JPH03126508A - Mold made of resin whose surface is plated and manufacture thereof - Google Patents
Mold made of resin whose surface is plated and manufacture thereofInfo
- Publication number
- JPH03126508A JPH03126508A JP1265010A JP26501089A JPH03126508A JP H03126508 A JPH03126508 A JP H03126508A JP 1265010 A JP1265010 A JP 1265010A JP 26501089 A JP26501089 A JP 26501089A JP H03126508 A JPH03126508 A JP H03126508A
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- mold
- resin
- thermosetting resin
- type conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 61
- 239000011347 resin Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000007747 plating Methods 0.000 claims abstract description 30
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 26
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 229920000642 polymer Polymers 0.000 abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052804 chromium Inorganic materials 0.000 abstract description 3
- 239000011651 chromium Substances 0.000 abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- -1 and in special cases Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000010137 moulding (plastic) Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000011529 conductive interlayer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱硬化性樹脂を用いてなる型に関するもので
ある。特に、本発明は、耐摩耗性と表面硬さの高い樹脂
製型を提供するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a mold made of a thermosetting resin. In particular, the present invention provides a resin mold with high wear resistance and surface hardness.
（従来の技術）
従来から射出成形や真空成形をはじめとするプラスチッ
ク成形型および薄い金属板のプレス加工を目的にしたプ
レス成形型には、鉄を中心とした金属製型が一般に使用
されて来な。しかし金属製型は切削加工が容易でないた
め、型費用が高価でかつ加工に長時間を要するという欠
点を有していた。この金属製の金型の欠点を克服するた
めに、加工性の良いアルミや亜鉛合金などの材料が開発
されて来ている。こうした新金属材料を用いた型は、や
はり鉄製型と同様な製造プロセスを経るために本質的な
解決にはならない。(Prior art) Metal molds, mainly made of iron, have traditionally been used for plastic molds such as injection molding and vacuum forming, and press molds for pressing thin metal plates. Na. However, since metal molds are not easy to cut, they have the drawbacks of being expensive and requiring a long time to process. In order to overcome the drawbacks of metal molds, materials with good workability such as aluminum and zinc alloys have been developed. Molds made of these new metal materials still require the same manufacturing process as iron molds, so they are not a fundamental solution.
そこで、この金属製の型に替わって、加工が容易であり
、かつ型の製造プロセスを大幅に簡略化しうる樹脂製型
の出現が望まれていた。Therefore, in place of the metal mold, there has been a desire for a resin mold that is easy to work with and can greatly simplify the mold manufacturing process.
こうしたプラスチック成形型用材料としてはエポキシ樹
脂、ウレタン樹脂、シリコン樹脂などの熱硬化性樹脂が
開発されて来た。このうち、特にエポキシ樹脂は、その
硬化特性や硬化物性に優れていることから型用材料とし
てはＲ通であるとされていた。Thermosetting resins such as epoxy resins, urethane resins, and silicone resins have been developed as materials for such plastic molds. Among these, epoxy resin in particular was considered to be R-class as a material for molds because of its excellent curing characteristics and hardening properties.
しかし、従来からの型用熱硬化性樹脂材料は、金属製の
型に比べて耐摩耗性が低く、プラスチック成形、とりわ
け成形圧力の高い射出成形では、型の損傷が大きい。同
様のことがプレス成形においても云える。However, conventional thermosetting resin materials for molds have lower abrasion resistance than metal molds, and the molds are frequently damaged in plastic molding, especially injection molding where molding pressure is high. The same can be said for press molding.
こうした欠点を補うために、樹脂製型の製品形状面に無
電解メッキによって金属メッキ層を形成した樹脂型が開
発されている。In order to compensate for these drawbacks, resin molds have been developed in which a metal plating layer is formed on the product shape surface of the resin mold by electroless plating.
例えば、特開昭６２−２３８２９４号公報、特開昭６３
−２３８２４号公報、特開昭６２−１１０８２３号公報
および特開昭６２−１１０８２４号公報には、樹脂型表
面に金属メッキ層を無電解メッキにより形成する方法が
開示されている。For example, JP-A-62-238294, JP-A-63
JP-A-23824, JP-A-62-110823, and JP-A-62-110824 disclose methods of forming a metal plating layer on the surface of a resin mold by electroless plating.
