JPH03126913A - Separation of joined substrate and separation of liquid crystal display device - Google Patents
Separation of joined substrate and separation of liquid crystal display deviceInfo
- Publication number
- JPH03126913A JPH03126913A JP1267036A JP26703689A JPH03126913A JP H03126913 A JPH03126913 A JP H03126913A JP 1267036 A JP1267036 A JP 1267036A JP 26703689 A JP26703689 A JP 26703689A JP H03126913 A JPH03126913 A JP H03126913A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrates
- adhesive
- liquid crystal
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 135
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 30
- 238000000926 separation method Methods 0.000 title description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 25
- 238000005304 joining Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 abstract description 10
- 239000011521 glass Substances 0.000 abstract description 6
- 230000008929 regeneration Effects 0.000 abstract description 3
- 238000011069 regeneration method Methods 0.000 abstract description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 229910003437 indium oxide Inorganic materials 0.000 abstract 1
- 230000001172 regenerating effect Effects 0.000 abstract 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 1
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000011109 contamination Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は基板に形成された配線等にダメージを与えるこ
となく接合基板を分離する方法に関し、特に液晶表示装
置の分離方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for separating bonded substrates without damaging wiring formed on the substrate, and particularly to a method for separating a liquid crystal display device.
この明細書においては接合基板の例として液晶表示装置
の場合について説明する。In this specification, a liquid crystal display device will be described as an example of a bonded substrate.
第４図は液晶平面表示装置の全体構造を示す斜視図、第
５図はその断面構造を示すもので第４図における■−Ｖ
線断面図である。図において、（１）は透明ガラス基板
から成る対向基板、（２）は透明ガラス基板から成る主
基板、（３）は対向基板上に形成された配線、（４）は
主基板上に形成された配線、（５）は対向基板を主基板
を接合するための高分子材料から成る接着剤であり、こ
の場合には、エポキシ系接着剤が使用される。（６）は
対向基板と主基板の間隔を保持するための保持材であり
、この場合には、間隔は５μｍとしている。（７）は液
晶である。Fig. 4 is a perspective view showing the overall structure of the liquid crystal flat display device, and Fig. 5 shows its cross-sectional structure.
FIG. In the figure, (1) is a counter substrate made of a transparent glass substrate, (2) is a main substrate made of a transparent glass substrate, (3) is a wiring formed on the counter substrate, and (4) is a wiring formed on the main substrate. The wiring (5) is an adhesive made of a polymeric material for bonding the opposing substrate to the main substrate, and in this case, an epoxy adhesive is used. (6) is a holding material for maintaining the distance between the counter substrate and the main substrate, and in this case, the distance is 5 μm. (7) is a liquid crystal.
配線＋３１．（４１に適当な信号を印加することにより
、液晶を駆動する。基板＋１１． （２＋の光の透過量
を制御して表示装置とする。液晶の駆動方式には大別す
ると、単純マトリクス方式とアクティブマトリクス方式
がある。近年は、各画素を個別に駆動する薄膜トランジ
スタを有するアクティブマトリクス方式が主流を占めつ
つある。液晶の駆動方式により、配線ｆ３１． （４）
の構造を異なるが、本発明に関しては、その汎用性を考
慮すると、重要な要因ではなく、図中配線＋３１．＋４
１は単純化した構造として表記しである。Wiring +31. (The liquid crystal is driven by applying an appropriate signal to the substrate +11. The display device is created by controlling the amount of light transmitted through the substrate +11. There is an active matrix method.In recent years, the active matrix method, which has thin film transistors that drive each pixel individually, has become mainstream.Due to the liquid crystal drive method, wiring f31. (4)
However, considering the versatility of the present invention, it is not an important factor, and the wiring +31. +4
1 is expressed as a simplified structure.
この液晶平面表示装置の製造工程は、対向基板と主基板
上に配線を形成する工程と、対向基板と主基板を接着材
で組み立て、対向基板と主基板の間に設けたれた空隙に
液晶を注入する工程いわゆる後工程に大別される。液晶
平面表示装置の表示欠陥は、配線の電気的開閉や前述し
た薄膜トランジスタの特性不良の他、対向基板と主基板
の空隙に混入した異物も表示欠陥の原因となる。液晶駆
動の高速性や、高表示性を達成する目的で近年、この間
隔は益々減少する方向にあり、場合によっては、数μｍ
の異物の混入によっても表示欠陥となる。このため、後
工程を実施する製造環境には高い清浄性が要求されるが
、環境下にある数μｍ以下の異物の制御は技術的に困難
であるばかりか、後工程の中には、切断等の機械加工を
含むので、異物混入の頻度の減少にはおのずと限界があ
る。The manufacturing process for this liquid crystal flat display device includes the steps of forming wiring on the counter substrate and the main substrate, assembling the counter substrate and the main substrate with adhesive, and inserting the liquid crystal into the gap provided between the counter substrate and the main substrate. The injection process is broadly divided into so-called post-processes. Display defects in liquid crystal flat display devices are caused not only by electrical switching of wiring and by poor characteristics of thin film transistors described above, but also by foreign matter that has entered the gap between the opposing substrate and the main substrate. In recent years, in order to achieve high-speed liquid crystal drive and high display performance, this distance has been decreasing more and more, and in some cases, it has become smaller than several micrometers.
Inclusion of foreign matter may also cause display defects. For this reason, a high degree of cleanliness is required for the manufacturing environment in which the post-process is carried out, but not only is it technically difficult to control foreign particles of several micrometers or less in the environment, but some of the post-processes include cutting. There are naturally limits to reducing the frequency of foreign matter contamination.
言い換えると、後工程の製造歩留が液晶表示装置として
の製造歩留に大きく影響を及ぼしつつある。In other words, the manufacturing yield of post-processes is starting to have a large effect on the manufacturing yield of liquid crystal display devices.
製造歩留の向上の一方策として、異物の混入の頻度を減
少させる工程の確率もさることながら、不良品を再生す
る技ｆ＋ｉも極めて重要である。ところが液晶は接＠剤
により封入された状態であるから、後工程終了後に異物
を除去することはできない。さらに、微細な異物の混入
による表示欠陥は、後工程以前に検査５発見されること
は極めて困難であり、後工程終了後、すなわち、表示可
能な状態になって、はしめて発見される。従来、この接
合された基板を分離する方法としては、慣用的には、基
板の切断等の機械加工によるものと、化学薬品中に暴露
して、高分子接着剤を化学的に脆弱化するか、あるいは
除去する方法が考えられていた。ところが、両者とも基
板上に形成された配線等のダメージや、ひいては基板そ
のもののダメージを伴うので、分Ｍ後に再び組立て、表
示装置としても、表示の不具合を生じたり、組立てその
ものが不可能であった１以上のように慣用的な従来の方
法では分離、再生が不可能であるため、分離再生を実施
した従来例はなく、異物混入等による欠陥品は、廃棄し
ているのが現状である。As one measure to improve manufacturing yield, it is extremely important to not only reduce the probability of a process that reduces the frequency of contamination by foreign substances, but also to recycle defective products (f+i). However, since the liquid crystal is sealed with an adhesive, foreign matter cannot be removed after the post-process is completed. Furthermore, it is extremely difficult to detect display defects due to the inclusion of minute foreign matter in the inspection 5 before the post-process, and they are discovered only after the post-process is completed, that is, after the display becomes possible. Conventionally, the conventional methods for separating these bonded substrates have been to use mechanical processing such as cutting the substrate, or to chemically weaken the polymer adhesive by exposing it to chemicals. , or ways to remove it have been considered. However, both of them involve damage to the wiring formed on the board, and even damage to the board itself, so if it is reassembled after minutes M, the display device may have display problems or be impossible to assemble. As mentioned above, it is impossible to separate and recycle using conventional conventional methods, so there is no prior example of separation and regeneration, and currently products that are defective due to contamination with foreign matter, etc. are discarded. .
〔発明が解決しようとするｆ１ｇ１
以上のように製造歩留向上の一方策として不良品再生技
術も極めて重要である。ところが、従来、接合基板の分
離は上述の慣用的な方法によっているため、分離２分解
後の再生が不可能であり、欠陥品は廃棄しているための
製造歩留の向上が図れなかった。そのため、基板や配線
等にダメージを与えることなく接合基板を分離する方法
を見出し、その結果、欠陥品を再生できるようにすると
いう課題があった。[f1g1 to be Solved by the Invention As described above, defective product recycling technology is extremely important as one way to improve manufacturing yield. However, conventionally, the bonded substrates have been separated by the conventional method described above, making it impossible to recycle after separation and decomposition, and defective products are discarded, making it impossible to improve the manufacturing yield. Therefore, there was a problem of finding a method to separate the bonded substrates without damaging the substrates, wiring, etc., and as a result, making it possible to recycle defective products.
本発明は上記のような課題を解決するためになされたも
ので、基板やそれらに形成された配線等に何らダメージ
を与えることなく、分離１分解でき、その結果、例えば
液晶表示装置の場合、再度組立てても表示特性の遜色な
い再生基板が得られる接合基板の分離方法及び液晶表示
装置の分離方法を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and allows separation and disassembly without causing any damage to the substrates or the wiring formed thereon.As a result, for example, in the case of a liquid crystal display device, It is an object of the present invention to provide a method for separating a bonded substrate and a method for separating a liquid crystal display device, which can yield a recycled substrate with comparable display characteristics even when reassembled.
本発明の接合基板の分離方法は、複数の基板を対向させ
て接着剤で接合した接合基板の接合部に、上記一方の基
板上から、上記一方の基板を透過し、かつ上記接着剤に
吸収される特性を有するエネルギービームを照射し、上
記一方の基板と他方の基板を分離するようにしたもので
ある。The method for separating bonded substrates of the present invention includes transmitting a signal from above one of the substrates to the bonded portion of the bonded substrates, in which a plurality of substrates are opposed to each other and bonded with an adhesive, through the one substrate and absorbed by the adhesive. The one substrate and the other substrate are separated by irradiation with an energy beam having the characteristics of
また、本発明の別の発明の液晶表示装置の分離方法は、
複数の基板を対向させて高分子材零４から成る接着剤で
接合して形成した液晶表示装置の接合部に、上記一方の
基板上から光の波長が紫外光域にあるレーザビームを照
射し、上記一方の基板と他方の基板を分離するようにし
たものである。Further, a method for separating a liquid crystal display device according to another invention of the present invention includes:
A laser beam having a wavelength in the ultraviolet region is irradiated from above one of the substrates onto the joint of a liquid crystal display device formed by facing a plurality of substrates and joining them with an adhesive made of polymer material Zero 4. , the one substrate and the other substrate are separated.
本発明においては接合基板の接合部に基板を透過し、か
つ接着材に吸収される特性を有するエネルギービームを
照射することにより、基板と接着剤の接合界面力」危弱
化し、接合界面で接着剤と基板が分離し、周基板が分離
されると考えられる。In the present invention, by irradiating the bonded part of the bonded substrates with an energy beam that has the property of transmitting through the substrate and being absorbed by the adhesive, the bonding interface force between the substrate and the adhesive is weakened, and the bonding occurs at the bonding interface. It is thought that the agent and the substrate are separated, and the surrounding substrate is separated.
従って、基板やそれらに形成された配線等にダメージを
与えることもない。Therefore, no damage is caused to the substrate or the wiring formed thereon.
また、本発明の別の発明における光の波長が紫外光域に
あるレーザは高分子材料に対してドライエツチング作用
を有しており、これを接合部に照射することにより、基
板と高分子材料からなる接着剤との間の化学的な結合が
切断あるいは変化した結果として、基板と接着剤が接合
界面で分離し、周基板が分剤するものと考えられる。Further, in another invention of the present invention, a laser whose light wavelength is in the ultraviolet region has a dry etching effect on polymeric materials, and by irradiating the joint with the laser, the substrate and polymeric material It is thought that as a result of the chemical bond between the substrate and the adhesive being broken or changed, the substrate and adhesive separate at the bonding interface, and the surrounding substrate separates.
以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の液晶平面表示装置の基本的
な分離方法を示す模式斜視図であり、接合基板の両面（
周基板上）から接合部にエネルギービームを照射する場
合を示している０図において、（１）は一方の基板で、
この場合は透明ガラス基板から成る対向基板（２）は他
方の基板で、この場合は同しく透明ガラス基板から成る
主基板、（５）は主基板（２）と対向基板（１）を接合
するための高分子材料から成る接着剤であり、この場合
にはエポキシ系接着剤が使用される。（８）はエネルギ
ービームであり、この場合には紫外光域（波長３０８ｎ
ｍ）のエキシマレーザが使用される。また、矢印はエネ
ルギービーム（８）の走査方向を示す。エキシマレーザ
（８）を励起電圧２５Ｋｖ、くりかえし数１００１１Ｚ
ビーム径２１１Ｉｍ にて透明ガラス基板からな
る対向基板（１）、主基板（２）を介して接着剤（５）
に照射、走査する。一方、液晶表示装置の断面構造は第
５図に示すとおりであり、配線（４）の材料としては通
常主にインジウム、スズ酸素から成る複合酸化物が使用
される。この複合酸化物は透明電極と称されており、紫
外光を透過する。第５図の断面構造において、接着剤（
５）に対向基板（１）、主基板（２）を介してエキシマ
レーザ（８）を照射すると、接着剤の接合界面が劣化し
、対向基板（１）、接着剤（５）、主基板（２）の３者
に分離し、周基板（１１＋２１は配線（４）等に何ら損
傷を受けることなく分解される。光の波長が紫外線光域
にあるレーザ、特にエキシマレーザは高分子材料に対し
て、すぐれたドライエツチング作用を有するため、高分
子材料の穴あけ加工に関して、積極的な研究が実施され
つつある。本発明では、接着剤で接合された構造体の分
離にも極めて有効であることをはしめて開示するもので
ある。接着剤の接合メカニズムが示されていない今日で
は、本発明による分離のメカニズムを明確に示すことは
できないが、接着剤と基板との間の科学的な結合がエキ
シマレーザの照射により、切断あるいは変化した結果と
して、接着剤と基板が界面で分離するものと考えられる
。FIG. 1 is a schematic perspective view showing a basic separation method of a liquid crystal flat display device according to an embodiment of the present invention, and shows both sides of a bonded substrate (
In Figure 0, which shows the case where the energy beam is irradiated to the joint from the peripheral substrate), (1) is one of the substrates,
In this case, the counter substrate (2) made of a transparent glass substrate is the other substrate, in this case the main substrate also made of a transparent glass substrate, and (5) is used to bond the main substrate (2) and the counter substrate (1). It is an adhesive made of a polymeric material for the purpose of use, and in this case, an epoxy adhesive is used. (8) is an energy beam, in this case it is in the ultraviolet light region (wavelength 308 nm).
m) excimer laser is used. Further, the arrow indicates the scanning direction of the energy beam (8). Excimer laser (8) with excitation voltage of 25Kv, number of repetitions of 10011Z
With a beam diameter of 211 Im, adhesive (5) is applied via the opposing substrate (1) made of a transparent glass substrate and the main substrate (2).
irradiate and scan. On the other hand, the cross-sectional structure of the liquid crystal display device is as shown in FIG. 5, and a composite oxide mainly consisting of indium and tin-oxygen is usually used as the material for the wiring (4). This composite oxide is called a transparent electrode and transmits ultraviolet light. In the cross-sectional structure shown in Figure 5, the adhesive (
When 5) is irradiated with an excimer laser (8) through the counter substrate (1) and the main substrate (2), the bonding interface of the adhesive deteriorates, causing the counter substrate (1), the adhesive (5), and the main substrate ( 2), and the peripheral substrate (11+21 is decomposed without any damage to the wiring (4), etc.) Lasers whose light wavelength is in the ultraviolet range, especially excimer lasers, are sensitive to polymer materials. Because it has an excellent dry etching effect, active research is being carried out on drilling holes in polymeric materials.The present invention shows that it is also extremely effective for separating structures bonded with adhesives. Although it is not possible to clearly demonstrate the mechanism of separation according to the present invention as the bonding mechanism of the adhesive has not been demonstrated today, the scientific bonding between the adhesive and the substrate is It is thought that the adhesive and the substrate separate at the interface as a result of cutting or changing due to excimer laser irradiation.
このように分離、分解された液晶表示装置の対向基板（
１）及び主基板（２）は、基板それ自体とそれらに形成
された配線（４）に何ら劣化、損傷を受けていないので
、適当な洗浄工程の後、再度組みたてれば液晶表示装置
として動作が可能である。従って、不良品を基板や配線
を損うことなく分離１分解して、再生、修復が可能とな
り、製造歩留が向上する。The counter substrate of the liquid crystal display device separated and disassembled in this way (
1) and the main substrate (2) have not suffered any deterioration or damage to the substrates themselves or the wiring (4) formed on them, so if they are reassembled after an appropriate cleaning process, they will work as a liquid crystal display device. is possible. Therefore, defective products can be separated, disassembled, recycled, and repaired without damaging the substrate or wiring, and the manufacturing yield can be improved.
第２図は本発明の他の実施例に係わる分離装置を示す断
面構成図で、図において、（９）は対向基板（１）、主
基板（２）を吸着により閲む治具、００１は真空である
。レーザ（８）照射後、又は照射中に、治具（９）を用
いて、対向基板（１）、主基板（２）に回転又はすべり
により剪断力を加えることにより、対向基板（１）主基
板（２）及び接着剤（５）がその接合界面で分離される
。FIG. 2 is a cross-sectional configuration diagram showing a separation device according to another embodiment of the present invention. In the figure, (9) is a jig for viewing the counter substrate (1) and the main substrate (2) by suction; It is a vacuum. After or during laser (8) irradiation, a jig (9) is used to apply shear force to the opposing substrate (1) and the main substrate (2) by rotation or sliding. The substrate (2) and adhesive (5) are separated at their bonding interface.
第３図は本発明のさらに他の実施例に係わる分離装置を
示す断面横戒図で、この場合はレーザ（８）を一方の基
板の対向基板ｆｉｌ上から照射している。FIG. 3 is a cross-sectional view showing a separation device according to still another embodiment of the present invention, in which a laser (8) is irradiated from above the opposing substrate fil of one substrate.
図において０υは加熱装置、この場合はヒータである。In the figure, 0υ is a heating device, in this case a heater.
レーザ（８）照射後、又は照射中に、対向基板ｉｌ＋又
は主基板（２）をヒータ０υにより加熱すると基板中の
温度差で発生する熱応力により、対向基板（１）と主基
板（２）は分離される。After or during laser (8) irradiation, if the counter substrate il+ or the main substrate (2) is heated by the heater 0υ, the counter substrate (1) and the main substrate (2) will be heated due to the thermal stress generated by the temperature difference in the substrate. are separated.
なお、上記実施例では、基板をｉ！ｉ過し、接着剤に吸
収される特性を有するエネルギービーム、紫外光域レー
ザがエキシマレーザである場合について示したがこれに
限定することはなく、他のレーザ、例えばＮｄ：ＹＡＧ
レーザ、 Ｘｅレーザ、 Ａｒレーザ炭酸ガスレーザ、
銅蒸気レーザも同等の作用を有するので応用が可能であ
る。さらにレーザに限定することはなく、同様の作用を
有する他のエネルギービームであっても良いことは自明
である。また、接合部に配線等が形成されてする場合、
その配線をもｉ３遇するものである。In addition, in the above embodiment, the substrate is i! Although the case where the energy beam having the property of being absorbed by the adhesive and the ultraviolet laser is an excimer laser is shown, the present invention is not limited to this, and other lasers such as Nd:YAG can be used.
Laser, Xe laser, Ar laser, carbon dioxide laser,
Copper vapor lasers can also be applied because they have the same effect. Furthermore, it is obvious that the present invention is not limited to lasers, and that other energy beams having similar effects may be used. In addition, if wiring etc. are formed at the joint,
The wiring is also treated as i3.
また、上記実施例では、接着剤としてエポキシ系高分子
接着剤である場合について、述べたが、これに限ること
はなく、アクリル系、ボッイミド系、フェノール系、ウ
レタン系１笠他の高分子接着剤であっても良い。さらに
、無機系接着剤についても応用が可能である。In addition, in the above embodiments, the adhesive is an epoxy polymer adhesive, but the adhesive is not limited to this. It may be a drug. Furthermore, it can also be applied to inorganic adhesives.
さらに、上記実施例では接合部が接合基板の外周に在る
ものについて示したが基板上からエネルギービームを照
射し、分離するものであるから、中央部であろうとどこ
にあろうと、その接合を分離できる。Furthermore, in the above embodiment, the bond is located on the outer periphery of the bonded substrate, but since the energy beam is irradiated from above the substrate and the bond is separated, the bond can be separated regardless of whether it is in the center or anywhere. can.
そして、上記実施例では液晶表示装置の場合について説
明したが、他の複数（２枚に限らず）の基板を接合した
接合基板に適用できることは自明であり、以上のように
して分離１分解された個別基板は、個別基板と、それら
に形成された配線等を何ら劣化させないので、適当な洗
浄工程の後、再度組み立てれば正常に動作する。従って
、不良品はそれを分離し、再生修復が可能となり製造歩
留が向上する。Although the above embodiment describes the case of a liquid crystal display device, it is obvious that the application can be applied to a bonded substrate in which a plurality of other substrates (not limited to two) are bonded together, and the separation and disassembly as described above is applicable. Since the individual substrates and the wiring formed thereon do not deteriorate in any way, they will operate normally if they are reassembled after an appropriate cleaning process. Therefore, defective products can be separated and regenerated and repaired, thereby improving manufacturing yield.
以上のように、本発明によれば、複数のＷ ＋＆を対向
させて接着剤で接合した接合基板の接合部に、上記一方
の基板上から、上記一方の基板を透過し、かつ上記接着
剤に吸収される特性を有するエネルギービームを照射し
、上記一方の基板と他方の基板を分離するようにしたの
で基板とそれらに形成された配線等にダメージを与える
ことなく、接合基板を分離することができる。その結果
、不良な接合基板を分離し、分離した基板を用いて再生
修復が可能で製造歩留が向上できる。As described above, according to the present invention, a plurality of W + Since the one substrate and the other substrate are separated by irradiating the energy beam with the characteristic of being absorbed by the bonded substrates, the bonded substrates can be separated without damaging the substrates and the wiring formed on them Can be done. As a result, the defective bonded substrate can be separated and the separated substrate can be used for regeneration and repair, thereby improving manufacturing yield.
また、本発明の別の発明によれば、複数の基板を対向さ
せて高分子材料から成る接着剤で接合して形成した液晶
表示装置の接合部に、上記一方の基板上から光の波長が
紫外光域にあるレーザビームを照射し、上記一方の基板
と他方の基板を分離するようにしたので、上記と同様に
基板やそれらに形成された配線等にダメージを与えるこ
となく分離できる。その結果、不良な液晶表示装置を分
離１分解して再生できるので、液晶表示装置の製造歩留
が向上する。According to another aspect of the present invention, a wavelength of light from one of the substrates is applied to a joint portion of a liquid crystal display device formed by making a plurality of substrates face each other and joining them with an adhesive made of a polymeric material. Since the one substrate and the other substrate are separated by irradiation with a laser beam in the ultraviolet light range, they can be separated without damaging the substrates or the wiring formed thereon in the same manner as described above. As a result, a defective liquid crystal display device can be separated, disassembled and regenerated, thereby improving the manufacturing yield of liquid crystal display devices.
第１図は本発明の一実施例の液晶平面表示装置の分離方
法を示す模式斜視図、第２図は本発明の他の実施例に係
わる分離装置を示す断面構成図、第３図は同さらに他の
実施例に係わる分離装置を示す断面構成図、第４図は液
晶平面表示装置を示す斜視図、第５図は第４図のｖ−ｖ
’線断面図である。
図において、（１川よ一方の基板で、この場合は対向基
板、（２）は他方の基板で、この場合は主基板、（５）
は高分子材料からなる接着剤、（８）は波長が市街光域
にあるレーザビームである。
なお、図中、同一符号は同−又は相当部分を示す。FIG. 1 is a schematic perspective view showing a separating method for a liquid crystal flat display device according to an embodiment of the present invention, FIG. 2 is a cross-sectional configuration diagram showing a separating device according to another embodiment of the present invention, and FIG. FIG. 4 is a perspective view showing a liquid crystal flat display device, and FIG. 5 is a cross-sectional view showing a separation device according to another embodiment.
' It is a line sectional view. In the figure, (1) is one board, in this case the counter board, (2) is the other board, in this case the main board, (5)
(8) is an adhesive made of a polymeric material, and (8) is a laser beam whose wavelength is in the city light range. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (2)
板の接合部に、上記一方の基板上から、上記一方の基板
を透過し、かつ上記接着剤に吸収される特性を有するエ
ネルギービームを照射し、上記一方の基板と他方の基板
を分離するようにした接合基板の分離方法。(1) An energy beam having the characteristic of transmitting through one of the substrates and being absorbed by the adhesive from above one of the substrates to the joint of the bonded substrate in which multiple substrates are faced and bonded with adhesive. A method for separating bonded substrates, the method comprising: irradiating the one substrate with the other substrate to separate the one substrate and the other substrate.
