JPH03124486U - - Google Patents
Info
- Publication number
- JPH03124486U JPH03124486U JP3471290U JP3471290U JPH03124486U JP H03124486 U JPH03124486 U JP H03124486U JP 3471290 U JP3471290 U JP 3471290U JP 3471290 U JP3471290 U JP 3471290U JP H03124486 U JPH03124486 U JP H03124486U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- view
- stacked
- insert
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471290U JPH03124486U (es) | 1990-03-29 | 1990-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3471290U JPH03124486U (es) | 1990-03-29 | 1990-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124486U true JPH03124486U (es) | 1991-12-17 |
Family
ID=31539429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3471290U Pending JPH03124486U (es) | 1990-03-29 | 1990-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124486U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
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1990
- 1990-03-29 JP JP3471290U patent/JPH03124486U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |