JPH03132047A - High frequency heater for semiconductor device sealing - Google Patents

Abstract

PURPOSE:To elevate the work efficiency of the installation and taking-out of a columnar synthetic resin substance for sealing by providing a high frequency electrode for heating in opposition to the side of the synthetic resin substance. CONSTITUTION:A columnar synthetic resin substance 2 is placed on a table 3, and high frequency voltage is applied from a high frequency power source 7 to high frequency electrodes 6a and 6b being arranged, respectively, on right and left sides of the resin substance 2. When a supporting shaft 5 is rotated to rotate the table 3 and high frequency is applied to the electrodes 6a and 6b, high frequency power 8 flows through the resin substance 2 between the electrodes 6a and 6b, and heats the resin substance 2 quickly.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a semiconductor device that is used in the manufacturing process of a resin-sealed semiconductor device and is applicable to a heating device that preheats a synthetic resin body for sealing. This invention relates to a high frequency heating device for resin sealing.

(Prior Art) Conventionally, in a resin-to-IF type semiconductor device, a semiconductor element is mounted at a predetermined position on a metal lead frame, and the semiconductor element and the lead frame are electrically connected using a thin Au wire by wire bonding. After connection, resin sealing is performed using epoxy resin, and the outer shape is formed.

For one resin pair, set the wire-bonded lead frames in a pair of upper and lower molds heated to a temperature of 175°C, and place a synthetic resin body for sealing in a pot provided in the sealing mold. This is done by pressurizing the mold with a plunger to forcefully feed the resin into a cavity provided in the mold, and then pressurizing and heating the resin. The synthetic resin body is generally preheated by high-frequency heating means before being put into the pot for the purpose of shortening molding time and improving molding quality.

FIG. 3 is a diagram showing a conventional high-frequency heating device for breheating, in which 11 is a cylindrical synthetic resin body, 12a,
12b is a pair of rotatable roller electrodes whose surfaces are coated with resin and arranged in parallel; 13 is a roller electrode 12a;
, 12b is an upper electrode made of a metal plate arranged above the roller electrodes 12a, 12b and the upper electrode 1.
This is a high frequency power supply that applies a high frequency voltage of about 70M[(z) between the

In the figure, a synthetic resin body 11 of the object to be heated is placed between roller electrodes 12a and 12b, and one roller electrode 12 is placed between roller electrodes 12a and 12b.
When a is rotated in the direction of the arrow 15 and a high frequency voltage is applied, a high frequency current 16 flows as shown by the broken line, and the synthetic resin body 1
1 is uniformly heated while rotating in the direction of arrow 17 according to the rotation of roller electrode 12a.

(Problems to be Solved by the Invention) In the conventional device described above, in order to place the cylindrical synthetic resin body 11 on the roller electrodes 12a, 12b in a sideways state, the synthetic resin body 11 is placed on the roller electrodes 12a, 12b.
The handling is complicated when placing the synthetic resin body 11 on the mold and when taking out the synthetic resin body 11 after heating is completed. It is necessary to stand the resin body 11 vertically, which poses a problem of complicating the operation of putting the synthetic resin body 11 into the pot.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency heating device for resin-sealing a semiconductor device, which improves the workability of installing and removing a columnar synthetic resin body for sealing.

(Means for Solving the Problems) In order to achieve the above object [1], the present invention provides a high-frequency heating device for a semiconductor device resin pair 11- that heats a synthetic resin for resin-sealing the outside of a semiconductor element. A column-shaped synthetic resin body for sealing is placed on a rotatable mounting table so that its elongated direction is upright, and a high-frequency electrode for heating is provided facing the side of the synthetic resin body for sealing. It is characterized by:

(Function) By adopting the above method, the columnar synthetic resin body for sealing can be heated uniformly with the high frequency electrode while the longitudinal direction is upright on the mounting table, and the synthetic resin body can be heated evenly on the mounting table. And, since the synthetic resin body can be taken out in an upright state, it can be easily taken out.

(Example) An embodiment of the present invention will be described above based on the drawings.