剤で接合して形成した液晶表示装置の接合部に、上記一
方の基板上から光の波長が紫外光域にあるレーザビーム
を照射し、上記一方の基板と他方の基板を分離するよう
にした液晶表示装置の分離方法。(2) A laser beam whose wavelength is in the ultraviolet range is irradiated from above one of the substrates onto the joint of a liquid crystal display device formed by facing multiple substrates and joining them with an adhesive made of a polymeric material. and a method for separating a liquid crystal display device, wherein the one substrate and the other substrate are separated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1267036A JP2789720B2 (en) | 1989-10-12 | 1989-10-12 | Method for separating bonding substrate and method for separating liquid crystal display device |
| US07/975,136 US5269868A (en) | 1989-10-12 | 1992-11-12 | Method for separating bonded substrates, in particular disassembling a liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1267036A JP2789720B2 (en) | 1989-10-12 | 1989-10-12 | Method for separating bonding substrate and method for separating liquid crystal display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126913A true JPH03126913A (en) | 1991-05-30 |
| JP2789720B2 JP2789720B2 (en) | 1998-08-20 |
Family
ID=17439160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1267036A Expired - Lifetime JP2789720B2 (en) | 1989-10-12 | 1989-10-12 | Method for separating bonding substrate and method for separating liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2789720B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5514850A (en) * | 1992-06-30 | 1996-05-07 | Sharp Kabushiki Kaisha | Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam |
| EP0924769A4 (en) * | 1997-07-03 | 2001-11-14 | Seiko Epson Corp | Method of transferring thin film devices, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display, and electronic apparatus |
| WO2003008219A1 (en) * | 2000-03-24 | 2003-01-30 | Asahi Glass Company, Limited | Method of removing window pane |
| WO2015096373A1 (en) * | 2013-12-23 | 2015-07-02 | 京东方科技集团股份有限公司 | Touch screen and display screen separating device and separating method |
| WO2017006405A1 (en) * | 2015-07-03 | 2017-01-12 | 堺ディスプレイプロダクト株式会社 | Method for dividing display member and method for manufacturing liquid crystal display device |
| CN109661115A (en) * | 2018-11-27 | 2019-04-19 | 广东创辉鑫材科技股份有限公司东莞分公司 | A method of it reducing heavy tin ion and pollutes content |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127917A (en) * | 1982-01-26 | 1983-07-30 | Citizen Watch Co Ltd | Manufacture of liquid crystal cell |
-
1989
- 1989-10-12 JP JP1267036A patent/JP2789720B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127917A (en) * | 1982-01-26 | 1983-07-30 | Citizen Watch Co Ltd | Manufacture of liquid crystal cell |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5514850A (en) * | 1992-06-30 | 1996-05-07 | Sharp Kabushiki Kaisha | Defect compensation method for smoothing a surface of a transparent plate with an ArF excimer laser beam |
| EP0924769A4 (en) * | 1997-07-03 | 2001-11-14 | Seiko Epson Corp | Method of transferring thin film devices, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display, and electronic apparatus |
| US6521511B1 (en) | 1997-07-03 | 2003-02-18 | Seiko Epson Corporation | Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus |
| US6878607B2 (en) | 1997-07-03 | 2005-04-12 | Seiko Epson Corporation | Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus |
| KR100494479B1 (en) * | 1997-07-03 | 2005-06-10 | 세이코 엡슨 가부시키가이샤 | Method for manufacturing an active matrix substrate |
| WO2003008219A1 (en) * | 2000-03-24 | 2003-01-30 | Asahi Glass Company, Limited | Method of removing window pane |
| WO2015096373A1 (en) * | 2013-12-23 | 2015-07-02 | 京东方科技集团股份有限公司 | Touch screen and display screen separating device and separating method |
| US10328591B2 (en) | 2013-12-23 | 2019-06-25 | Boe Technology Group Co., Ltd. | Apparatus and method for separating touch screen and display screen |
| WO2017006405A1 (en) * | 2015-07-03 | 2017-01-12 | 堺ディスプレイプロダクト株式会社 | Method for dividing display member and method for manufacturing liquid crystal display device |
| JPWO2017006405A1 (en) * | 2015-07-03 | 2018-06-14 | 堺ディスプレイプロダクト株式会社 | Method for dividing display member and method for manufacturing liquid crystal display device |
| CN109661115A (en) * | 2018-11-27 | 2019-04-19 | 广东创辉鑫材科技股份有限公司东莞分公司 | A method of it reducing heavy tin ion and pollutes content |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2789720B2 (en) | 1998-08-20 |
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