effect, and adding more than 5% does not change the effect, but it only increases the amount of liquid phase in the paste, which has negative effects such as taking longer to dry, so the range is set to 0.1%. ~5%. The test results of the gelling effect are summarized in Table 1.
第１表
可塑剤としての脂肪酸エステルのＨＬＢ値（水との親和
度を示す）は、数値が高い程、可塑効果が高（ＨＬＢ値
１０以上が好ましい。これは、１０以下では、疏水性と
なるので効果を十分発揮しないからである。可塑剤は、
ペースト１００％に対し、０．５％以下では、すべり効
果がなく、４％以上では穴の周辺にしみ出してくる欠点
がある。Table 1 HLB value (indicating affinity with water) of fatty acid ester as a plasticizer: The higher the value, the higher the plasticizing effect (HLB value of 10 or more is preferable. This is because plasticizers do not exhibit their full effect.Plasticizers are
With respect to 100% paste, if it is less than 0.5%, there will be no sliding effect, and if it is more than 4%, it will seep out around the holes.
なお、一般に一ペーストの物理特性に粘度は重要な指標
であるが、本発明のゲル化ペーストの場合、Ｂ型粘度計
の測定では回転子や、回転レオメータではペーストとの
接触面ですべりが発生し、測定値の信頼性が得られなか
った。In general, viscosity is an important indicator for the physical properties of a paste, but in the case of the gelled paste of the present invention, slippage occurs at the rotor when measured with a B-type viscometer, and at the contact surface with the paste when measured with a rotational rheometer. However, the reliability of the measured values could not be obtained.
［実施例］
［実施例１１
導体としてＷ粉末９０％、バインダーとしてエチルセル
ロース２％、溶剤としてブチルカルピトールアセテート
８％からなるペーストに、添加剤としてグリセ９２０１
１％添加し、よく練った後、可塑剤としてオレインＩＰ
ＥＧエステルを４％添加して可塑化してホイップ状の導
体ペーストを得た。[Example] [Example 11] Grise 9201 was added as an additive to a paste consisting of 90% W powder as a conductor, 2% ethyl cellulose as a binder, and 8% butylcarpitol acetate as a solvent.
After adding 1% and kneading well, add Olein IP as a plasticizer.
4% of EG ester was added and plasticized to obtain a whip-like conductor paste.
この導体ペーストでスクリーン印刷により高アルミナ質
グーリンシートに印刷したところ第１図のように充填用
導体ペースト３で穴が埋めた。約１６００℃で焼成後も
同じ形状であった。これは、熱収縮によってクラックを
生じないためである。When this conductor paste was printed on a high alumina gurin sheet by screen printing, the holes were filled with the filler conductor paste 3 as shown in FIG. The shape remained the same after firing at about 1600°C. This is to prevent cracks from occurring due to thermal contraction.
［実施例２コ
Ｗ ６０％、ＭｏｌＯ％、アルミナを９２％含有するア
ルミナ質粉２０％にブチラル樹脂２％、テルピネオール
８％からなるペーストに、添加剤としてトリエチレング
リコールを５％添加して練り、３日間ゆっくりとかき混
ぜた後、可塑剤としてオレイン１ｌＰＥＧエステルを０
．５％添加してホイップ状の導体ペーストを得た。穴３
００μｍ、手厚８００μｍのグリーンシートにスクリー
ン印刷したところ、やはり実施例１の結果と同様であっ
た。[Example 2] A paste consisting of 20% alumina powder containing 60% W, molO%, 92% alumina, 2% butyral resin, and 8% terpineol was kneaded with 5% triethylene glycol added as an additive. , after stirring slowly for 3 days, add 0 olein 1l PEG ester as a plasticizer.
．． A whipped conductor paste was obtained by adding 5%. hole 3
When screen printing was performed on a green sheet with a thickness of 0.00 μm and a thickness of 800 μm, the results were similar to those of Example 1.
なお、グーリンシートはアルミナ質からなり、上記の固
形粉の１部に用いたアルミナ９２％含有のアルミナ質は
グーリンシート成分のアルミナ質と同質のものが好まし
く、その他のセラミックスであっても良い。The Gulin sheet is made of alumina, and the alumina containing 92% alumina used as a part of the solid powder is preferably the same as the alumina of the Gulin sheet component, and other ceramics may be used.
［実施例３］
Ａｇ’７９％、Ｐｄ １０％にブチラル樹脂２．５％、
テルピネオール８．５％からなるペーストにエチレング
リコール１．５％およびオレイン酸エステル２％を添加
して導体ペーストを得た。この導体ペーストでスクリー
ン印刷により低温焼成基板のとアホールに印刷したとこ
ろ第１図のように充填用導体と
ペースト３で穴が埋めた。約８７０°Ｃで焼成後も同じ
形状であった。[Example 3] 79% Ag', 10% Pd, 2.5% butyral resin,
A conductor paste was obtained by adding 1.5% ethylene glycol and 2% oleic acid ester to a paste consisting of 8.5% terpineol. When this conductive paste was printed on the holes of the low temperature fired substrate by screen printing, the holes were filled with the filler conductor and paste 3 as shown in FIG. The shape remained the same after firing at approximately 870°C.
本発明の充填用導体ペーストをビアボール充填用ペース
トとして用いた多層配線基板は、ビアホール部の断線は
皆無であった。In the multilayer wiring board using the filling conductive paste of the present invention as the via ball filling paste, there was no disconnection at the via hole portion.
