JPH03126300A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To enable positional deviation, lifting, etc., to be detected accurately by roughly correcting the positional deviation of a chip by a rough correction device and then by measuring the lead of this chip using a fine measuring device. CONSTITUTION:The tip part of a lead L of a chip P contacts press-contact parts 44 and 45 and the positional deviation can be corrected by enabling an X table 21 to slide in XY direction. When the chip P is roughly corrected in this manner, a transfer head 7 arrives at the upper part of the chip P, moves this chip P to an area directly above a laser device C by taking it up, moves in XY direction there, and then performs scanning of laser light in direction S crossing the lead L protruding from four sides (a), (b), (c) and (d) of a molded body M, thus enabling a precise positional deviation, lifting, presence/absence, etc., of the lead L to be measured precisely, and the positional deviation of the tip P to be corrected, and them mounting it onto a printed circuit board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus, and more particularly to an apparatus for mounting a chip having leads such as a QFP on a board at high speed and with high precision.

(Prior Art) An electronic component mounting apparatus that mounts electronic components (hereinafter referred to as chips) such as IC chips and LS'l chips on a substrate is configured to transfer chips from a chip supply section such as a tray to a nozzle of a transfer head. The device is picked up by suction, corrected for positional deviation in the XYθ directions, and then mounted on a board positioned in a positioning section.

Conventionally, as a means for correcting positional deviation in the xyθ directions, as shown in FIG. Are known.

To explain its operation, first, the sub transfer head 105
The chip P in the chip supply section 101 is transferred to the table 104 by moving in the Y force direction, and the positional shift of the chip P in the XYθ directions is detected by the CCD camera 106 provided on the table 104. Next, nozzle 1 of transfer head 107
08 lands on the center of the chip P, picks up the chip P, and transfers and mounts the chip P on the board 102. At this time, the positional deviation of the chip P in the XY force direction is caused by the
In the Y direction stroke, the XY detected as above
This is corrected by adding a correction value based on the positional deviation in the force direction, and the positional deviation in the θ direction is corrected by moving the nozzle 108 in the θ direction (centered on the axis of the nozzle 108) by a motor 109 installed in the transfer head 107. Correct by rotating in the rotation direction).

(Problems to be Solved by the Invention) However, the above conventional means has the following problems.

(1) In a chip P having leads such as a QFP, the leads are connected to the lands of the circuit pattern printed on the substrate (
However, in recent years, the number of leads has been increasing, and many extremely thin leads are protruding with a small pinch, so it is possible to accurately detect lead misalignment. need to be detected. However, the above C
With the observation means using the CD camera 106, it is difficult to accurately detect positional deviation of the lead.

(2) When the sub transfer head 105 arrives on the observation table 104 and is loading the chip P on the table 104, when the transfer head 107 arrives on the table 104 to pick up the chip P. , sub transfer head 1
05 and the transfer head 107 collide. Therefore, the timings at which the heads 105 and 107 arrive on the table 104 must be staggered, which causes dead time and reduces work efficiency.

(3) Also, the leads have floats and bends, which prevent the leads from landing accurately on the lands of the circuit pattern, so such chips must be removed as defective products. However, with the above CCD camera, it is difficult or impossible to detect floating or bending of the lead.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus that solves the problems of the conventional means described above.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component mounting apparatus in which a chi knob of a chip supply section is transferred and mounted on a board positioned in a positioning section. Between the positioning sections, there is an XY child table on which chips are transferred from the chip supply section by a sub-transfer head, and by the sliding of this XY child table in the XY force direction, the tip of the lead of the chip on this XY child table is A rough correction device including a position regulating member for roughly correcting the positional deviation of the chip by pressing is provided, and the rough-corrected chip is picked up by a transfer head and positioned in the positioning section. A micromeasuring device for micromeasuring the leads protruding from the chip is provided on the transfer path for transferring the chips to the substrate.

(Function) In the above configuration, the chip in the chip supply unit is transferred onto the XY child table by the sub-transfer head.Then, by sliding this XY child table in the XY force direction, the tip of the chip lead is positioned. Press against the regulating member and
Rough correction of positional deviation in the θ direction is performed. The chip that has been roughly corrected is then picked up by a transfer head and transferred to a fine measurement device. After precisely measuring lead misalignment and floating, the chip is mounted on a board after correcting this misalignment. .

