JPH03119140A - Glass cloth - Google Patents
Glass clothInfo
- Publication number
- JPH03119140A JPH03119140A JP1258561A JP25856189A JPH03119140A JP H03119140 A JPH03119140 A JP H03119140A JP 1258561 A JP1258561 A JP 1258561A JP 25856189 A JP25856189 A JP 25856189A JP H03119140 A JPH03119140 A JP H03119140A
- Authority
- JP
- Japan
- Prior art keywords
- cloth
- coupling agent
- silane coupling
- glass cloth
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004744 fabric Substances 0.000 title abstract description 37
- 239000011521 glass Substances 0.000 title abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 25
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 11
- 230000005484 gravity Effects 0.000 claims abstract description 8
- 239000000835 fiber Substances 0.000 abstract description 23
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 abstract description 7
- 238000009941 weaving Methods 0.000 abstract description 7
- 239000011159 matrix material Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 239000003365 glass fiber Substances 0.000 description 9
- 239000012779 reinforcing material Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000010453 quartz Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 235000019353 potassium silicate Nutrition 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 238000000578 dry spinning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Glass Compositions (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Woven Fabrics (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はマトリックス樹脂とともに積層成形されプリン
ト配線基板用積層板の製造に用いられるガラスクロスに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a glass cloth that is laminated together with a matrix resin and used in the production of a laminate for a printed wiring board.
従来の技術
高品質を要求される産業用および一部民生用プリント配
線基板の補強材として、従来から主としてガラスクロス
が用いられている。ガラスクロスを基材とする積層板は
この分野において最も要求されるゴ法安定性、ｔｌｌ械
的強度、耐熱性、耐薬品性、電気特性において非常に邊
りているからである。2. Description of the Related Art Glass cloth has been mainly used as a reinforcing material for industrial and some consumer printed wiring boards that require high quality. This is because laminates based on glass cloth have extremely high mechanical stability, mechanical strength, heat resistance, chemical resistance, and electrical properties that are most required in this field.
一方、最近の高度情報化社会の発達に伴い、超大型コン
ピューター、スーパーコンビ、上−ター高速演算を行な
う高度計測機器などによる情報処理技術、および′ａｌ
星放送、通信や移動無線の分野での高周波通信技術はま
すまず重要性を帯びている。On the other hand, with the recent development of an advanced information society, information processing technology using ultra-large computers, super combinations, advanced measuring equipment that performs high-speed calculations, and
High frequency communication technology in the field of astronomical broadcasting, communications and mobile radio is becoming increasingly important.
前者の技術分野では低誘電特性を有する主として多層プ
リント配線基板が、後者の技術分野では低誘電特性を有
する主として両面プリント配線基板が用いられている。In the former technical field, multilayer printed wiring boards having low dielectric properties are mainly used, and in the latter technical field, double-sided printed wiring boards having low dielectric properties are mainly used.
プリント配線基板に低誘電特性を持たせるには２通りの
方法がある。即ち、１つは補強用ガラスクロス林料とし
て比較的安価で一般のプリント配線基板用に用いられる
Ｅガラスクロスを用い、マトリックス樹脂として低誘電
特性を持つ材料を用いる方法である。このための樹脂と
して、フッ素樹脂やポリフェニレンサルファイド、ポリ
エーテルイミド、ポリフェニレンオキサイド、ポリエチ
レンなどが知られている。There are two methods for imparting low dielectric properties to printed wiring boards. That is, one method is to use E-glass cloth, which is relatively inexpensive and used for general printed wiring boards, as a reinforcing glass cloth material, and to use a material with low dielectric properties as a matrix resin. Known resins for this purpose include fluororesin, polyphenylene sulfide, polyetherimide, polyphenylene oxide, and polyethylene.
