JPH03130960U - - Google Patents
Info
- Publication number
- JPH03130960U JPH03130960U JP4020190U JP4020190U JPH03130960U JP H03130960 U JPH03130960 U JP H03130960U JP 4020190 U JP4020190 U JP 4020190U JP 4020190 U JP4020190 U JP 4020190U JP H03130960 U JPH03130960 U JP H03130960U
- Authority
- JP
- Japan
- Prior art keywords
- bellows
- layers
- outside
- cloth
- flexible joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004744 fabric Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 3
- 229920000271 Kevlar® Polymers 0.000 claims description 2
- 239000010425 asbestos Substances 0.000 claims description 2
- 239000004761 kevlar Substances 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Gasket Seals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990040201U JP2531469Y2 (ja) | 1990-04-17 | 1990-04-17 | 高温、高圧用フレキシブルジヨイント |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990040201U JP2531469Y2 (ja) | 1990-04-17 | 1990-04-17 | 高温、高圧用フレキシブルジヨイント |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03130960U true JPH03130960U (US20100223739A1-20100909-C00005.png) | 1991-12-27 |
JP2531469Y2 JP2531469Y2 (ja) | 1997-04-02 |
Family
ID=31549785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990040201U Expired - Fee Related JP2531469Y2 (ja) | 1990-04-17 | 1990-04-17 | 高温、高圧用フレキシブルジヨイント |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2531469Y2 (US20100223739A1-20100909-C00005.png) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5810840A (ja) * | 1981-07-10 | 1983-01-21 | Fujitsu Ltd | 半導体装置 |
JPS59175755A (ja) * | 1983-03-25 | 1984-10-04 | Ibiden Co Ltd | ワイヤボンデイングに適した表面を有するプリント配線基板の製造方法 |
JPS63315229A (ja) * | 1987-12-28 | 1988-12-22 | シュレイナー ルシュトバート グロエプ ビー ブイ | 熱可塑性サンドウィッチ構造体およびサンドウィッチ構造体の製造方法 |
JPS6425565U (US20100223739A1-20100909-C00005.png) * | 1987-08-05 | 1989-02-13 | ||
JPH01130418A (ja) * | 1987-11-16 | 1989-05-23 | Toshiba Corp | 超電導導体 |
-
1990
- 1990-04-17 JP JP1990040201U patent/JP2531469Y2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5810840A (ja) * | 1981-07-10 | 1983-01-21 | Fujitsu Ltd | 半導体装置 |
JPS59175755A (ja) * | 1983-03-25 | 1984-10-04 | Ibiden Co Ltd | ワイヤボンデイングに適した表面を有するプリント配線基板の製造方法 |
JPS6425565U (US20100223739A1-20100909-C00005.png) * | 1987-08-05 | 1989-02-13 | ||
JPH01130418A (ja) * | 1987-11-16 | 1989-05-23 | Toshiba Corp | 超電導導体 |
JPS63315229A (ja) * | 1987-12-28 | 1988-12-22 | シュレイナー ルシュトバート グロエプ ビー ブイ | 熱可塑性サンドウィッチ構造体およびサンドウィッチ構造体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2531469Y2 (ja) | 1997-04-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |