JPH03121174A - Bonding method - Google Patents
Bonding methodInfo
- Publication number
- JPH03121174A JPH03121174A JP25910989A JP25910989A JPH03121174A JP H03121174 A JPH03121174 A JP H03121174A JP 25910989 A JP25910989 A JP 25910989A JP 25910989 A JP25910989 A JP 25910989A JP H03121174 A JPH03121174 A JP H03121174A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- articles
- adhesive tape
- self
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 52
- 230000001070 adhesive effect Effects 0.000 claims abstract description 51
- 239000002390 adhesive tape Substances 0.000 claims abstract description 31
- 239000003960 organic solvent Substances 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003522 acrylic cement Substances 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- -1 isocyanate compound Chemical class 0.000 description 2
- 239000011505 plaster Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は２つの物品を接着する方法、より詳しくは、２
つの物品を接着剤により接着する方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for bonding two articles, more specifically to a method for bonding two articles together.
The present invention relates to a method of bonding two articles together using an adhesive.
従来、粘着テープで二物品を仮止めして接着剤により接
着する方法が知られている。しかしながらこの方法にあ
っては、接着剤に含まれている揮発成分が発散すること
により接着剤の体積が減少する一方、粘着テープはその
厚さを維持するため、接着剤の有効接着面積が減少し良
好な結果を得られないことがあった。特に、木造の建築
物を接着する際は粗面であることも相俟って厚い粘着テ
ープを用いることが必要であり、このような箇所に上記
方法を用いる出接着剤の有効接着面積が極めて少なくな
り、その目的を果たさなくなるため殆ど実用化されてい
ないのが現状である。BACKGROUND ART Conventionally, a method is known in which two articles are temporarily attached with an adhesive tape and then bonded with an adhesive. However, with this method, the volume of the adhesive decreases due to volatile components contained in the adhesive dissipating, while the adhesive tape maintains its thickness, reducing the effective bonding area of the adhesive. However, sometimes good results could not be obtained. In particular, when gluing wooden buildings, it is necessary to use thick adhesive tape due to the rough surface, and the effective bonding area of the adhesive used in the above method is extremely large. The current situation is that it is rarely put into practical use because it no longer serves its purpose.
現在、粘着テープに替えて釘で仮止めし、接着剤で接着
する方法が行われているが、釘穴があき外観が良くない
という問題がある。また、釘の打てない箇所には使用で
きず、接着剤が硬化するまでつっかえ棒などで支えたり
している。Currently, instead of using adhesive tape, a method of temporary fixing with nails and gluing with adhesive is being used, but there is a problem that the appearance is not good because of the nail holes. Also, it cannot be used in areas where nails cannot be driven, and the glue must be supported with a holding bar until the adhesive hardens.
そこで、本発明者らは接着剤の収縮にあわせ仮止めに用
いる粘着テープも収縮させれば上記課題を解決できるこ
とを発見し本発明に至ったものである。Therefore, the present inventors discovered that the above problem could be solved by shrinking the adhesive tape used for temporary fixing in accordance with the shrinkage of the adhesive, which led to the present invention.
即ち本発明は、二物品を接着剤で接着する方法において
、厚さ方向に収縮する粘着テープにより該二物品を仮止
めすると共に、該二物品の少なくともどちらか一方の接
着面表面に接着剤を塗布することを特徴とするものであ
る。That is, the present invention provides a method for bonding two articles with an adhesive, in which the two articles are temporarily attached using an adhesive tape that shrinks in the thickness direction, and an adhesive is applied to the adhesive surface of at least one of the two articles. It is characterized by being applied.
本発明で用いられる接着剤は、通常用いられているもの
であれば特に限定されず、例えば酢酸ビニル系接着剤、
エポキシ系接着剤、ゴム系接着剤、アクリル系接着剤等
を例示することができる。The adhesive used in the present invention is not particularly limited as long as it is commonly used, such as vinyl acetate adhesive,
Examples include epoxy adhesives, rubber adhesives, and acrylic adhesives.
これら接着剤は通常塗布作業性を考慮して、固形分が３
０〜６０重量％となるように、水あるいは有機溶剤など
に分散、溶解して用いられる。These adhesives usually have a solid content of 3.
It is used after being dispersed or dissolved in water or an organic solvent to a concentration of 0 to 60% by weight.
また、本発明で用いられる粘着テープは、厚さ方向に収
縮するものである。そのような粘着テープの例としては
、テープを構成する基材あるいは粘着剤の少なくとも一
方を水または有機溶剤で膨潤させた粘着テープを挙げる
ことができ、水または有機溶剤が揮発して粘着テープが
収縮するものである。Further, the adhesive tape used in the present invention shrinks in the thickness direction. An example of such an adhesive tape is an adhesive tape in which at least one of the base material or the adhesive constituting the tape is swollen with water or an organic solvent, and the adhesive tape evaporates when the water or organic solvent evaporates. It is something that contracts.