（発明が解決しようとする課８）
しかし、これらの方法は、脱脂、エツチング、中和、表
面調整、触媒付与、触媒活性化、化学メッキという一連
の工程を経て初めて金属メッキ層が形成される。したが
って、各工程の処理槽が必要なだけでな（、メッキ処理
時間も長い。(Issue 8 to be solved by the invention) However, in these methods, a metal plating layer is formed only after a series of steps including degreasing, etching, neutralization, surface conditioning, catalyst application, catalyst activation, and chemical plating. . Therefore, not only is a processing tank required for each process, but the plating process time is also long.
また、得られる金属メッキ層は、各処理槽の管理が十分
でないと、析出ムラや光沢ムラが出易い。Furthermore, the resulting metal plating layer tends to have uneven precipitation and uneven gloss if each treatment tank is not adequately managed.
また、無電解メッキによって得られた金属メッキ層は、
下池である樹１１Ｎとの密若性が充分でなく、特に剥離
強さや耐摩耗性の点で充分な性能を発揮できない。In addition, the metal plating layer obtained by electroless plating is
The compactness with the lower tree 11N is insufficient, and sufficient performance cannot be exhibited, especially in terms of peel strength and abrasion resistance.
（課題を解決するための手段）
本発明者らは、これらの問題点の解決のために、鋭意検
討を重ねた結果、本発明に到達し得たものである。(Means for Solving the Problems) The present inventors have made extensive studies to solve these problems, and as a result, have arrived at the present invention.
すなわち、本発明は；
■熱硬化性樹脂を用いてなる型において、型の製品形状
面が、熱硬化性樹脂上に形成されたポリマ二型導電性中
間層と、その中間層の上に形成された金属メッキ層から
成る樹脂製型である。That is, the present invention is; (1) A mold made of a thermosetting resin, in which the product-shaped surface of the mold is formed on a polymer two-type conductive intermediate layer formed on the thermosetting resin and on the intermediate layer; It is a resin mold made of a metal plating layer.
■ポリマー型導電性中間層を製品形状面に形成してなる
熱硬化性樹脂に、電気メッキを施すことによって該ポリ
マー型導電層上に金属メッキを形成することを特徴とす
る、樹脂製型の製造方法でもある。■A resin mold characterized in that a thermosetting resin is formed by forming a polymer-type conductive intermediate layer on the surface of the product shape, and metal plating is formed on the polymer-type conductive layer by electroplating. It is also a manufacturing method.
本発明の構成を以下に具体的に説明する。The configuration of the present invention will be specifically explained below.
本発明で用いることのできる熱硬化性樹脂は特に限定す
るものではなく、フェノール樹脂、ユリア樹脂、メラミ
ン樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ウレ
タン樹脂、シリコン樹脂、ポリイミド樹脂、ビスマレイ
ミド−トリアジン樹脂などを挙げることができる。これ
らの熱硬化性樹脂にば、各種の添加剤、例えばアルミ粉
、銅粉、鉄粉などの金属粉、特別の場合にはガラス、金
属製のチゴップや短繊維を混合したものであってもよい
。Thermosetting resins that can be used in the present invention are not particularly limited, and include phenolic resins, urea resins, melamine resins, epoxy resins, unsaturated polyester resins, urethane resins, silicone resins, polyimide resins, and bismaleimide-triazine resins. etc. can be mentioned. These thermosetting resins may be mixed with various additives, such as metal powders such as aluminum powder, copper powder, and iron powder, and in special cases, glass, metal chips, and short fibers. good.
ポリマー型導電性中間層は、体積抵抗率が１Ω・ｃｍ以
下であることが好ましい。１Ω・Ｃ１以上である場合に
は通電性が不良のために、良好なメッキ層が形成しにく
い、好ましい範囲は、１０−”〜１０−５Ω・１である
。The polymer type conductive intermediate layer preferably has a volume resistivity of 1 Ω·cm or less. If it is 1Ω·C1 or more, the conductivity is poor and it is difficult to form a good plating layer.The preferable range is 10−” to 10−5Ω·1.