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, and FIG. 2 is a plan view of the same.
, a laser device C as a micromeasuring device, and a positioning section for the substrate 1. A tray 2 is provided in the chip supply section A, and a chip P having a lead such as a QFP is stored in a pocket of the tray 2. In addition to the tray 2, tape feeders, tube feeders, and the like are often used as chip supply units.

The rough correction device B roughly corrects the positional deviation of the chip P to ensure that the lead enters the measurement area of the laser device C prior to precise measurement of the lead by the laser device C, and the details will be described later. do. Reference numeral 3 denotes a sub-transfer head that moves in the XY force direction, picks up the chips P from the chip supply section A to the nozzle 4, and transfers and loads them onto the rough correction device B.

The laser device C is disposed on a path for transporting the chip P from the rough correction device B to the positioning section.

The upper surface of the laser device C has a V-shaped notch, and a laser emitting section 5 and a light receiving section 6 are provided on the slope thereof. 7
is a transfer head that moves in the XY force direction, picks up the chip P that has been roughly corrected in the rough correction device B to the nozzle 8, transfers it to the upper part of the laser device C, and transfers it to the top of the laser device C, where it is By moving in the force direction, the laser light emitted from the laser emitting section 5 is irradiated in a direction across the leads protruding in large numbers from each side of the chip P, and the reflected light is received by the light receiving section 6. It precisely measures the positional deviation, floating, presence or absence of the lead, etc.

The positioning section includes clamp members 9, 9 for clamping and fixing the substrate 1 from both sides. Reference numeral 10 denotes a conveyor for carrying the substrate 1 into the positioning section and carrying it out from there. Note that a description of well-known mechanisms such as means for moving the transfer heads 3 and 7 in the x and y directions will be omitted. Next, the detailed structure of the rough correction device B will be explained.

In FIGS. 1 and 2, reference numeral 1) is a base plate, on which a cylinder 12 is disposed on the top side and a Y rail 13 on the other side.

14 is a rotary arm provided on the cylinder 12 so as to be horizontally rotatable about a hinge 15; 16 is a roll attached to its tip; and 17 and 18 are air tubes. When air enters and exits from tubes 17 and 18, rotating arm 1
4 rotates around the hinge portion 15 in horizontal directions Nl and N2.

1 and 3, 21 is a Y table slidably disposed on the Y rail 13 via a slider 22, 23 is an X rail provided on the Y table 21, 2
Reference numeral 4 denotes an X table that is slidably disposed on the X rail 23 via a slider 25. The X table 24 is biased toward the cylinder 12 by a coil spring member 26 .

This is a bracket attached to the side surface of the 2'lY table 21 and extends above the cylinder 12. A long hole 28 is formed in this bracket 27, and the roll 16 is fitted into this long hole 28. Therefore, as described above, the rotating arm 14 horizontally rotates, and the roll 1
6 rotates in the N1 direction, the Y table 21 slides in the Y1 direction along the Y rail 13, and the roll 16 rotates in the N2 direction.
When rotated in the direction, the Y table 21 slides in the Y2 direction.

31 is a bracket provided on the rear edge of the base plate 1), and a lever 33 in the shape of an abbreviation is pivoted to a pin 32 so as to be horizontally rotatable (see also FIG. 4). Rolls 34, 35 are mounted on the shaft. 36 is a coil spring member that biases the lever 33 in the counterclockwise direction in FIG. 4, and 49 is a stopper. A notch 37 is formed at the end corner of the Y table 21, and the roll 34 is pressed against this notch 37, as will be described later.

Further, a side plate 38 is attached to the side surface of the X table 24, and the roll 35 is pressed against this side plate 38. Second
In the figure, 39 is a small hole drilled in the X table 24;
A suction tube 40 is connected to the X table 24, and its suction force attracts the chip P on the X table 24 so that it does not shake.

