JPH0313612U - - Google Patents

Info

Publication number
JPH0313612U
JPH0313612U JP7389489U JP7389489U JPH0313612U JP H0313612 U JPH0313612 U JP H0313612U JP 7389489 U JP7389489 U JP 7389489U JP 7389489 U JP7389489 U JP 7389489U JP H0313612 U JPH0313612 U JP H0313612U
Authority
JP
Japan
Prior art keywords
main body
chip according
laminated
laminated chip
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7389489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7389489U priority Critical patent/JPH0313612U/ja
Publication of JPH0313612U publication Critical patent/JPH0313612U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Adjustable Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の概要を示す組立図
、第2図は同組立を完了した状態を示す斜視図、
第3図は本考案の他の実施例の概要を示す組立図
、第4図は同組立を完了した状態を示す斜視図、
第5図乃至第7図は夫々従来例の説明図である。 1……絶縁ケース、2……絶縁ケース、3……
本体、4……絶縁板、11……溝、12……ハン
ダ付電極、32……電極。
Fig. 1 is an assembly diagram showing an outline of an embodiment of the present invention, Fig. 2 is a perspective view showing a state in which the same assembly is completed,
FIG. 3 is an assembly diagram showing an outline of another embodiment of the present invention, and FIG. 4 is a perspective view showing a state in which the same assembly is completed.
5 to 7 are explanatory diagrams of conventional examples, respectively. 1...Insulation case, 2...Insulation case, 3...
Main body, 4... Insulating plate, 11... Groove, 12... Soldered electrode, 32... Electrode.

Claims (1)

【実用新案登録請求の範囲】 (1) 略平板状の複数の絶縁ケースと、両端に電
極を有する本体と、平板状の絶縁板とから成り、
前記夫々の絶縁ケースの一平面に一側面から他側
面まで溝を形成し、同溝に対応する前記本体を同
溝に収容すると共に、前記絶縁板を介して同溝が
対向するように前記夫々の絶縁ケースを積層固着
し、前記電極と接続するハンダ付電極を前記夫々
の絶縁ケースおよび前記絶縁板の側面に形成した
ことを特徴とする積層チツプの構造。 (2) 前記積層チツプの前記本体が互いに交差し
ていることを特徴とする請求項(1)記載の積層チ
ツプの構造。 (3) 前記本体にジヤンパー用の導体を形成した
ことを特徴とする請求項(1)記載の積層チツプの
構造。 (4) 前記本体に抵抗を形成したことを特徴とす
る請求項(1)記載の積層チツプの構造。 (5) 前記本体にコンデンサを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。 (6) 前記本体にインダクタを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。 (7) 前記本体にダイオードを形成したことを特
徴とする請求項(1)記載の積層チツプの構造。
[Claims for Utility Model Registration] (1) Consisting of a plurality of substantially flat insulating cases, a main body having electrodes at both ends, and a flat insulating plate,
A groove is formed in one plane of each of the insulating cases from one side to the other side, and the main body corresponding to the groove is accommodated in the groove, and the grooves are arranged to face each other with the insulating plate interposed therebetween. 1. A structure of a laminated chip, characterized in that insulating cases are laminated and fixed, and soldered electrodes to be connected to the electrodes are formed on the side surfaces of each of the insulating cases and the insulating plate. (2) The structure of the laminated chip according to claim (1), wherein the bodies of the laminated chips intersect with each other. (3) The structure of the laminated chip according to claim (1), wherein a conductor for a jumper is formed on the main body. (4) The structure of the laminated chip according to claim (1), characterized in that a resistor is formed in the main body. (5) The structure of the multilayer chip according to claim (1), wherein a capacitor is formed in the main body. (6) The structure of the laminated chip according to claim (1), characterized in that an inductor is formed in the main body. (7) The structure of the laminated chip according to claim (1), characterized in that a diode is formed in the main body.
JP7389489U 1989-06-23 1989-06-23 Pending JPH0313612U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7389489U JPH0313612U (en) 1989-06-23 1989-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7389489U JPH0313612U (en) 1989-06-23 1989-06-23

Publications (1)

Publication Number Publication Date
JPH0313612U true JPH0313612U (en) 1991-02-12

Family

ID=31613105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7389489U Pending JPH0313612U (en) 1989-06-23 1989-06-23

Country Status (1)

Country Link
JP (1) JPH0313612U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391968U (en) * 1976-12-25 1978-07-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391968U (en) * 1976-12-25 1978-07-27

Similar Documents

Publication Publication Date Title
JPH0245620U (en)
JPH0313612U (en)
JPS6083234U (en) multilayer capacitor
JPS5849430U (en) Chip-shaped composite electronic components
JPH01156502U (en)
JPS61134115U (en)
JPS619918U (en) π type filter
JPS6134730U (en) multilayer composite capacitor
JPS6210434U (en)
JPS59119030U (en) Chip type electronic components
JPS58182401U (en) composite chip parts
JPS60167328U (en) electric double layer capacitor
JPS59159939U (en) chip capacitor
JPS59189229U (en) Assembly of chip parts
JPS6355506U (en)
JPS59135627U (en) composite chip capacitor
JPS58150825U (en) Chip-shaped composite parts
JPS61197675U (en)
JPS5974724U (en) Chip type LC composite parts
JPS6258877U (en)
JPS59131139U (en) multilayer chip capacitor
JPH0388375U (en)
JPH01165603U (en)
JPS6151723U (en)
JPS62104403U (en)