ポリマー型導電性中間層としては、■ポリマー自身が１
Ω・Ｃｌ１１以下の体積抵抗率を有するものであっても
よいし、■ポリマー中に導電性金属粉を含有することに
よって１Ω・ｃｍ以下の体積抵抗率を有するものでもよ
い。As a polymer-type conductive intermediate layer, ■The polymer itself is 1
It may have a volume resistivity of Ω·Cl11 or less, or it may have a volume resistivity of 1 Ω·cm or less by (2) containing conductive metal powder in the polymer.
■ｉ′ｉ１晋の例としては、ポリアセチレン、ポリパラ
フェニレン、ポリアニリン、ポリピロール、ポリチオフ
ェン樹脂などを挙げることができる。Examples of (i'i1) include polyacetylene, polyparaphenylene, polyaniline, polypyrrole, and polythiophene resin.
■後者の例としては、ポリマー中に金、白金、根、銅、
ニッケル、アルミニウムなどの金属粉、またはグラファ
イト、カーボンブラックなどの導電粉を混合した複合型
ポリマーを挙げることができる。■ Examples of the latter include gold, platinum, roots, copper, etc.
Examples include composite polymers mixed with metal powders such as nickel and aluminum, or conductive powders such as graphite and carbon black.
前記ポリマーとしては、アクリル系樹脂、ポリエステル
などの熱可塑性樹脂や、フェノール樹脂、メラミン樹脂
、ユリア樹脂、エポキシ樹脂、不飽和ポリエステル樹脂
、シリコン樹脂、ウレタン樹脂、ポリイミド樹脂などの
熱硬化性樹脂を用いることができる。As the polymer, thermoplastic resins such as acrylic resins and polyesters, thermosetting resins such as phenolic resins, melamine resins, urea resins, epoxy resins, unsaturated polyester resins, silicone resins, urethane resins, and polyimide resins are used. be able to.
好ましいポリマー型導電性中間層は、樹脂製型に用いら
れる熱硬化性樹脂と同種の熱硬化性樹脂の中に、銅ある
いはニッケルわ）を６０〜９０重量％混合したものであ
る。A preferred polymer type conductive intermediate layer is one in which 60 to 90% by weight of copper or nickel is mixed in a thermosetting resin of the same type as the thermosetting resin used for the resin mold.
次に、金属メッキ層とは、電気メッキにより形成された
金属メッキ層を云い、金属の種類は特に限定するもので
はない。代表的な金属メッキの種類としては、ニッケル
、クロム、銅、亜鉛メッキを挙げることができる。Next, the metal plating layer refers to a metal plating layer formed by electroplating, and the type of metal is not particularly limited. Typical types of metal plating include nickel, chromium, copper, and zinc plating.
ポリマー型導電性中間層の厚さは、必要に応じて調節す
ることができるが、好ましい範囲としては５０μｍ〜１
．０順である。The thickness of the polymer-type conductive intermediate layer can be adjusted as necessary, but is preferably in the range of 50 μm to 1 μm.
．． In order of 0.
金型メッキ層の厚さは、５μｍ〜１ｍの範囲で任意に選
択することができるが、高度な耐久性を要求される場合
にば５０ａｍ〜５００ ｐｍ、さらに好ましくは５０μ
ｍ〜３００ ｐｍの範囲が好ましく、研磨して用いられ
る。The thickness of the mold plating layer can be arbitrarily selected within the range of 5 μm to 1 m, but if a high degree of durability is required, the thickness is 50 am to 500 pm, more preferably 50 μm.
It is preferably in the range of m to 300 pm, and is used after polishing.
（樹脂製型の製造方法）
本発明の樹脂製型は、ポリマー型導電性中間層を製品形
状面に形成してなる熱硬化性樹脂製型に、電気メッキを
施すことによって該ポリマー型導電層の上に金属メッキ
層を形成するものである。(Method for manufacturing a resin mold) The resin mold of the present invention is produced by electroplating a thermosetting resin mold in which a polymer conductive intermediate layer is formed on the product shape surface. A metal plating layer is formed on top of the metal plating layer.
ポリマー型導電性中間層を熱硬化性樹脂製型の製品形状
面に形成させる方法は、特に限定するものではない。The method for forming the polymer-type conductive intermediate layer on the product-shaped surface of the thermosetting resin mold is not particularly limited.
例えば、予め熱硬化性樹脂製型を作成しておき、これに
ポリマー型導電性中間層を塗布・乾燥させ、必要に応じ
て硬化反応を行うことによって得られるものである。別
の例としては、熱硬化性樹脂製型を注形などの方法によ
って、マスターモデルから複製する際に、予め離型剤を
塗布したマスターモデルに、ポリマー型導電性中間層成
分を塗布、必要に応じて乾燥、硬化反応を行い、これに
熱硬化性樹脂を注形、硬化反応を行うことにより、樹脂
製型を得る際に同時にポリマー型導電性中間層を形成さ
せるものである。For example, it can be obtained by preparing a thermosetting resin mold in advance, applying a polymer-type conductive intermediate layer thereto, drying it, and carrying out a curing reaction if necessary. Another example is when replicating a thermosetting resin mold from a master model by a method such as casting, a polymer-type conductive intermediate layer component is applied to the master model, which has been previously coated with a mold release agent. Drying and curing reactions are carried out according to the conditions, and a thermosetting resin is cast into the resin mold, and a curing reaction is carried out to form a polymer-type conductive intermediate layer at the same time as a resin mold is obtained.
電気メッキは、代表的には、電気分解反応で金属イオン
を還元し、陰極としてのポリマー型導電性中間層上に金
属を析出させるものである。例えば、メッキ層中に樹脂
製型を浸漬し、ポリマー型導電性中間層に陰極を接続し
、陽極にはメッキを施す金属の板または球を用いる。メ
ッキ液には金属イオン補給を目的としたものがよい。Electroplating typically involves reducing metal ions in an electrolytic reaction and depositing the metal onto a polymeric conductive interlayer as a cathode. For example, a resin mold is immersed in the plating layer, a cathode is connected to the polymer conductive intermediate layer, and a metal plate or ball to be plated is used as the anode. The plating solution should preferably be one intended for replenishing metal ions.
また、樹脂製型の必要部分のみメッキを施してもよい。Alternatively, plating may be applied to only the necessary portions of the resin mold.
高速メッキの場合には、陽極として、カーボン又は白金
などの不溶性材料を用いるとよい。この場合には、メッ
キ液中の金属イオンはメッキを施す金属塩の水溶液から
補充する必要がある。For high speed plating, an insoluble material such as carbon or platinum may be used as the anode. In this case, the metal ions in the plating solution must be replenished from an aqueous solution of the metal salt to be plated.
本発明の樹脂製型は、ポリエチレン、ポリプロピレン、
ポリスチレン、ＡＢＳ樹脂などの汎用プラスチックス；
ナイロン樹脂、ポリエステル樹脂、ポリアセクール樹脂
、アクリル樹脂などの特殊プラスチックスなどの熱可塑
性樹脂に関する射出成形、真空成形、ブロー成形をはじ
めとする成形型に、またウレタン樹脂などのＲＩＭ成形
型にも用いることができる。The resin mold of the present invention includes polyethylene, polypropylene,
General-purpose plastics such as polystyrene and ABS resin;
Can be used for injection molding, vacuum molding, blow molding, and other molds for thermoplastic resins such as special plastics such as nylon resin, polyester resin, polyacecool resin, and acrylic resin, as well as RIM molding molds for urethane resins, etc. Can be done.
また、金属製の薄板加工を施すプレス成形型への適用も
可能である。It is also possible to apply the present invention to press molds for processing thin metal plates.
以下、本発明を実施例により詳細に説明するが、これら
は本発明の範囲を制限するものでない。EXAMPLES Hereinafter, the present invention will be explained in detail with reference to Examples, but these are not intended to limit the scope of the present invention.
