JPH03124677U - - Google Patents
Info
- Publication number
- JPH03124677U JPH03124677U JP3314890U JP3314890U JPH03124677U JP H03124677 U JPH03124677 U JP H03124677U JP 3314890 U JP3314890 U JP 3314890U JP 3314890 U JP3314890 U JP 3314890U JP H03124677 U JPH03124677 U JP H03124677U
- Authority
- JP
- Japan
- Prior art keywords
- perforation
- hole
- wall
- insulating substrate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図及び第2図は本考案の実施例の各々平面
図及びA−A断面図、第3図は本考案の他の実施
例の平面図を示す。 1……絶縁基板、2……ミシン目、5……孔、
6……めつき層、7……内壁。
図及びA−A断面図、第3図は本考案の他の実施
例の平面図を示す。 1……絶縁基板、2……ミシン目、5……孔、
6……めつき層、7……内壁。
Claims (1)
- 絶縁基板にミシン目を形成したプリント配線板
において、ミシン目の少なくとも孔の内壁にめつ
きを設けることを特徴とするプリント配線板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3314890U JPH03124677U (ja) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3314890U JPH03124677U (ja) | 1990-03-29 | 1990-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03124677U true JPH03124677U (ja) | 1991-12-17 |
Family
ID=31536565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3314890U Pending JPH03124677U (ja) | 1990-03-29 | 1990-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03124677U (ja) |
-
1990
- 1990-03-29 JP JP3314890U patent/JPH03124677U/ja active Pending