本発明に用いられる粘着テープの収縮率は接着剤の種類
や接着剤中の揮発成分の量などにより変化するが、通常
１．２倍〜５倍、好ましくは２〜３倍とされる。より好
ましくは、接着剤の収縮率とほぼ同一の収縮率とされる
。収縮率が大きすぎると粘着テープの接着力が低下する
傾向があり、小さすぎると接着剤の収縮に追従できなく
なるおそれがある。The shrinkage rate of the adhesive tape used in the present invention varies depending on the type of adhesive, the amount of volatile components in the adhesive, etc., but is usually 1.2 to 5 times, preferably 2 to 3 times. More preferably, the shrinkage rate is approximately the same as that of the adhesive. If the shrinkage rate is too large, the adhesive strength of the adhesive tape tends to decrease, and if it is too small, there is a risk that it will not be able to follow the shrinkage of the adhesive.
上記粘着テープは、基材および粘着剤ともに、水または
有機溶剤にて膨潤して体積膨張するが溶解しないもので
あれば特に限定されない。例えば、通常知られるアクリ
ルまたはゴム系粘着剤は架橋していない状態では水ある
いは有機溶剤に溶解してしまうことが多いので、架橋剤
を添加するなどして架橋して用いるのが良い。本発明に
おいては、粘着剤の架橋率は粘着剤の種類等により変化
するが、２０〜９０％程度のものが用いられる。The above-mentioned adhesive tape is not particularly limited as long as both the base material and the adhesive are swollen in water or an organic solvent and expand in volume but do not dissolve. For example, commonly known acrylic or rubber adhesives often dissolve in water or organic solvents in an uncrosslinked state, so it is preferable to use them after crosslinking by adding a crosslinking agent. In the present invention, the crosslinking rate of the adhesive varies depending on the type of adhesive, etc., but a crosslinking rate of about 20 to 90% is used.
粘着剤の架橋率が上昇するに従い膨潤、収縮の度合いが
小さくなり、架橋率が減少するとともに膨潤、収縮度合
いが大きくなり、用いる粘着剤や溶剤の種類などにより
異なるが、ある一定限度以下では溶解を始めるものが多
い。このような粘着剤の好適な例としては、ゴム系、ア
クリル系あるいはシリコーン系の粘着剤をイソシアネー
ト化合物、過酸化物、メラミン化合物、エポキシ化合物
などの架橋剤添加、あるいは電子線、紫外線照射により
架橋したものを挙げることができる。As the cross-linking rate of the adhesive increases, the degree of swelling and contraction decreases, and as the cross-linking rate decreases, the degree of swelling and contraction increases, and although it varies depending on the type of adhesive and solvent used, it will dissolve below a certain limit. There are many people who start. Suitable examples of such adhesives include rubber-based, acrylic-based, or silicone-based adhesives that are cross-linked by adding a cross-linking agent such as an isocyanate compound, peroxide, melamine compound, or epoxy compound, or by irradiating electron beams or ultraviolet rays. I can list some things that I did.
本発明で用いられる粘着テープの基材としては、使用さ
れる水または有機溶剤に対して不溶性のものであれば特
に限定されず、例えば不織布、プラスチックフィルム、
和紙、発泡体などを挙げることができる。The base material of the adhesive tape used in the present invention is not particularly limited as long as it is insoluble in the water or organic solvent used, such as nonwoven fabric, plastic film,
Examples include Japanese paper and foam.
また、本発明に用いられる粘着テープは、その基材のな
い粘着剤自体でテープ状に成形されたものでも良い。Further, the adhesive tape used in the present invention may be formed into a tape shape using the adhesive itself without a base material.
以下、本発明を実施例により説明する。 The present invention will be explained below using examples.
実施例
アクリル酸ブチル１００重量部とアクリル酸５重量部の
共重合体ポリマーにイソシアネート系架橋剤をアクリル
酸に対して１当量添加した粘着剤（架橋率７０％）を塗
布乾燥して厚さ０．２ｍｍの粘着テープを得た。Example: A copolymer of 100 parts by weight of butyl acrylate and 5 parts by weight of acrylic acid was coated with an adhesive (crosslinking rate: 70%) in which 1 equivalent of an isocyanate crosslinking agent was added to the acrylic acid, and dried to a thickness of 0. A 2 mm adhesive tape was obtained.