ハ０発明の効果
本発明は、従来セラミック多層配線基板のビアホールの
穴埋め充填率を大幅に向上し、９０％以上の充填率とな
った結果断線は皆無となった。また従来使用されていた
穴埋めのための圧入法や、また数回繰り返していた穴埋
め用つなぎ印刷をする４、図面の説明
第１図は本発明の導体ペーストをビアホール穴埋めした
乾燥状態の断面図である。第２図は、従来のＷの導体ペ
ーストをビアホール穴埋めした乾燥状態の断面図である
。第３図は、添加剤としてジベンジリデンソルビトール
を添加したＷの導体ペーストの乾燥状態の断面図である
。Effects of the Invention The present invention greatly improves the filling rate of via holes in conventional ceramic multilayer wiring boards, and as a result of achieving a filling rate of 90% or more, there are no disconnections. In addition, the conventional press-fitting method for filling the holes and the printing process for filling the holes, which was repeated several times. be. FIG. 2 is a cross-sectional view of a dry state in which via holes are filled with conventional W conductive paste. FIG. 3 is a sectional view of a dry W conductor paste containing dibenzylidene sorbitol as an additive.
１・・・グリーンシート、２・・・ビアホール、３・・
・本発明の充填用導体ペースト、４・・・Ｗ導体ペース
ト、５・・・ジベンジリデンソルビトール添加Ｗ導体ペ
ースト、６・・・貫通穴。1... Green sheet, 2... Beer hall, 3...
- Filling conductor paste of the present invention, 4... W conductor paste, 5... Dibenzylidene sorbitol added W conductor paste, 6... Through hole.
Claims (3)
５〜９０重量％で、ビヒクルを加えた合計が１００重量
％に、添加剤として２価または３価のＯＨ基を有する多
価アルコール０．１〜５重量％および可塑剤として脂肪
酸エステル０．５〜４重量％を含有させたことを特徴と
する充填用導体ペースト。(1) In a ceramic multilayer wiring board, the conductor metal is 8
5 to 90% by weight, for a total of 100% by weight with vehicle, 0.1 to 5% by weight of polyhydric alcohols having divalent or trivalent OH groups as additives and 0.5% of fatty acid esters as plasticizers. A conductor paste for filling characterized by containing ~4% by weight.
０重量％以上で、残部がセラミック質の、合計が８５〜
９０重量％に、ビヒクルを加えた合計が１００重量％に
、添加剤として２価または３価のＯＨ基を有する多価ア
ルコール０．１〜５重量％および可塑剤として脂肪酸エ
ステル０．５〜４重量％を含有させたことを特徴とする
充填用導体ペースト。(2) In a ceramic multilayer wiring board, the conductor metal is 6
0% by weight or more, the remainder is ceramic, the total is 85~
90% by weight, vehicle added to make a total of 100% by weight, 0.1 to 5% by weight of a polyhydric alcohol having a divalent or trivalent OH group as an additive, and 0.5 to 4% of a fatty acid ester as a plasticizer. A conductor paste for filling characterized by containing % by weight.
アホール充填用ペーストとしたことを特徴とするセラミ
ック多層配線基板。(3) A ceramic multilayer wiring board characterized in that the conductor paste for filling according to claim 1 or 2 is used as a paste for filling via holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276428A JPH03138806A (en) | 1989-10-24 | 1989-10-24 | Conductive paste for filling and multi-layer wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1276428A JPH03138806A (en) | 1989-10-24 | 1989-10-24 | Conductive paste for filling and multi-layer wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03138806A true JPH03138806A (en) | 1991-06-13 |
Family
ID=17569277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1276428A Pending JPH03138806A (en) | 1989-10-24 | 1989-10-24 | Conductive paste for filling and multi-layer wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03138806A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03229489A (en) * | 1990-02-02 | 1991-10-11 | Ibiden Co Ltd | Manufacture of ceramic base having through hole |
| JPH05198207A (en) * | 1991-08-13 | 1993-08-06 | E I Du Pont De Nemours & Co | Thick-film paste composition by which screen printing is possible |
| JPH06338214A (en) * | 1993-05-27 | 1994-12-06 | Nec Corp | Conductive paste for ceramic wiring board |
| JPH07188391A (en) * | 1993-11-17 | 1995-07-25 | Internatl Business Mach Corp <Ibm> | Via fill composition and method of filling it |
| JPH07307573A (en) * | 1994-05-13 | 1995-11-21 | Nec Corp | Via structure of multilayered wiring ceramic board and manufacture thereof |
| JP2007053206A (en) * | 2005-08-17 | 2007-03-01 | Tdk Corp | Electronic component and manufacturing method thereof |
| CN106531284A (en) * | 2016-12-22 | 2017-03-22 | 武汉智普天创科技有限公司 | Conductive paste and preparation method thereof |
-
1989
- 1989-10-24 JP JP1276428A patent/JPH03138806A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03229489A (en) * | 1990-02-02 | 1991-10-11 | Ibiden Co Ltd | Manufacture of ceramic base having through hole |
| JPH05198207A (en) * | 1991-08-13 | 1993-08-06 | E I Du Pont De Nemours & Co | Thick-film paste composition by which screen printing is possible |
| JPH06338214A (en) * | 1993-05-27 | 1994-12-06 | Nec Corp | Conductive paste for ceramic wiring board |
| JPH07188391A (en) * | 1993-11-17 | 1995-07-25 | Internatl Business Mach Corp <Ibm> | Via fill composition and method of filling it |
| JPH07307573A (en) * | 1994-05-13 | 1995-11-21 | Nec Corp | Via structure of multilayered wiring ceramic board and manufacture thereof |
| JP2007053206A (en) * | 2005-08-17 | 2007-03-01 | Tdk Corp | Electronic component and manufacturing method thereof |
| CN106531284A (en) * | 2016-12-22 | 2017-03-22 | 武汉智普天创科技有限公司 | Conductive paste and preparation method thereof |
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