JPH03124653U - - Google Patents

Info

Publication number

JPH03124653U

JPH03124653U JP3364690U JP3364690U JPH03124653U JP H03124653 U JPH03124653 U JP H03124653U JP 3364690 U JP3364690 U JP 3364690U JP 3364690 U JP3364690 U JP 3364690U JP H03124653 U JPH03124653 U JP H03124653U

Authority

JP

Japan

Prior art keywords

semiconductor element

mounting part

element mounting

lead frame

sealed

Prior art date

1990-03-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 10
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 238000007789 sealing Methods 0.000 claims description 2
• 239000000565 sealant Substances 0.000 claims 1
• 229910001111 Fine metal Inorganic materials 0.000 description 1

Cited By (1)