他の１つは補強材として低誘電特性を有する材料を用い
る方法である。この材料としてクォーツ繊維、Ｄガラス
繊維、リーチド・シリカカラスクロス、あるいは有機性
のアラミド繊維などが知られている。クォーツ繊維は低
銹な特性に優れているが、高価である。Ｄガラス繊維は
他のガラス繊維に比べて熱に弱いので、加工工程に気を
使わなければならず強度が低く、製織工程で多量の毛羽
を発生し、低誘電特性もクォーツ繊維より劣り、使用目
的に対し適切であるとは言えない。また、アラミド繊維
はマトリックス樹脂との接着性が悪く、ドリル加工性も
悪いという欠点を持つ。また、通常のＥガラスを濃い酸
などで処理し、シリカ以外の成分を溶出することによっ
て得られるリーチド・シリカガラスも低誘電特性を持つ
が、強度が非常に低くて、特に多層配線基板に用いられ
る薄いクロスの製造プロセスにおける連続加工が非常に
困難である。Another method is to use a material with low dielectric properties as a reinforcing material. Known materials include quartz fiber, D-glass fiber, leached silica glass cloth, and organic aramid fiber. Quartz fiber has excellent low rust properties, but is expensive. D-Glass fiber is more sensitive to heat than other glass fibers, so care must be taken in the processing process; its strength is low; it generates a large amount of fuzz during the weaving process; its low dielectric properties are also inferior to quartz fibers, making it difficult to use. It cannot be said that it is appropriate for the purpose. Furthermore, aramid fibers have the drawbacks of poor adhesion with matrix resins and poor drilling workability. In addition, leached silica glass, which is obtained by treating ordinary E-glass with concentrated acid and eluting components other than silica, also has low dielectric properties, but its strength is very low and it is used especially in multilayer wiring boards. Continuous processing in the manufacturing process of thin cloth is extremely difficult.
曲の方法として、低誘電特性を極力発揮させる目的で、
補強材を使わずにフッ素樹脂だけで銅張積層板を構成す
る場合らある。現在のところ、実用的な樹脂の中ではフ
ッ素樹脂が最も低誘電特性に優れており、知られている
実用的な補強材はＰＩれもフッ素樹脂を始めとする低誘
電特性で知られる７トリツクス樹脂に比べ低誘電特性に
劣るからである。しかし、この場合は、積層板の寸法安
定性に劣り、またコスト高になるなどの欠点がある。As a song method, in order to maximize the low dielectric properties,
In some cases, copper-clad laminates are constructed using only fluororesin without using reinforcing materials. At present, fluororesins have the best low dielectric properties among practical resins, and the only known practical reinforcing materials are PI and fluororesins, which are known for their low dielectric properties. This is because it has inferior dielectric properties compared to resin. However, in this case, there are drawbacks such as poor dimensional stability of the laminate and high cost.
発明が解決しようとする課題
本発明は上記問題を解決するもので、従来の補強材を基
材として用いた低誘電特性積層板と比較して非常に優れ
た低誘電特性を有し、かつその他の物理、化学的性質も
従来のＭｌ １ｙＪＩ Ｎと比べて遜色ない積層板用ガ
ラスクロスを提供することを目的とするものである。Problems to be Solved by the Invention The present invention solves the above problems, and has extremely superior low dielectric properties compared to conventional low dielectric property laminates using reinforcing materials as base materials, and has other characteristics. The object of the present invention is to provide a glass cloth for laminated plates whose physical and chemical properties are comparable to those of conventional Ml 1yJIN.
課題を解決するための手段
この課題を解決するために本発明は、二酸化珪素の含有
量が９８重量％以上で、比重１．８〜，２．０、引張強
度２（１−８２ｋｇ ／ ｒｕｌ’ 、弾性率１，００
０〜８，２００ｋｇ ／ ｍｍ ’である珪酸４〜維を
製織し、その表面をシランカップリング剤で処理したも
のである。Means for Solving the Problems In order to solve this problem, the present invention provides a silicon dioxide content of 98% by weight or more, a specific gravity of 1.8 to 2.0, and a tensile strength of 2 (1 to 82 kg/rul'). , elastic modulus 1,00
Silicic acid fibers with a weight of 0 to 8,200 kg/mm' are woven, and the surface thereof is treated with a silane coupling agent.
