JPH0312554Y2 - - Google Patents
Info
- Publication number
- JPH0312554Y2 JPH0312554Y2 JP17118284U JP17118284U JPH0312554Y2 JP H0312554 Y2 JPH0312554 Y2 JP H0312554Y2 JP 17118284 U JP17118284 U JP 17118284U JP 17118284 U JP17118284 U JP 17118284U JP H0312554 Y2 JPH0312554 Y2 JP H0312554Y2
- Authority
- JP
- Japan
- Prior art keywords
- card
- electronic component
- printed circuit
- circuit board
- component structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118284U JPH0312554Y2 (US07922777-20110412-C00004.png) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17118284U JPH0312554Y2 (US07922777-20110412-C00004.png) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185481U JPS6185481U (US07922777-20110412-C00004.png) | 1986-06-05 |
| JPH0312554Y2 true JPH0312554Y2 (US07922777-20110412-C00004.png) | 1991-03-25 |
Family
ID=30728877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17118284U Expired JPH0312554Y2 (US07922777-20110412-C00004.png) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312554Y2 (US07922777-20110412-C00004.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727185Y2 (ja) * | 1988-04-11 | 1995-06-21 | アンリツ株式会社 | Ｉｃカード |
| JPH0832492B2 (ja) * | 1988-10-18 | 1996-03-29 | セイコーエプソン株式会社 | Ｉｃカードの製造方法 |
-
1984
- 1984-11-12 JP JP17118284U patent/JPH0312554Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6185481U (US07922777-20110412-C00004.png) | 1986-06-05 |