実施例１
（イ）熱硬化性樹脂製型の準備
アルミニウム粉を３０重量％、鉄粉を４０重量％含有す
るエポキシ樹脂（チハガイギー製ＣＷ２１７）の硬化物
ブロックを切削して、樹脂製型Ａを作成した。Example 1 (a) Preparation of thermosetting resin mold A resin mold A was made by cutting a cured block of epoxy resin (CW217 manufactured by Chiha Geigy) containing 30% by weight of aluminum powder and 40% by weight of iron powder. Created.
（ロ）ポリマー型導電性中間層の形成
予め用意した銅粉を８０重量部、ノボラック系フェノー
ル樹脂２０重量部および溶剤２０重量部からなる導電性
塗料を熱硬化性樹脂製型への製品形状面に０．２ｍｍの
厚みに塗布し、乾燥後１８０’Ｃ／１０分間焼付けた。(b) Formation of polymer-type conductive intermediate layer A conductive paint consisting of 80 parts by weight of copper powder, 20 parts by weight of novolac phenolic resin, and 20 parts by weight of a solvent is molded into a thermosetting resin mold to form the product shape. The coating was applied to a thickness of 0.2 mm, and after drying, it was baked at 180'C for 10 minutes.
導電層の体積抵抗率は２Ｘ１０−’Ω・ｃｍであった。The volume resistivity of the conductive layer was 2×10 −′Ω·cm.
（ハ）電気メッキ層の形成
鉛合金を陽極として、無水クロム酸−硫酸からなるメッ
キ浴（無水クロム酸の濃度は２５０ ｇ／ｌ）でポリマ
ー型導電性中間層を陰極に接続した樹脂製型Ａの必要部
分にメッキを施した。なお、浴温度は５０°Ｃ，７Ｊ、
流密度は４５ Ａ ／ ｄ ｒｄであった。(c) Formation of electroplated layer A resin mold with a lead alloy as an anode and a polymer conductive intermediate layer connected to the cathode in a plating bath consisting of chromic anhydride and sulfuric acid (the concentration of chromic anhydride is 250 g/l). Plating was applied to the necessary parts of A. The bath temperature was 50°C, 7J,
The flow density was 45 A/drd.
得られた樹脂製型１のクロムメッキ層を研磨した後の厚
みは０．５ｍであった。The thickness of the chromium plating layer of the obtained resin mold 1 after polishing was 0.5 m.
（ニ）エポキシ樹脂製成形型の性能
得られた樹脂製型１を使用して、０．７鵬の鉄板をプレ
ス成形した。２千ショット製作しても、型表面に疵の発
生は見られなかった。(iv) Performance of epoxy resin molding die Using the resin mold 1 obtained, an iron plate of 0.7 mm was press-molded. No flaws were observed on the mold surface even after 2,000 shots were produced.
実施例２
実施例１において、熱硬化性樹脂製型への準備（イ）項
でエポキシ樹脂の硬化ブロックが、アルミニウム粉６０
重量％含有するエポキシ樹脂である点を除いて、全て実
施例１と同様にして樹脂製型２を作成した。Example 2 In Example 1, the epoxy resin hardening block in the preparation for thermosetting resin mold (a) was prepared using aluminum powder 60
A resin mold 2 was prepared in the same manner as in Example 1 except that the epoxy resin contained % by weight.
得られた樹脂製型２を使用してＡＢＳ樹脂を射出成形し
た。５千シヨツト成形しても型表面に疵の発生は見られ
なかった。The obtained resin mold 2 was used to injection mold an ABS resin. Even after 5,000 shots were molded, no flaws were observed on the mold surface.
実施例３
実施例１において、熱硬化性樹脂製型の準備（イ）項中
でエポキシ樹脂の替わりに、不飽和ポリエステル樹脂（
昭和高分子製エポキシアクリレート）を使用する以外は
、全て実施例１と同様にして樹脂製型３を作成した。Example 3 In Example 1, unsaturated polyester resin (
A resin mold 3 was prepared in the same manner as in Example 1 except that epoxy acrylate (manufactured by Showa Kobunshi) was used.
得られた樹脂製型３を使用して、０．１ｒｒｍの鉄板を
プレス成形した。千ショット製作しても型表面に疵の発
生は見られなかった。Using the obtained resin mold 3, a 0.1 rrm iron plate was press-molded. No flaws were observed on the mold surface even after 1,000 shots were produced.