作用
この構成により、繊維中の二酸化珪素の含有量が多いた
めに誘電率、誘電正接ともに優れた低誘電特性を有し、
安価で、強度も充分で、耐薬品性らある。また、比重が
軽く、取り扱いが有利である。さらに、表面がシランカ
ップリング剤で処理されているため、プリント配線基板
用補強材として樹脂との接着性を高め、耐熱性も高める
。Function: Due to this structure, the fiber has a high content of silicon dioxide, so it has low dielectric properties with excellent dielectric constant and dielectric loss tangent.
It is inexpensive, has sufficient strength, and has chemical resistance. In addition, it has a light specific gravity and is convenient to handle. Furthermore, since the surface is treated with a silane coupling agent, it can be used as a reinforcing material for printed wiring boards to improve adhesion to resins and heat resistance.
実施例
以下、本発明の実施例について、図面に基づいて説明す
る。Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings.
即ち、本発明実施例のカラスクロスは、二酸化珪素の含
有量が９８重量％以上で、比重１，８〜２．０、引張強
度２０〜８２ｋｔ／噛２、弾性率１ 、０００〜８．２
００ｋｇ／ ｗｒ ２である珪酸繊維を製織し、その表
面をシランカップリング剤で処理したものである。That is, the crow cloth of the embodiment of the present invention has a silicon dioxide content of 98% by weight or more, a specific gravity of 1.8 to 2.0, a tensile strength of 20 to 82 kt/mesh, and an elastic modulus of 1.000 to 8.2.
00 kg/wr 2 silicic acid fibers are woven, and the surface thereof is treated with a silane coupling agent.
さらに詳しくは前記珪酸繊維はソーダ水ガラスを乾式紡
糸し、水分を発散させて固化させた後、酸や塩の水ｍＡ
でその繊維からソーダ分を抽出除去し、場合によっては
その後高温で焼却することにより繊維中の水分を除去し
、ミクロボアを消滅させたものである。繊維中の二酸化
珪素の含有量が多いために、Ｉ Ｍ ＨｚでのＢｉ２
を率約３．７〜３．９、誘電正接的０．０００１〜０．
０００３と、低誘電特性ではクォーツ繊維と同等の性能
を有し、しかもクォーツ繊維に比べて安価である。また
、繊維中の二酸化珪素の含有量が多いため、酸やアルカ
リ、塩などの薬品に対し強い、また、通常のガラス繊維
クロスに比べて比重が軽いので、取り扱いが右利である
。More specifically, the silicic acid fiber is produced by dry spinning soda water glass, wicking away moisture, and solidifying the silicic acid fiber.
The soda content is extracted and removed from the fibers, and in some cases, the fibers are then incinerated at high temperatures to remove moisture in the fibers and eliminate micropores. Due to the high content of silicon dioxide in the fibers, Bi2 at I MHz
The ratio is about 3.7 to 3.9, and the dielectric loss tangent is about 0.0001 to 0.
0003, it has the same performance as quartz fiber in terms of low dielectric properties, and is cheaper than quartz fiber. In addition, because the fiber contains a large amount of silicon dioxide, it is resistant to chemicals such as acids, alkalis, and salts, and its specific gravity is lighter than ordinary glass fiber cloth, making it easy to handle.
このクロスから、熱処理などの適当な手段により表面に
付着している紡糸バインダーや製織用糊剤を１余去し、
しかる後にシランカップリング剤溶液に浸消し、乾燥す
ることでガラスの表面にシランカップリング剤を結合、
架橋せしめプリント配線基板用補強材として樹脂との接
着性を高め、１３４熱性を高める。The spinning binder and weaving paste adhering to the surface of this cloth are removed by appropriate means such as heat treatment, and
After that, the silane coupling agent is bonded to the surface of the glass by soaking it in a silane coupling agent solution and drying it.
