JPH0313612U - - Google Patents
Info
- Publication number
- JPH0313612U JPH0313612U JP7389489U JP7389489U JPH0313612U JP H0313612 U JPH0313612 U JP H0313612U JP 7389489 U JP7389489 U JP 7389489U JP 7389489 U JP7389489 U JP 7389489U JP H0313612 U JPH0313612 U JP H0313612U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- chip according
- laminated
- laminated chip
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
Landscapes
- Non-Adjustable Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の概要を示す組立図
、第２図は同組立を完了した状態を示す斜視図、
第３図は本考案の他の実施例の概要を示す組立図
、第４図は同組立を完了した状態を示す斜視図、
第５図乃至第７図は夫々従来例の説明図である。
１……絶縁ケース、２……絶縁ケース、３……
本体、４……絶縁板、１１……溝、１２……ハン
ダ付電極、３２……電極。
Fig. 1 is an assembly diagram showing an outline of an embodiment of the present invention, Fig. 2 is a perspective view showing a state in which the same assembly is completed,
FIG. 3 is an assembly diagram showing an outline of another embodiment of the present invention, and FIG. 4 is a perspective view showing a state in which the same assembly is completed.
5 to 7 are explanatory diagrams of conventional examples, respectively. 1...Insulation case, 2...Insulation case, 3...
Main body, 4... Insulating plate, 11... Groove, 12... Soldered electrode, 32... Electrode.
Claims (1)
極を有する本体と、平板状の絶縁板とから成り、
前記夫々の絶縁ケースの一平面に一側面から他側
面まで溝を形成し、同溝に対応する前記本体を同
溝に収容すると共に、前記絶縁板を介して同溝が
対向するように前記夫々の絶縁ケースを積層固着
し、前記電極と接続するハンダ付電極を前記夫々
の絶縁ケースおよび前記絶縁板の側面に形成した
ことを特徴とする積層チツプの構造。 (2) 前記積層チツプの前記本体が互いに交差し
ていることを特徴とする請求項(1)記載の積層チ
ツプの構造。 (3) 前記本体にジヤンパー用の導体を形成した
ことを特徴とする請求項(1)記載の積層チツプの
構造。 (4) 前記本体に抵抗を形成したことを特徴とす
る請求項(1)記載の積層チツプの構造。 (5) 前記本体にコンデンサを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。 (6) 前記本体にインダクタを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。 (7) 前記本体にダイオードを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。[Claims for Utility Model Registration] (1) Consisting of a plurality of substantially flat insulating cases, a main body having electrodes at both ends, and a flat insulating plate,
A groove is formed in one plane of each of the insulating cases from one side to the other side, and the main body corresponding to the groove is accommodated in the groove, and the grooves are arranged to face each other with the insulating plate interposed therebetween. 1. A structure of a laminated chip, characterized in that insulating cases are laminated and fixed, and soldered electrodes to be connected to the electrodes are formed on the side surfaces of each of the insulating cases and the insulating plate. (2) The structure of the laminated chip according to claim (1), wherein the bodies of the laminated chips intersect with each other. (3) The structure of the laminated chip according to claim (1), wherein a conductor for a jumper is formed on the main body. (4) The structure of the laminated chip according to claim (1), characterized in that a resistor is formed in the main body. (5) The structure of the multilayer chip according to claim (1), wherein a capacitor is formed in the main body. (6) The structure of the laminated chip according to claim (1), characterized in that an inductor is formed in the main body. (7) The structure of the laminated chip according to claim (1), characterized in that a diode is formed in the main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7389489U JPH0313612U (en) | 1989-06-23 | 1989-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7389489U JPH0313612U (en) | 1989-06-23 | 1989-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313612U true JPH0313612U (en) | 1991-02-12 |
Family
ID=31613105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7389489U Pending JPH0313612U (en) | 1989-06-23 | 1989-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313612U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5391968U (en) * | 1976-12-25 | 1978-07-27 |
-
1989
- 1989-06-23 JP JP7389489U patent/JPH0313612U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5391968U (en) * | 1976-12-25 | 1978-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0313612U (en) | ||
| JPS5849430U (en) | Chip-shaped composite electronic components | |
| JPH01156502U (en) | ||
| JPH0471257U (en) | ||
| JPS61134115U (en) | ||
| JPS6134730U (en) | multilayer composite capacitor | |
| JPS6210434U (en) | ||
| JPS59119030U (en) | Chip type electronic components | |
| JPS60176536U (en) | multilayer capacitor | |
| JPS58182401U (en) | composite chip parts | |
| JPS60167328U (en) | electric double layer capacitor | |
| JPS59159939U (en) | chip capacitor | |
| JPS6438016U (en) | ||
| JPS59189229U (en) | Assembly of chip parts | |
| JPS6355506U (en) | ||
| JPS59135627U (en) | composite chip capacitor | |
| JPS58150825U (en) | Chip-shaped composite parts | |
| JPS61197675U (en) | ||
| JPS5974724U (en) | Chip type LC composite parts | |
| JPS6258877U (en) | ||
| JPS59131139U (en) | multilayer chip capacitor | |
| JPH0388375U (en) | ||
| JPH01165603U (en) | ||
| JPS6151723U (en) | ||
| JPS62104403U (en) |