JPH03121602A - Connection structure of microwave integrated circuit - Google Patents

Abstract

PURPOSE:To prevent the reduction in a return loss by providing a capacitive element connected to the ground to cancel an inductive component of the 1st and 2nd connection lines connected in series at the connecting point of the 1st and 2nd connection lines connected in series. CONSTITUTION:A grounding capacitive element 5 is connected to the connecting point between the 1st and 2nd connection lines 3, 4 connected in series. Thus, it is possible to cancel the inductive component of the 1st and 2nd connection lines 3, 4 connected in series by the capacitive component 5. Thus, even when the length of the connection wire between microwave integrated circuit modules is prolonged to some extent depending on the mounting condition, the deterioration in the return loss is suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection structure for a plurality of microwave integrated circuit modules.

3. Detailed description of the invention [Summary] Connection structure of multiple microwave integrated circuit modules [Prior art] In recent microwave radio equipment, circuits such as amplifiers, frequency mixers, and attenuators are each connected to a small microwave Integrated circuit modules (hereinafter referred to as MIC modules) are individually provided, and a desired wireless device is configured by mounting a plurality of these MIC modules. This MIC module may be connected to other circuits other than the MIC module before and after it, but there are also cases where several stages of MIC modules are connected in succession, and in this case, a microstrip line for connection is used. A method is often used in which the MIC modules are directly connected using only connection lines without using a MIC module.

FIG. 6 is a diagram showing the connection structure of the MIC module in the conventional example.
This is an example of a three-stage connection of a third MIC 13 and a third MIC 13.

For example, a metal package is used for each M I C Il, 12.13, and the signal input/output terminal sections 31 to 36 have a microstrip line structure. Further, insulating parts 41 to 46 are provided on both sides of each input/output terminal part 31 to 36 to ensure electrical insulation in the input/output terminal parts 31 to 36. Note that each of the M I C11 and 12.13 is connected to each other using a gold wire 21 and a gold wire 22 for connection, respectively. In order to further reduce the connection impedance, a plurality of gold wires 21 and 22 for connection may be connected in parallel, or a gold ribbon may be used in place of the gold wires 21 and 22 for connection. When using a long money ribbon, it is made to have some length to prevent it from breaking due to expansion and contraction due to temperature changes.

In the case of a connection using a gold wire 21.22 or a gold ribbon for such a connection, at high frequencies where this gold wire 2L22 or gold ribbon has an inductance component, there is a There will be impedance mismatch between the two. In this case, the horizontal axis is the frequency, and the vertical axis is the return loss (reflected power/
The ratio of input power (expressed in dB) is shown in Figure 7.
It is a diagram. Figure 7 shows diameter 25 microns, length Q, 8*
An example is shown in which gold wires of m length are used to connect two tree branch arrays, and the return loss in this case is about 15 dB or less.

Note that in order to increase this return loss and make a good connection, the connection interval S can be made small, but for this purpose, it is necessary to increase the dimensional accuracy of each package of each M I C11 and 12.13. In this case, MfC becomes high-value. Therefore, it is inevitable that a certain connection interval S is required.

[Problem to be solved by the invention]

This conventional connection structure has the problem that the length of the connection wire cannot be shortened below a certain length because it requires a certain connection interval between the MIC modules, and therefore a sufficiently large return loss cannot be obtained. .

An object of the present invention is to provide a connection structure that can obtain a large return loss without reducing the connection interval of MIC modules and shortening the connection wire length.

[Means to solve the problem]

In the present invention, a first connecting line 3 connects a plurality of first microwave integrated circuits 1 and a plurality of second microwave integrated circuits 2 in series.
and a second connection line 4, at a connection point between the first connection line 3 and the second connection line 4 connected in series, the first connection line connected in series A capacitive element 5 connected to ground is provided in order to cancel the inductance component of the second connection line 3 and the second connection line 4.

[For production]

In the present invention, as shown in FIG. 1, a capacitive element 5 is connected to a connection point between a first connection line 3 and a second connection line 4 connected in series.