As a reinforcing material for cross-linked printed wiring boards, it improves adhesion to resin and improves 134 heat resistance.
また、用いられるガラス繊維の単糸径を３〜１５μｍの
範囲で変えることにより両面プリント配線基板から超多
層基板までの幅広い用途に供することができる。３μｍ
より細くなると折れ易くて収り扱いが難しくなる。１５
μｍを超えると逆常の両面プリント配線基板に要求され
るクロス表面の平滑度を満たすことが困難であり、ドリ
ル加工性も悪くなる。In addition, by changing the single fiber diameter of the glass fiber used within the range of 3 to 15 μm, it can be used in a wide range of applications from double-sided printed wiring boards to super multilayer boards. 3μm
The thinner it becomes, the more easily it breaks and becomes difficult to store and handle. 15
If it exceeds .mu.m, it will be difficult to satisfy the smoothness of the cross surface required for a double-sided printed wiring board, and the drilling workability will also deteriorate.
また、クロスの厚みを望ましくは２０〜２５０μＩｎの
範囲で変えることにより両面グリント配線基板から超多
層基板までの幅広い用途に供することができる。２０μ
ｍより薄いとクロスの強度が弱くなり、加工、処理プロ
セスでの収り扱いか難しくなる。２５０μＩｎより厚い
と、樹脂ワニスの含浸性が低下し、また厚みをｉｆ′Ａ
するために太い単糸径のガラス繊維を用いる必要があり
、クロス表面の平滑度が悪くなるし、ドリル加工性も悪
くなる。Further, by changing the thickness of the cloth preferably within the range of 20 to 250 μIn, it can be used in a wide range of applications from double-sided glint wiring boards to super multilayer boards. 20μ
If it is thinner than m, the strength of the cloth will be weakened and it will be difficult to handle it during processing and treatment processes. If it is thicker than 250μIn, the impregnating property of the resin varnish will decrease, and if the thickness is
In order to do this, it is necessary to use glass fibers with a large single diameter, which results in poor cloth surface smoothness and poor drilling workability.
さらに上記説明において、二酸化珪素の含有量を９８重
量％以上としたのは、９８重量％より少ないと含有する
不純物のために低誘電特性が悪くなるからである。また
、本発明による二酸化珪素繊維の実用面での大きな特徴
は安価な水ガラスを原料として比較開部ｔｙｔに製造で
きるということである。Further, in the above description, the reason why the content of silicon dioxide is set to 98% by weight or more is because if it is less than 98% by weight, the low dielectric properties will deteriorate due to the impurities contained. Further, a major practical feature of the silicon dioxide fiber according to the present invention is that it can be manufactured in a comparative opening type using inexpensive water glass as a raw material.
この方法によると酸や塩などによりソータ分を除去して
二酸化珪素含有量９８重量％以上にすると、比重は１．
８以上、高温で焼却することにより２．０まで４−昇す
る。また、引張強度は同様に２０ｋｚ／鴎２以上、８２
ｋｇ／ ｍ ’に達する。また同様に弾性率は１．０
００ ｋ［／ Ｂ２以上、８，２００ ｋ［ｒ／ ｍｔ
＋’に達する。ソーダ水ガラスを用いた二酸化珪素繊維
の良好な製法については、例えば特公昭５９−４７０４
３号公報、特公昭６３−２７４４６号公報に詳細に記載
されている。According to this method, if the sorter content is removed with acid or salt to make the silicon dioxide content 98% by weight or more, the specific gravity will be 1.
8 or more, increases to 4-2.0 by incineration at high temperature. In addition, the tensile strength is 20 kHz/U2 or more, 82
kg/m'. Similarly, the elastic modulus is 1.0
00 k[/B2 or higher, 8,200 k[r/mt
+' reached. For a good method of manufacturing silicon dioxide fiber using soda water glass, for example, Japanese Patent Publication No. 59-4704
It is described in detail in Publication No. 3 and Japanese Patent Publication No. 63-27446.
