JPH03122571U - - Google Patents

Info

Publication number
JPH03122571U
JPH03122571U JP3061290U JP3061290U JPH03122571U JP H03122571 U JPH03122571 U JP H03122571U JP 3061290 U JP3061290 U JP 3061290U JP 3061290 U JP3061290 U JP 3061290U JP H03122571 U JPH03122571 U JP H03122571U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
metal
insulating layer
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3061290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3061290U priority Critical patent/JPH03122571U/ja
Publication of JPH03122571U publication Critical patent/JPH03122571U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP3061290U 1990-03-27 1990-03-27 Pending JPH03122571U (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3061290U JPH03122571U (hu) 1990-03-27 1990-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3061290U JPH03122571U (hu) 1990-03-27 1990-03-27

Publications (1)

Publication Number Publication Date
JPH03122571U true JPH03122571U (hu) 1991-12-13

Family

ID=31533321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3061290U Pending JPH03122571U (hu) 1990-03-27 1990-03-27

Country Status (1)

Country Link
JP (1) JPH03122571U (hu)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607792A (ja) * 1983-06-28 1985-01-16 株式会社東芝 耐熱性絶縁基板およびその製造法
JPS61241150A (ja) * 1985-04-18 1986-10-27 松下電器産業株式会社 金属ベ−スプリント基板の製造方法
JPS61241151A (ja) * 1985-04-19 1986-10-27 松下電器産業株式会社 金属ベ−スプリント基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607792A (ja) * 1983-06-28 1985-01-16 株式会社東芝 耐熱性絶縁基板およびその製造法
JPS61241150A (ja) * 1985-04-18 1986-10-27 松下電器産業株式会社 金属ベ−スプリント基板の製造方法
JPS61241151A (ja) * 1985-04-19 1986-10-27 松下電器産業株式会社 金属ベ−スプリント基板の製造方法

Similar Documents

Publication Publication Date Title
JPH03122571U (hu)
JPS6380880U (hu)
JPH0172313U (hu)
JPH02126146U (hu)
JPS6085841U (ja) サブマウント
JPS6387024U (hu)
JPS62136544U (hu)
JPS583239U (ja) アルミ箔と不燃性シ−トの複合材
JPS62192671U (hu)
JPH0395676U (hu)
JPS61158025U (hu)
JPH0337715U (hu)
JPS6153131U (hu)
JPH01100471U (hu)
JPH0392069U (hu)
JPS6011928U (ja) 防水構造
JPH03102767U (hu)
JPH0391196U (hu)
JPS63172174U (hu)
JPS63140696U (hu)
JPS5964238U (ja) 化粧積層板
JPS60181812U (ja) 導電性シ−ト
JPS6140718U (ja) 転写磁気シ−ト
JPS63116682U (hu)
JPH0295628U (hu)