次いで上記粘着テープを幅２０ｍｍに切り、トルエンで
膨潤させ厚さ０．５ｍｍ（収縮率２．５倍）とし、第１
図に示すように９０ｃｍＸ１８０ｃｍの石膏ボード１の
紙を貼っである面の短尺方向の両端に該粘着テープ２を
貼り着け、略中央部２箇所に固形分６０重量％の酢酸ビ
ニル系エマルジョン接着剤３を２５０ｇずつに塗布し、
厚さ１ｍｍのアクリルガラスと上記石膏ボード１を貼り
合わせる。Next, the above adhesive tape was cut to a width of 20 mm, swollen with toluene to a thickness of 0.5 mm (2.5 times the shrinkage rate), and the first
As shown in the figure, the adhesive tape 2 is pasted on both ends of the paper-covered surface of a 90 cm x 180 cm gypsum board 1 in the short direction, and a vinyl acetate emulsion adhesive 3 with a solid content of 60% by weight is applied at two locations approximately in the center. Apply 250g of
Acrylic glass with a thickness of 1 mm and the above plaster board 1 are pasted together.
比較例
実施例の粘着剤と同じ組成の粘着剤（膨潤させていない
もの）よりなる厚さ０．５ｍｍ、幅２０ｍｍの粘着テー
プを用いる他は実施例１と同様にして石膏ボードとアク
リルガラスを貼着した。Comparative Example Gypsum board and acrylic glass were bonded in the same manner as in Example 1, except that an adhesive tape with a thickness of 0.5 mm and a width of 20 mm made of an adhesive (not swollen) having the same composition as the adhesive in the example was used. Pasted.
実施例および比較例で得られたものを、石膏ボードを固
定して垂直に保持し常温で１日おき、接着剤中の水分を
揮発させ、接着剤の接着状態を観察した。The samples obtained in the Examples and Comparative Examples were fixed to a plaster board and held vertically at room temperature for one day to volatilize the moisture in the adhesive, and the adhesion state of the adhesive was observed.
実施例のものは、粘着テープ中に揮発成分（アセトン）
を含んでいるので厚さ方向に収縮するため、接着剤が塗
布された部分のほぼ全面に接着していたのに対し、比較
例のものは粘着テープの厚さが変化しないので、塗布さ
れた面積の１０％の部分しか接着されていなかった。The example has a volatile component (acetone) in the adhesive tape.
Because it contains adhesive tape, it shrinks in the thickness direction, so it adhered to almost the entire area where the adhesive was applied, whereas in the comparative example, the thickness of the adhesive tape did not change, so the adhesive tape was not applied. Only 10% of the area was bonded.
（発明の効果〕
上記から明らかなように、本発明の接着方法は厚さ方向
に収縮する粘着テープにより二物品を仮止めすると共に
、該二物品の少なくともどちらか一方の接着面表面に接
着剤を塗布しているので該二物品を良好に接着すること
ができる。(Effects of the Invention) As is clear from the above, the bonding method of the present invention temporarily fastens two articles using an adhesive tape that shrinks in the thickness direction, and also applies an adhesive to the adhesive surface of at least one of the two articles. , the two articles can be bonded well.
第１図は本発明の接着方法の一例を示す平面図である。 １・・・物品 ２・・・粘着テープ ３・・・接着剤 FIG. 1 is a plan view showing an example of the bonding method of the present invention. 1... Goods 2... Adhesive tape 3...Adhesive
Claims (1)
収縮する粘着テープにより該二物品を仮止めすると共に
、該二物品の少なくともどちらか一方の接着面表面に接
着剤を塗布することを特徴とする接着方法。A method of bonding two articles with an adhesive, characterized in that the two articles are temporarily attached using an adhesive tape that shrinks in the thickness direction, and an adhesive is applied to the adhesive surface of at least one of the two articles. Adhesion method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25910989A JPH03121174A (en) | 1989-10-03 | 1989-10-03 | Bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25910989A JPH03121174A (en) | 1989-10-03 | 1989-10-03 | Bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03121174A true JPH03121174A (en) | 1991-05-23 |
Family
ID=17329443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25910989A Pending JPH03121174A (en) | 1989-10-03 | 1989-10-03 | Bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03121174A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924277A1 (en) * | 1997-12-17 | 1999-06-23 | Beiersdorf Aktiengesellschaft | Indestructable and residue-free detachable mounting device for interior and exterior |
-
1989
- 1989-10-03 JP JP25910989A patent/JPH03121174A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924277A1 (en) * | 1997-12-17 | 1999-06-23 | Beiersdorf Aktiengesellschaft | Indestructable and residue-free detachable mounting device for interior and exterior |
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