JPH0313744U - - Google Patents
Info
- Publication number
- JPH0313744U JPH0313744U JP7447689U JP7447689U JPH0313744U JP H0313744 U JPH0313744 U JP H0313744U JP 7447689 U JP7447689 U JP 7447689U JP 7447689 U JP7447689 U JP 7447689U JP H0313744 U JPH0313744 U JP H0313744U
- Authority
- JP
- Japan
- Prior art keywords
- package
- thermal expansion
- circuit board
- materials
- matching circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7447689U JPH0313744U (zh) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7447689U JPH0313744U (zh) | 1989-06-26 | 1989-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313744U true JPH0313744U (zh) | 1991-02-12 |
Family
ID=31614196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7447689U Pending JPH0313744U (zh) | 1989-06-26 | 1989-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313744U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007062276A (ja) * | 2005-09-01 | 2007-03-15 | Kurabo Ind Ltd | 一体押出成形体および建築用部材 |
-
1989
- 1989-06-26 JP JP7447689U patent/JPH0313744U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007062276A (ja) * | 2005-09-01 | 2007-03-15 | Kurabo Ind Ltd | 一体押出成形体および建築用部材 |
| JP4723956B2 (ja) * | 2005-09-01 | 2011-07-13 | 倉敷紡績株式会社 | 一体押出成形体および建築用部材 |