In FIG. 1, reference numerals 41 and 42 are pillars erected in the base material 1), and a key-shaped position regulating member 43 is attached to the upper part.
is provided. This position regulating member 43 is located directly above the X table 24, and is provided with an X-direction pressing portion 44 and a Y-direction pressing portion 45 on its orthogonal inner surface. Further, the side surface S of the pressing portion 44,45 is a tapered surface.

This device has the above-mentioned configuration, and the overall operation will be explained below.

Initially, roll 16. The XY tables 21, 24, etc. are located at the positions shown in FIG.
It is located at the position shown by (also the solid line position in FIG. 2). In this state, the sub-transfer head 3 picks up the chip P from the chip supply section A and mounts it on the X table 24. Note that the sub-transfer head 3 has a position regulating member 4 regardless of the size of the chip P.
The chip P is mounted on the X table 24 so that the edge e (see FIG. 2) facing the chip P lands on the same spot.

Next, the cylinder 12 is actuated, and in FIG. 4, the roll 16 is rotated in the N1 direction from 16a to the position indicated by 16b. The rotation of this roll 16 causes the X table 21 and the X table 24 on this X table 21 to
slides a distance y1 in the X1 direction along the Y rail 13,
It slides from the positions 21a and 24a to the positions 21b and 24b.

In this position, the roll 34 presses against the notch 37 of the X-table 21, but the roll 16 still rotates from 16b to the position 16C, and the X-table 21 moves a distance from 21b to the position 21c. By sliding y2, the roll 34 is pushed by the notch 37 and rotates slightly clockwise from the solid line position m to the chain line position n in FIG.

Then, the lever 33 rotates slightly clockwise, the other roll 35 presses against the side plate 38 of the X table 24, and the
The table 21 is slid a distance x1 in the X1 direction. In FIG. 4, numerals 16c, 21c, 24c, and 28c indicate the final positions of the respective members xi and yl slid in this manner.

In this way, the X table 21 has a distance xi in the XY force direction,
By sliding, the tip of the lead of the chip P comes into contact with the pressing portions 44 and 45, and the positional deviation in the XYθ directions is corrected.

However, with such a correction means, it is difficult to accurately correct the positional deviation of the chip P so as to satisfy the required mounting accuracy.

Therefore, this correction is a rough correction performed to ensure that the lead L is located in the measurement area of the laser device C, and a precise correction is performed following this rough correction.
This is done by

Once the chip P has been roughly corrected in this way, the transfer head 7 arrives above the chip P, picks up the chip P, and transfers it directly above the laser equipment Hc, where it is shown in FIG. As shown in the figure, by moving in the XY force directions and scanning the laser beam in the direction S that crosses the leads L protruding from the four sides a, b, c, and d of the mold body M, the precise position of the leads can be determined. Misalignment, lifting,
After measuring the presence or absence of the chip P and correcting the positional deviation of the chip P in the XYθ directions, the chip P is mounted on the substrate l.

This positional deviation correction is performed by well-known correction means such as correction of the XY direction stroke of the transfer head 7 and θ rotation of the nozzle 8. The beam of the laser beam of the laser device C is extremely fine, and the position of the object can be measured with extremely high precision from the incident position of the reflected light from the object to the light receiving section 6. Therefore, the laser device C By using this, it is possible to precisely measure the positional deviation and floating of the lead.

Moreover, in FIG. 2, Ql, Q2. Q3 is the trajectory of the sub transfer head 3, the XYX table 2124, and the transfer head 7, respectively, and the transfer of the chip P from the tray 2 to the substrate 1 is shared by these three parties 3, 21, 24, and 7. ing.

In other words, the chip P is transferred only by both heads 3.7 (,
It is also shared by the XYX table 2124, and the shared distance is approximately equal to the distance y1. Like this
By sharing the transfer of the chips P with the YX table 2124, the strokes of both heads 3 and 7 are correspondingly shortened, and the chips P of the tray 2 are transferred to the substrate 1 at a higher speed.
It can be transported and loaded.

Note that for chips that require low mounting accuracy and do not require precise correction, the chip that has been roughly corrected by the rough correction device B can be picked up by the transfer head 7 to perform precise correction. Instead, the mounting speed may be increased by transferring and mounting the laser device directly onto the substrate 1, and in this case, the laser device C is not necessary. Further, the fine measurement device is not limited to the laser device C, but may be, for example, a near image sensor device.