FIG. 1 is a cross-sectional view showing an embodiment of a high-frequency heating device for resin-sealing a semiconductor device according to the present invention, and FIG. 2 is a cross-sectional view showing the state of the embodiment shown in FIG. 1 before being set. 2 is a column-shaped synthetic resin body for sealing, 3 is a mounting table that is rotatable and movable up and down with respect to the integrated unit 1, and 4 is a support shaft 5 of the mounting table 3.
Flanges 6a and 6b are provided in the unit 1, and numeral 7 is a high-frequency power source for heating, which is placed facing each other inside the unit 1.

In FIGS. 1 and 2, a columnar synthetic resin body 2 is placed 1α on a mounting table 3 so that its longitudinal direction is upright.

A high-frequency voltage is applied from a high-frequency power source 7 to high-frequency electrodes 6a and 6b arranged on the left and right sides of the synthetic resin body 2, respectively, and the mounting table 3 is made of a material with extremely low high-frequency loss. It is formed of.

Further, the mounting table 3 moves up and down and rotates with the up and down movement and rotation of the support shaft 5, and the flange 4 moves up and down with the up and down movement of the support shaft 5, and the rotation is caused by the up and down movement of the support shaft 5. The unit 1 is made of a metal material that prevents leakage of high frequency waves.

In FIG. 2, the synthetic resin body 2 placed upright on the mounting table 3 is moved to the set position in FIG. 1 by raising the support shaft 5.
That is, it is located approximately at the center between the high frequency electrodes 6a and 6b. As the support shaft 5 rises, the flange 4 also rises, and touches the bottom of the integral part 1 at the final end of its upward movement, which together with the integral part 1 prevents high frequency leakage! Performs the action of hi.

In FIG. 1, by rotating the support shaft 5, the mounting table 3 is
Then, a high frequency is applied from a high frequency power source 7 between the high frequency electrodes 6a and 6b. The high frequency current 8 flows through the synthetic resin body 2 between the high frequency electrodes 6a and 6b as shown by the broken line, and rapidly heats the synthetic resin body 2.

By a timer (not shown) or an infrared temperature controller,
When the synthetic resin body 2 is heated to a predetermined temperature and softened, the supply of the high frequency voltage is stopped, and the rotation of the support shaft 5 is stopped and lowered, resulting in the state before setting as shown in FIG. 2.

As mentioned above, in this embodiment, the synthetic resin body 2 can be placed on and taken out from the mounting table 3 with its longitudinal direction upright, which improves workability. When inserting the synthetic resin body 2 into the provided pot,
There is no need to change the direction of the resin sealing process, making it easy to automate the resin sealing process.

Note that the mounting table 3 may be provided in a suspended state with respect to the unit 1.

(Effects of the Invention) According to the present invention, the columnar synthetic resin body for sealing can be installed and taken out with its longitudinal direction upright with respect to the mounting table, and workability can be improved. It is possible to provide a high-frequency heating device for semiconductor device resin-to-soil.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an embodiment of the high-frequency heating device for semiconductor device resin and soil according to the present invention, FIG. 2 is a cross-sectional view showing the state of the embodiment shown in FIG. 1 before setting, and FIG. FIG. 2 is a configuration diagram showing a conventional high-frequency heating device. 1... Integral, 2... Synthetic resin body,... Mounting table, 4... Flange, 5 Support shaft, 6a, 6b
... High frequency electrode, ... Product frequency '6i source.

Claims (2)

[Claims] (1) In a high-frequency heating device for resin-sealing a semiconductor device that heats a synthetic resin for resin-sealing the outside of a semiconductor element,
A column-shaped synthetic resin body for sealing is placed on a rotatable mounting table so that its longitudinal direction is upright, and a high-frequency electrode for heating is provided opposite to the side of the synthetic resin body for sealing. A high-frequency heating device for resin-sealing semiconductor devices, characterized in that: (2) The high-frequency heating device for resin-sealing a semiconductor device according to claim (1), wherein the mounting table is movable up and down.