JPH03124636U - - Google Patents
Info
- Publication number
- JPH03124636U JPH03124636U JP1990033129U JP3312990U JPH03124636U JP H03124636 U JPH03124636 U JP H03124636U JP 1990033129 U JP1990033129 U JP 1990033129U JP 3312990 U JP3312990 U JP 3312990U JP H03124636 U JPH03124636 U JP H03124636U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- wiring
- insulating layer
- layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990033129U JPH03124636U (US06277897-20010821-C00009.png) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990033129U JPH03124636U (US06277897-20010821-C00009.png) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124636U true JPH03124636U (US06277897-20010821-C00009.png) | 1991-12-17 |
Family
ID=31536531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990033129U Pending JPH03124636U (US06277897-20010821-C00009.png) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124636U (US06277897-20010821-C00009.png) |
-
1990
- 1990-03-29 JP JP1990033129U patent/JPH03124636U/ja active Pending
