JPH03126363U - - Google Patents
Info
- Publication number
- JPH03126363U JPH03126363U JP3650990U JP3650990U JPH03126363U JP H03126363 U JPH03126363 U JP H03126363U JP 3650990 U JP3650990 U JP 3650990U JP 3650990 U JP3650990 U JP 3650990U JP H03126363 U JPH03126363 U JP H03126363U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film substrate
- lead wire
- solder
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3650990U JPH03126363U (sh) | 1990-04-03 | 1990-04-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3650990U JPH03126363U (sh) | 1990-04-03 | 1990-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03126363U true JPH03126363U (sh) | 1991-12-19 |
Family
ID=31542802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3650990U Pending JPH03126363U (sh) | 1990-04-03 | 1990-04-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03126363U (sh) |
-
1990
- 1990-04-03 JP JP3650990U patent/JPH03126363U/ja active Pending