JPH0312795B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor integrated circuits (hereinafter referred to as IC).
The present invention relates to a transfer device in which a plurality of types of stakes can be selectively attached to a stake mounting table on which stakes are attached.

[Prior art]

Generally, in the IC manufacturing process, the IC is stored in the process stake 1a as shown in Figure 4 and transported within the process, so when shipping the IC, it is necessary to It is necessary to transfer the IC to shipping stake 1b.

An example of a conventional IC transfer device is shown in FIG.
This device installs a process stake 1a and a shipping stake 1b on stake mounting bases 2, 2, respectively, tilts one stake mounting base 2a to maintain the process stake 1a in an inclined position, and tilts the shipping stake 1b. Stakes 1 for posture process
The IC is placed on the extension of a and the IC is slid between the two to transfer the IC. Normally, multiple stakes are installed side by side on each stake mounting table, and ICs are transferred between the multiple stakes at the same time, so it is necessary to maintain a constant pitch interval between adjacent stakes. Therefore, recesses are provided at the front and rear ends of the stake mounting base, and the stakes are received in the recesses to regulate the lateral position and maintain a constant pitch interval.

Incidentally, recently, a wide variety of ICs have been manufactured, and there are also a wide variety of stakes for storing these ICs, and each stake has different external dimensions at both ends. Therefore, the recess provided in the stake mounting base cannot be used in common, and a dedicated stake mounting base must be manufactured for each stake. transfer equipment is required.

[Purpose of the invention]

The present invention solves the above-mentioned problems by providing an IC transfer device that allows a variety of types of stakes to be mounted on a single stake mounting stand.

[Structure of the invention]

In order to achieve the above object, a semiconductor integrated circuit transfer device according to the present invention has a stake mounting base and transfers a semiconductor integrated circuit between a process stake and a shipping stake. The stake mounting stand consists of a set of a mounting stand that supports two or more process stakes in parallel and a mounting stand that supports two or more shipping stakes in parallel,
Due to the tilted posture of both mounting tables facing each other,
The semiconductor integrated circuit is slid from the inside of one stake and transferred to the other stake, and each mounting base is equipped with a pair of polygonal shafts, and the polygonal shafts are rotatable and Each side has a support part such as a recess that accepts different types of stakes with different external shapes and dimensions and arranges them at a constant pitch. , the stake is supported by straddling support parts of the same shape formed on the pair of shafts.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

In the present invention, a pair of polygonal shafts 3 and 4 shown in FIG. 1 are assembled to mounting bases 2 and 2 shown in FIG. 5, respectively. Each polygonal surface of the polygonal shafts 3 and 4 serves as a support surface for the stakes 1 (1a, 1b), and when assembling them to each mounting base 2, the rotation axis should be aligned with the longitudinal axis of the mounting base 2. It is perpendicular to the direction, and is pivoted at the front and rear ends of the mounting base 2, so as to be supported across both shafts 3 and 4. Both shafts 3 and 4 are
The shafts 3 are linked to rotate synchronously by a coupling device 5 using gears or other transmission mechanisms, and when a handle 7 provided on one shaft 4 is rotated, the shaft 3 is driven by the shaft 4 to rotate. It's getting old. Concave portions are formed in each polygonal surface of the shafts 3, 4 as supporting portions 6a, 6b, . . . for receiving two or more stakes 1 in parallel.

These recesses are formed in the shape of a groove with a constant pitch, but the size and size are different for each side of the shafts 3 and 4.
Different types of stick support portions 6a, 6b, . . . are formed in different shapes and have different external shapes and width dimensions on each side. The cross section of each shaft 3, 4 is as shown in FIG.
It has an n-gon shape in accordance with the type n of
b and 6c, but the present invention is not limited thereto. The components in this embodiment are made of conductive material, such as metal or conductive plastic. Further, in the embodiment, the stake support portion is formed of a recess, but it may be formed of something other than the recess.

In the present invention, by operating the handle 7, both shafts 3 and 4 are rotated clockwise or counterclockwise in synchronization, a stake support portion that matches the shape of the stake to be installed is selected, and the support portion 6 is rotated in synchronization with the handle 7.
Convert a to an upward position. Then, both ends of the stake 1 are fitted into the recesses forming the support portion 6a to regulate the position in the lateral direction so that the stake 1 is supported by the shafts 3 and 4 while maintaining a constant pitch interval.

The above operation is performed each time the shape of the stake to be installed differs, and the stake support portion provided on the circumferential surface of the shaft is selected to support various types of stakes by two shafts.

In addition, in order to increase the types of stakes that can be supported, a plurality of sets of shafts 3 and 4 with different stake support parts are prepared, and an appropriate shaft is selected from among them and transferred to the stake mounting base 2 of the transfer device. It may also be installed so that it can be replaced.

〔Effect of the invention〕

As explained above, the present invention provides different types of stake support parts on the circumferential surface of the polygonal shaft.
By switching and using the supporting parts, one stake mounting table can support various types of stakes, and the work of transferring ICs from various types of stakes can be performed by one transfer device. Moreover, there is no need to provide a dedicated stake mounting base for each stake as in the prior art, and the installation space for the device can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing one embodiment of the present invention, and FIG.
Figure 3 is a side view of the shaft, Figure 3 is a plan view of the shaft viewed diagonally from above, Figure 4 is a perspective view showing an example of the stay, and Figure 5 is an example of a conventional semiconductor integrated circuit transfer device. FIG. 1...stacks, 34...shafts, 6a, 6
b, 6c, ... stake support portion (recessed portion).

Claims (1)

[Scope of Claims] 1. A semiconductor integrated circuit transfer device that has a stake mounting base and transfers a semiconductor integrated circuit between a process stake and a shipping stake, wherein the stake mounting base has two or more It consists of a mounting stand that supports process stakes in parallel and a mounting stand that supports two or more shipping stakes in parallel.
Due to the tilted posture of both mounting tables facing each other,
The semiconductor integrated circuit is slid from the inside of one stake and transferred to the other stake, and each mounting base is equipped with a pair of polygonal shafts, and the polygonal shafts are rotatable and Each side has a support part such as a recess that accepts different types of stakes with different external shapes and dimensions and arranges them at a constant pitch. 1. A semiconductor integrated circuit transfer device, characterized in that a stake is supported astride support portions of the same shape formed on a pair of shafts.