JPH03124643U - - Google Patents
Info
- Publication number
- JPH03124643U JPH03124643U JP3288190U JP3288190U JPH03124643U JP H03124643 U JPH03124643 U JP H03124643U JP 3288190 U JP3288190 U JP 3288190U JP 3288190 U JP3288190 U JP 3288190U JP H03124643 U JPH03124643 U JP H03124643U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- chip
- flexible substrate
- wiring
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3288190U JPH03124643U (en:Method) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3288190U JPH03124643U (en:Method) | 1990-03-30 | 1990-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124643U true JPH03124643U (en:Method) | 1991-12-17 |
Family
ID=31536126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3288190U Pending JPH03124643U (en:Method) | 1990-03-30 | 1990-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124643U (en:Method) |
-
1990
- 1990-03-30 JP JP3288190U patent/JPH03124643U/ja active Pending