JPH03122578U - - Google Patents

Info

Publication number
JPH03122578U
JPH03122578U JP1990030864U JP3086490U JPH03122578U JP H03122578 U JPH03122578 U JP H03122578U JP 1990030864 U JP1990030864 U JP 1990030864U JP 3086490 U JP3086490 U JP 3086490U JP H03122578 U JPH03122578 U JP H03122578U
Authority
JP
Japan
Prior art keywords
substrate
pattern
insulating film
electronic element
land pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990030864U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990030864U priority Critical patent/JPH03122578U/ja
Priority to DE4108998A priority patent/DE4108998A1/de
Priority to US07/675,000 priority patent/US5132864A/en
Publication of JPH03122578U publication Critical patent/JPH03122578U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP1990030864U 1990-03-26 1990-03-26 Pending JPH03122578U (US06256357-20010703-M00001.png)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1990030864U JPH03122578U (US06256357-20010703-M00001.png) 1990-03-26 1990-03-26
DE4108998A DE4108998A1 (de) 1990-03-26 1991-03-19 Gedruckte leiterplatte
US07/675,000 US5132864A (en) 1990-03-26 1991-03-26 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990030864U JPH03122578U (US06256357-20010703-M00001.png) 1990-03-26 1990-03-26

Publications (1)

Publication Number Publication Date
JPH03122578U true JPH03122578U (US06256357-20010703-M00001.png) 1991-12-13

Family

ID=12315594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990030864U Pending JPH03122578U (US06256357-20010703-M00001.png) 1990-03-26 1990-03-26

Country Status (3)

Country Link
US (1) US5132864A (US06256357-20010703-M00001.png)
JP (1) JPH03122578U (US06256357-20010703-M00001.png)
DE (1) DE4108998A1 (US06256357-20010703-M00001.png)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9223008D0 (en) * 1992-11-03 1992-12-16 Smiths Industries Plc Electrical assemblies
JP3231225B2 (ja) * 1995-09-18 2001-11-19 アルプス電気株式会社 プリント配線基板
US6169253B1 (en) * 1998-06-08 2001-01-02 Visteon Global Technologies, Inc. Solder resist window configurations for solder paste overprinting
JP3604066B2 (ja) * 1998-12-28 2004-12-22 松下電器産業株式会社 起振機保持装置およびこれを備えた携帯用電子機器
US6272018B1 (en) * 1999-02-11 2001-08-07 Original Solutions Inc. Method for the verification of the polarity and presence of components on a printed circuit board
JP2008210993A (ja) * 2007-02-26 2008-09-11 Nec Corp プリント配線板及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1152809A (en) * 1968-05-07 1969-05-21 Standard Telephones Cables Ltd Electric Circuit Assembly
JPS55156482U (US06256357-20010703-M00001.png) * 1979-04-26 1980-11-11
JPS5724775U (US06256357-20010703-M00001.png) * 1980-07-17 1982-02-08
US4774634A (en) * 1986-01-21 1988-09-27 Key Tronic Corporation Printed circuit board assembly
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造

Also Published As

Publication number Publication date
DE4108998A1 (de) 1991-10-02
US5132864A (en) 1992-07-21

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