JPH03126054U - - Google Patents
Info
- Publication number
- JPH03126054U JPH03126054U JP3597090U JP3597090U JPH03126054U JP H03126054 U JPH03126054 U JP H03126054U JP 3597090 U JP3597090 U JP 3597090U JP 3597090 U JP3597090 U JP 3597090U JP H03126054 U JPH03126054 U JP H03126054U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- paragraph
- description
- cutting
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Special Spraying Apparatus (AREA)
Description
第１図はウエハの切削状態を略示する説明図で
、これに本考案のノズルを切削水用として取り付
けたもの、第２図はノズルの断面図、第３図は洗
浄水として本考案のノズルの使用状態を示す説明
図、第４図は切削水用並びに洗浄水用に使用した
ときの説明図。
１……ウエハ、２……モータ、３……回転刃、
４……管、５……噴出ノズル、６……超音波振動
子、７……制御部、８……超音波振動子制御用コ
ード。
Fig. 1 is an explanatory diagram schematically showing the cutting state of a wafer, in which the nozzle of the present invention is attached for use as cutting water, Fig. 2 is a sectional view of the nozzle, and Fig. 3 is a diagram showing the nozzle of the present invention installed as a cutting water. FIG. 4 is an explanatory diagram showing how the nozzle is used, and FIG. 4 is an explanatory diagram when it is used for cutting water and cleaning water. 1...Wafer, 2...Motor, 3...Rotary blade,
4...Pipe, 5...Ejection nozzle, 6...Ultrasonic transducer, 7...Control unit, 8...Ultrasonic transducer control cord.
Claims (1)
音波振動子を設けた半導体ダイシング機の噴水ノ
ズル。 (2) 第１項の記載において、回転刃に対向して
設けられた切削水用ノズル。 (3) 第１項の記載において、ウエハの切削部及
びその周辺に向かつて設けられた洗浄水用ノズル
。[Scope of Claim for Utility Model Registration] (1) A fountain nozzle for a semiconductor dicing machine in which an ultrasonic vibrator is provided facing a water flow tube on the inner surface of a spray nozzle member. (2) In the description of paragraph 1, a cutting water nozzle provided opposite the rotating blade. (3) In the description of paragraph 1, a cleaning water nozzle provided toward the cutting part of the wafer and its surroundings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3597090U JPH03126054U (en) | 1990-04-03 | 1990-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3597090U JPH03126054U (en) | 1990-04-03 | 1990-04-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126054U true JPH03126054U (en) | 1991-12-19 |
Family
ID=31541787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3597090U Pending JPH03126054U (en) | 1990-04-03 | 1990-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126054U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012120936A1 (en) * | 2011-03-07 | 2012-09-13 | 有限会社 エー・ジー・ケー | Display panel hanging and lighting device |
| JP5086356B2 (en) * | 2007-09-21 | 2012-11-28 | 株式会社モバイルビジネスプロモート | Information display panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660677A (en) * | 1979-10-23 | 1981-05-25 | Nishihara Env San Res Co Ltd | Ultrasonic washer |
| JPS63266831A (en) * | 1987-04-24 | 1988-11-02 | Toshiba Corp | Method and apparatus for cleaning semiconductor wafer |
-
1990
- 1990-04-03 JP JP3597090U patent/JPH03126054U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660677A (en) * | 1979-10-23 | 1981-05-25 | Nishihara Env San Res Co Ltd | Ultrasonic washer |
| JPS63266831A (en) * | 1987-04-24 | 1988-11-02 | Toshiba Corp | Method and apparatus for cleaning semiconductor wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5086356B2 (en) * | 2007-09-21 | 2012-11-28 | 株式会社モバイルビジネスプロモート | Information display panel |
| WO2012120936A1 (en) * | 2011-03-07 | 2012-09-13 | 有限会社 エー・ジー・ケー | Display panel hanging and lighting device |