JPH03126060U - - Google Patents

Info

Publication number
JPH03126060U
JPH03126060U JP1990035864U JP3586490U JPH03126060U JP H03126060 U JPH03126060 U JP H03126060U JP 1990035864 U JP1990035864 U JP 1990035864U JP 3586490 U JP3586490 U JP 3586490U JP H03126060 U JPH03126060 U JP H03126060U
Authority
JP
Japan
Prior art keywords
conductor film
internal
semiconductor device
output
output terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990035864U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990035864U priority Critical patent/JPH03126060U/ja
Publication of JPH03126060U publication Critical patent/JPH03126060U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1990035864U 1990-04-02 1990-04-02 Pending JPH03126060U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990035864U JPH03126060U (enExample) 1990-04-02 1990-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990035864U JPH03126060U (enExample) 1990-04-02 1990-04-02

Publications (1)

Publication Number Publication Date
JPH03126060U true JPH03126060U (enExample) 1991-12-19

Family

ID=31541590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990035864U Pending JPH03126060U (enExample) 1990-04-02 1990-04-02

Country Status (1)

Country Link
JP (1) JPH03126060U (enExample)

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