(Embodiment 2) FIG. 7 shows another embodiment of the XY child table driving means, in which 51.52 is the Y rail for the XY child table 53, and 54.55 is for the X table 51 and the X table 52. The X rail and slider provided in between, 63 is the X table 5
It is a spring material that urges 1 to the right. A nut portion 56 is coupled to the X table 52, and this nut portion 56 is driven and rotated by a motor 58 via a belt 57 or the like.

A feed screw 59 is screwed into the nut portion 56 and is arranged in the Y direction.

60 is a roll provided on the side of the X table 51, 61
is a guide member that guides this roll 60. This guide member 61 is disposed in the Y direction and has a straight portion 61a in the Y direction and a tapered portion 61b at the tip thereof. 62 is a position regulating member.

Therefore, in this device, when the motor 58 is driven,
The table 5152 moves straight in the Y direction along the straight part 61a of the guide member 61, and when the roller 60 reaches the tapered part 61b, the X table moves slightly in the X direction, and the tip of the lead of the chip P is positioned. By pressing against the member 62, the positional deviation is corrected.

FIG. 8 is a velocity diagram, and in the straight section 61a,
The YX table 5152 moves in the Y direction at high speed, and the tip of the lead presses against the position regulating member 62 at the tapered portion 61b.
Now move at low speed. In this way, the straight portion 61a
Since it moves at high speed along the tapered portion 61b, the working speed increases, and because it moves at a low speed along the tapered portion 61b, there is an advantage that the positional deviation can be corrected without giving an impact to the chip P.

(Effects of the Invention) As explained above, the present invention first coarsely corrects the positional deviation of the chip using a rough correction device, and then measures the lead of this chip using a fine measurement device. It can be placed in the measurement area of a micro-measuring device to perform precise measurements and accurately detect misalignment, floating, etc. Therefore, it is extremely suitable for chips such as QFP, which require high mounting accuracy. It can be mounted on the board with high precision. In addition, since an XY child table is interposed between the sub transfer head and the transfer head, there is no risk of collision between the two heads, and both heads can freely move in the X and Y directions regardless of the other. Can be implemented quickly. Furthermore, for chips that do not require precise correction, the mounting speed can be increased by performing rough correction with a rough correction device and then transferring and mounting them on the board as they are.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of an electronic component mounting apparatus, Fig. 2 is a plan view thereof, Fig. 3 is a partial front view, and Fig. 4 is a plane showing the operation. Figure 5 is a partial sectional view, Figure 6 is a perspective view of the lead being measured with a laser device,
FIG. 7 is a plan view of another embodiment of the XY child table, FIG. 8 is a velocity diagram, and FIG. 9 is a plan view of a conventional device. A...Chip supply section B...Rough correction device C...Fine measurement device D...Positioning section P...Chip L...Lead...Substrate 3...Sub transfer head 7. ...Transfer head 21.24, 51.52...XY child table 3.62
...Position regulating member

Claims (2)

[Claims] (1) In an electronic component mounting apparatus that transfers and mounts chips in a chip supply section onto a board positioned in a positioning section, the chip supply section is placed between the chip supply section and the positioning section by a sub-transfer head. An XY table to which the chip is transferred, and a position where the tip of the lead of the chip on the XY table is pressed to roughly correct the positional deviation of the chip by sliding this XY table in the XY direction. A rough correction device equipped with a regulating member is provided, and the chip that has been roughly corrected is taken up by a transfer head, and the leads protruding from the chip are finely inserted into the transfer path that is transferred to the substrate positioned in the positioning section. An electronic component mounting apparatus characterized by being provided with a micromeasuring device for measuring. (2) In an electronic component mounting apparatus that transfers and mounts chips in a chip supply section onto a board positioned in a positioning section, a sub-transfer head is placed between the chip supply section and the positioning section in the chip supply section. An XY table to which the chip is transferred, and a position where the tip of the lead of the chip on the XY table is pressed to roughly correct the positional deviation of the chip by sliding this XY table in the XY direction. An electronic component mounting apparatus characterized by being provided with a roughness correction device equipped with a regulating member.