次に、種々の材質のヤーンを用いてクロスを試織し、積
層板サンプルを試作し、誘な特性を調べた。その場合の
真木実施例および比較例について以下に説明し、クロス
および積層板の物性評価結果を表１に示す。Next, cloth was trial woven using yarns made of various materials, and laminate samples were made to investigate their attractive properties. Maki Examples and Comparative Examples in that case will be described below, and Table 1 shows the results of evaluating the physical properties of the cloth and the laminate.
珪酸繊維としてＡＫＺＯ（ＥＮＫＡ ＡＧ）で開発さ
れた水ガラス由来の繊維を用いてクロスを製織しな、用
いなり−ンの単糸本数２４１本、単糸径平均９．６μｍ
、番手は３５．７テツクスであった。The cloth is woven using fibers derived from water glass developed by AKZO (ENKA AG) as silicic acid fibers.The number of single yarns used is 241, and the average single yarn diameter is 9.6 μm.
The number was 35.7 tex.
ヤーンの物性は二酸化珪素の含有率９９，６％以上、比
重２，０、引張強度５２．０ｋＨ／止２、弾性率５，５
００ｋｇ／ｎ＋ｎ’であった。The physical properties of the yarn include silicon dioxide content of 99.6% or more, specific gravity of 2.0, tensile strength of 52.0 kHz/stop2, and modulus of elasticity of 5.5.
00kg/n+n'.
製織用糊剤としてポリビニルアルコール系の糊剤を用い
てヤーンに付着し、乾燥せしめた。糊剤付きヤーンをレ
ピア′ａＲにて製繊した。このクロスをバッチ式焼却炉
中で４００°ｃ”ｒ熱処理し、繊維表面の紡糸バインダ
ーや糊剤を焼却除去した。この熱処理したクロスをアミ
ノシランカップリング剤（Ｓ Ｚ ６０３２、東しシリ
コーン製）溶液中に浸漬した。クロスの液を絞り１４０
’Ｃで加熱乾燥することにより、シランカップリング剤
で処理したクロスを得た。このクロスの密度は経４０本
／２５間、緯３２本／２５關、厚さは１２４μｍであっ
た。このクロスにエポキシ樹脂ワニスを含浸させ、１５
０°Ｃにて加熱乾燥させてプリプレグを作成した。この
プリプレグ８枚と表面に３５μｍの！ｉ：Ｉ箔を重ねて
１７５°Ｃ５４０ｋｇ／ｄでプレス成形して銅張積層板
を作成した。A polyvinyl alcohol-based sizing agent was used as a sizing agent for weaving, and was attached to the yarn and allowed to dry. The sizing agent-coated yarn was produced using a rapier 'aR. This cloth was heat-treated at 400°c''r in a batch incinerator to remove the spinning binder and sizing agent on the fiber surface by incineration. I immersed it in the cloth. Squeezed the liquid from the cloth 140
By heating and drying at 'C, a cloth treated with a silane coupling agent was obtained. The density of this cloth was 40/25 warps, 32/25 warps, and 124 μm in thickness. Impregnate this cloth with epoxy resin varnish and
A prepreg was prepared by heating and drying at 0°C. These 8 prepregs and 35 μm on the surface! i: I foils were stacked and press-molded at 175°C and 540 kg/d to create a copper-clad laminate.
このようにして得られた積層板の諸性質は表１の通りで
あり、優れた低誘電特性を示している。The properties of the laminate thus obtained are shown in Table 1, and it exhibits excellent low dielectric properties.
〔比較例１〕
プリント配線基板用に一般に用いられるいるＥガラス繊
維１３ＣＥ２２５１１０ （２２，４テブクス、単糸
本数２００本、単糸径平均７．０μｍ ）を用いてクロ
スを製織１７た。具体実施例と同様の手順により、シラ
ンカップリング剤で処理したクロスを得た。[Comparative Example 1] A cloth was woven using E glass fiber 13CE225110 (22.4 tebux, number of single yarns: 200, average diameter of single yarns: 7.0 μm), which is commonly used for printed wiring boards. A cloth treated with a silane coupling agent was obtained by the same procedure as in the specific example.
このクロスの密度は経６１本／２５關、緯５８本／２５
ｎｍ、厚さは９７μｍであった。このクロスを用い、具
体実施例１と同様の手順により８プライの銅張積層板を
作成した。The density of this cross is 61/25 warp and 58/25 latitude.
nm, and the thickness was 97 μm. Using this cloth, an 8-ply copper-clad laminate was prepared in the same manner as in Example 1.
〔比較例２〕
Ｄガラス繊維Ｄ ＣＥ ２７０ Ｉｌｏを用いてクロス
を製織した。用いたヤーンの単糸本数１６０本、姑糸径
平均８．７μｍ、番手は２０．６テツクスであった。[Comparative Example 2] A cloth was woven using D glass fiber D CE 270 Ilo. The number of single yarns used was 160, the average yarn diameter was 8.7 μm, and the yarn count was 20.6 tex.
具体実施例と同様の手順によりシランカップリング剤で
処理したクロスを得た。製織工程で毛羽の発生が多かっ
た。このクロスの密度は経６４本／２５市、緯６２本／
２５市、厚さは９９μｍであった。このクロスを用い、
具体実施例と同様の手順により８プライの銅張積層板を
作成した。A cloth treated with a silane coupling agent was obtained by the same procedure as in the specific example. A lot of fuzz was generated during the weaving process. The density of this cross is 64 longitudes/25 cities, 62 latitudes/
There were 25 pieces, and the thickness was 99 μm. Using this cross,
An 8-ply copper-clad laminate was produced using the same procedure as in the specific example.
〔比較例３〕
Ｅガラス繊維ＥＣＥ２２５１１０ （２２，４テツク
ス、単糸本数２００本、単糸径平均７．０μｍ）を用い
て製織して得たクロスを、７０℃の塩酸（４Ｎ）中に７
５、分間浸漬し、続いて水洗、乾燥することにより二酸
化珪素の含有量が９９．６％のリーチド・シリカガラス
クロスを得た。このクロスを１，０００℃で５分間熱処
理した。このときのクロスの密度は経６９本／２５１ｎ
＋、緯６６本／２５市、厚さは９７μｍであった。[Comparative Example 3] A cloth obtained by weaving using E glass fiber ECE225110 (22.4 tex, number of single yarns 200, average single yarn diameter 7.0 μm) was soaked in hydrochloric acid (4N) at 70°C for 70 minutes.
5. Leached silica glass cloth with a silicon dioxide content of 99.6% was obtained by soaking for 5 minutes, followed by washing with water and drying. This cloth was heat treated at 1,000°C for 5 minutes. The density of the cross at this time is 69 warp/251n
+, latitude 66 lines/25 cities, thickness 97 μm.
このクロスの引張強度は経５．７ｋＨ／關２ 、！＃Ｂ
５．９に＋ｒ／ １１１１１２（何れも酸処理前の単糸
断面積基準）であった、引張強度があまりにも低いため
、シラン処理の工程で連続処理装置にかけよると、クロ
スの破れ、切断を生じ、シラン処理が不可能であった。The tensile strength of this cloth is 5.7kHz/2. #B
5.9 and +r/111112 (all based on the cross-sectional area of a single yarn before acid treatment).The tensile strength was so low that if it was applied to a continuous processing device during the silane treatment process, the cloth would tear or break. silane treatment was impossible.