比較例１
実施例１において用いた樹脂製型１の替わりに、製品形
状面に全く処理を施していない樹脂製型Ａを用いて、実
施例１と同様に０．１ｗｓの鉄板をプレス成形した。３
００シヨツト目に型表面に疵が発生した。Comparative Example 1 Instead of the resin mold 1 used in Example 1, a 0.1 ws iron plate was press-molded in the same manner as in Example 1, using resin mold A whose product shape was not treated at all. . 3
A flaw occurred on the mold surface at the 00th shot.
（発明の効果）
本発明によって得られる樹脂製型は、耐摩耗性、表面硬
さに優れており、プラスチック成形用およびプレス成形
用型のいずれにおいても耐久性に優れている。(Effects of the Invention) The resin mold obtained by the present invention has excellent wear resistance and surface hardness, and is excellent in durability both as a mold for plastic molding and a mold for press molding.
また、プラスチック成形用樹脂製型において、熱伝導率
を向上させることが可能であり、成形サイクルを短くで
きるという利点を有している。Further, in a resin mold for plastic molding, it is possible to improve the thermal conductivity and has the advantage that the molding cycle can be shortened.
Claims (2)
形状面が、熱硬化性樹脂上に形成されたポリマー型導電
性中間層と、その中間層の上に形成された金属メッキ層
から成る樹脂製型。(1) In a mold made using a thermosetting resin, the product shape surface of the mold includes a polymer-type conductive intermediate layer formed on the thermosetting resin and a metal plating layer formed on the intermediate layer. A resin mold made of.
なる熱硬化性樹脂に、電気メッキを施すことによって該
ポリマー型導電層上に金属メッキを形成することを特徴
とする、樹脂製型の製造方法。(2) A product made of resin, characterized in that metal plating is formed on the polymer-type conductive layer by applying electroplating to a thermosetting resin formed by forming a polymer-type conductive intermediate layer on the product shape surface. Mold manufacturing method.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265010A JPH07106576B2 (en) | 1989-10-13 | 1989-10-13 | Surface-plated resin mold and manufacturing method |
| ES90402242T ES2091810T3 (en) | 1989-08-07 | 1990-08-03 | EPOXY RESIN MOLD FILLED WITH METALLIC POWDER AND METHOD FOR ITS MANUFACTURE. |
| DE69027819T DE69027819T2 (en) | 1989-08-07 | 1990-08-03 | Mold made of metal powder-filled epoxy resin and process for its production |
| EP90402242A EP0412891B1 (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold and method of producing the same |
| US07/562,856 US5156754A (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold |
| CA002022642A CA2022642C (en) | 1989-08-07 | 1990-08-03 | Metal-powder filled epoxy resin mold and method of producing the same |
| KR1019900012064A KR920005524B1 (en) | 1989-08-07 | 1990-08-07 | Metal-powder filled epoxy resin mold and method of producing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1265010A JPH07106576B2 (en) | 1989-10-13 | 1989-10-13 | Surface-plated resin mold and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126508A true JPH03126508A (en) | 1991-05-29 |
| JPH07106576B2 JPH07106576B2 (en) | 1995-11-15 |
Family
ID=17411325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1265010A Expired - Fee Related JPH07106576B2 (en) | 1989-08-07 | 1989-10-13 | Surface-plated resin mold and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07106576B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469216A (en) * | 1990-07-11 | 1992-03-04 | Kuniaki Itou | Mold of thermally curable resin and its manufacture |
| JPH0664823U (en) * | 1991-12-10 | 1994-09-13 | 車体工業株式会社 | Product mold |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324370U (en) * | 1976-08-06 | 1978-03-01 |
-
1989
- 1989-10-13 JP JP1265010A patent/JPH07106576B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324370U (en) * | 1976-08-06 | 1978-03-01 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0469216A (en) * | 1990-07-11 | 1992-03-04 | Kuniaki Itou | Mold of thermally curable resin and its manufacture |
| JPH0664823U (en) * | 1991-12-10 | 1994-09-13 | 車体工業株式会社 | Product mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07106576B2 (en) | 1995-11-15 |
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