Therefore, this capacitive element 5 makes it possible to cancel out the inductance component of the first connection line 3 and second connection line 4 connected in series, thereby preventing a decrease in return loss due to the connection.

〔Example〕

FIG. 2 is a diagram showing an example of the connection structure of the MIC module according to the present invention. In the figure, II is the second MIC 12.L22 is the gold wire for connection, 14 is the microstrip line, and 15 is the dielectric substrate.The capacitance component is generated by the distributed constant circuit of the dielectric substrate 15 and the microstrip line 14. has been realized.

-MICII and the microstrip line 14 are connected, for example, by a gold wire 21, and the microstrip line 14 and the MIC 12 are connected, for example, by a gold wire 22, respectively. When the frequency of the signal being handled is in the microwave band, the gold wire 21 and the gold wire 22 become inductive and have an inductance component. In the present invention, the inductance component of the gold wire 21 and the gold wire 22 is replaced by a capacitance component formed by a distributed constant circuit of the dielectric substrate 15 and the microstrip line 14 connected to the connection point of the gold wire 21 and the gold wire 22. I'm trying to cancel it out.

FIG. 3 is a characteristic diagram of return loss in one embodiment of the present invention shown in FIG. In this parallel connection, and the dielectric substrate 15 has ε, =9
．． In this example, a ceramic substrate No. 7 is used, and the microstrip line 14 has a width of 0.36 mm and a length of 0.9 mm. As shown in FIG. 3, a minimum return loss of about 26 dB was obtained.

FIG. 4 is a diagram showing another example of the connection structure of the MIG module according to the present invention, in which a chip capacitor 16 is used as the capacitance component in FIG. 2, and the other configuration is the same as that in FIG. 2. be. Figure 5 is a characteristic diagram of return loss in the connection structure of Figure 4, and the circuit constants are 21.22 for a gold wire with a diameter of 25 μm and a length of 0.8 fins.
In this parallel connection, the chip capacitor 16 is set to 0.2 pF. As shown in FIG. 5, since a lumped constant capacitance is used, a good return loss can be obtained over a wide frequency band, and therefore a return loss of at least about 30 dB can be obtained. Although gold wires 21 and 22 were used as connection wires, similar characteristics can be obtained with gold ribbons by appropriately selecting the capacitance of the chip capacitor 16.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, the MIC
Even if the length of connection wires between modules becomes long to some extent due to mounting conditions, return loss can be suppressed by canceling it out in combination with capacitance.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the principle configuration of the present invention. FIG. 2 is a diagram showing an example of the connection structure of the MIC module in the present invention. FIG. 3 is a characteristic diagram of return loss in an embodiment of the present invention. The figure shows another example of the connection structure of the MIC module according to the present invention. Figure 5 is a characteristic diagram of return loss in another embodiment of the present invention. Figure 6 shows the connection structure of the MIC module in the conventional example. The figure shown in FIG. 7 is a characteristic diagram of return loss in a conventional example. In the figure, 1 is a first microwave integrated circuit, 2 is a second microwave integrated circuit, 3 is a first connection line, 4 is a second connection line, and 5 is a capacitive element. Figure 1 Figure 4 of Fukane Moe 4 Original If Sacred Qnet! gFI's P! -Starting the year on the left with skill 7-Ziros 4 tang site fullffi Fig. 5 <4. /l M I C module's concubine - 〇 beak zukuri - G J not T figure 2 carving I light GHf) throat must θb - large r service ρJ7/lrl Ku > a, 7 #Ba-Town Conventional Iika NTC Mori-ru n Risu I Takezo 9
Reriro Figure 6 Dark grain (GHz) 4) 1 zu 1 Sanyu plow 4 Wari y->a Shikotori 4 convex bow:
I'm not? Figure 7

Claims (1)

[Claims] A first connection line (3) connecting a plurality of first microwave integrated circuits (1) and second microwave integrated circuits (2) in series.
and a second connecting line (4), at a connection point between the first connecting line (3) and the second connecting line (4), which are connected in series. A capacitive element (
5) A connection structure for a microwave integrated circuit characterized by providing the following.