く以下余白〉
六ニー１
上記衣１からも分かるように、具体実施例の方が他の比
較例に比べて誘電率並びに誘電正接のｆｆｊが低い結果
を示している６
発明の効果
以りのように本発明によれば、誘電率、誘電正接とらに
値が低く優れた低誘電特性を存するとともにその曲の物
理、化学的性質において従来の補強材と比べて遜色のな
いＶ１層板用のカラスクロスを提供することができる。6) As can be seen from the above 1, the specific example shows lower dielectric constant and dielectric loss tangent ffj than other comparative examples. 6 More than the effect of the invention According to the present invention, the V1 layer plate has excellent low dielectric properties with low values of dielectric constant and dielectric loss tangent, and is comparable to conventional reinforcing materials in terms of physical and chemical properties. Crow cloth can be provided.
Claims (1)
８〜２．０、引張強度２０〜８２ｋｇ／ｍｍ＾２、弾性
率１，０００〜８，２００ｋｇ／ｍｍ＾２である珪酸繊
維を製織し、その表面をシランカップリング剤で処理し
たガラスクロス。1. The content of silicon dioxide is 98% by weight or more, and the specific gravity is 1.
8 to 2.0, a tensile strength of 20 to 82 kg/mm^2, and an elastic modulus of 1,000 to 8,200 kg/mm^2, and the surface thereof is treated with a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1258561A JPH03119140A (en) | 1989-10-03 | 1989-10-03 | Glass cloth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1258561A JPH03119140A (en) | 1989-10-03 | 1989-10-03 | Glass cloth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03119140A true JPH03119140A (en) | 1991-05-21 |
Family
ID=17321944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1258561A Pending JPH03119140A (en) | 1989-10-03 | 1989-10-03 | Glass cloth |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03119140A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1517595A2 (en) * | 2003-09-19 | 2005-03-23 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| JP2018127747A (en) * | 2017-02-10 | 2018-08-16 | 旭化成株式会社 | Glass cloth, prepreg and printed wiring board |
| JP2021195689A (en) * | 2020-06-17 | 2021-12-27 | 信越化学工業株式会社 | Annealed quartz glass cloth and manufacturing method thereof |
| EP3932880A1 (en) * | 2020-06-30 | 2022-01-05 | Shin-Etsu Chemical Co., Ltd. | Low dielectric resin substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5210312A (en) * | 1975-07-10 | 1977-01-26 | Bayer Ag | Heattstable silica glass |
| JPS56148550A (en) * | 1980-04-18 | 1981-11-18 | Matsushita Electric Works Ltd | Class cloth base material aminated board |
-
1989
- 1989-10-03 JP JP1258561A patent/JPH03119140A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5210312A (en) * | 1975-07-10 | 1977-01-26 | Bayer Ag | Heattstable silica glass |
| JPS56148550A (en) * | 1980-04-18 | 1981-11-18 | Matsushita Electric Works Ltd | Class cloth base material aminated board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1517595A2 (en) * | 2003-09-19 | 2005-03-23 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| EP1517595A3 (en) * | 2003-09-19 | 2008-04-02 | Hitachi Chemical Co., Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| US8420210B2 (en) | 2003-09-19 | 2013-04-16 | Hitachi Chemical Company, Ltd. | Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| JP2018127747A (en) * | 2017-02-10 | 2018-08-16 | 旭化成株式会社 | Glass cloth, prepreg and printed wiring board |
| JP2021195689A (en) * | 2020-06-17 | 2021-12-27 | 信越化学工業株式会社 | Annealed quartz glass cloth and manufacturing method thereof |
| EP3929166A1 (en) * | 2020-06-17 | 2021-12-29 | Shin-Etsu Chemical Co., Ltd. | Annealed quartz glass cloth and method for manufacturing the same |
| EP3932880A1 (en) * | 2020-06-30 | 2022-01-05 | Shin-Etsu Chemical Co., Ltd. | Low dielectric resin substrate |
| JP2022011534A (en) * | 2020-06-30 | 2022-01-17 | 信越化学工業株式会社 | Low dielectric resin substrate |
| US11802192B2 (en) | 2020-06-30 | 2023-10-31 | Shin-Etsu Chemical Co., Ltd. | Low dielectric resin substrate |
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