JPH0311905Y2 - - Google Patents

Info

Publication number
JPH0311905Y2
JPH0311905Y2 JP1986015134U JP1513486U JPH0311905Y2 JP H0311905 Y2 JPH0311905 Y2 JP H0311905Y2 JP 1986015134 U JP1986015134 U JP 1986015134U JP 1513486 U JP1513486 U JP 1513486U JP H0311905 Y2 JPH0311905 Y2 JP H0311905Y2
Authority
JP
Japan
Prior art keywords
height
printed wiring
electronic circuit
wiring board
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986015134U
Other languages
Japanese (ja)
Other versions
JPS62128691U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986015134U priority Critical patent/JPH0311905Y2/ja
Publication of JPS62128691U publication Critical patent/JPS62128691U/ja
Application granted granted Critical
Publication of JPH0311905Y2 publication Critical patent/JPH0311905Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【考案の詳細な説明】 〔考案の目的〕 (考案の利用分野) 本考案は電子回路装置例えばコンバータ、イン
バータ或いは整流装置などの実装構造に関するも
ので、特に2組の装置を1ユニツトとして実装す
るのに好適する構造の提供にある。
[Detailed Description of the Invention] [Purpose of the Invention] (Field of Application of the Invention) The present invention relates to a mounting structure for electronic circuit devices such as converters, inverters, or rectifiers, and is particularly concerned with mounting two sets of devices as one unit. The objective is to provide a structure suitable for

(従来技術およびその問題点) 印刷配線板(絶縁基板)上に所要構成部品を搭
載し接続して構成された電子回路装置例ばコンバ
ータを電子計算機などの負荷容量に対応して複数
組例えば2組並列接続して使用する場合、各電子
回路装置を機器内の収納フレームに架設などの方
法により取付けて使用される。しかしこの場合
個々の電子回路装置はその保護のため、装置との
間に間隔をもつように作られたケース内に収容す
るのが一般である。その結果電子回路装置は大型
化し、これを収容するフレームの形状も大となつ
て取付空間が大とならざるを得ない。また一般に
第1図に示すコンバータの如く交流電源ACの整
流回路REC、その直流出力をオンオフ制御する
トランジスタなどのスイツチング素子やその駆動
回路よりなるスイツチング回路S、電力変換用ト
ランスT、その出力の整流回路REC1、平滑回路
Fなどからなるもののように電力変換用トランス
Tをもつものでは、第2図のように一般にトラン
スTの高さが印刷配線板P面上において大きな取
付面積を占める他の構成部品PAに比して高き、
これによつて装置を保護するケースCの高さが定
まる。このため大型化するのを避けることができ
ず機器内の取付空間の増大を招く。
(Prior art and its problems) An electronic circuit device, such as a converter, which is constructed by mounting and connecting required components on a printed wiring board (insulating substrate), is connected to a plurality of sets, for example, two sets, corresponding to the load capacity of an electronic computer, etc. When using a set of parallel connected electronic circuit devices, each electronic circuit device is attached to a storage frame within the device by a method such as erection. However, in this case, in order to protect the individual electronic circuit devices, it is common to house them in a case that is designed to have a space between them. As a result, the electronic circuit device becomes larger, and the shape of the frame that accommodates it also becomes larger, which inevitably requires a larger installation space. In general, the converter shown in Fig. 1 includes a rectifier circuit REC for an AC power source AC, a switching circuit S consisting of a switching element such as a transistor that controls on/off its DC output, and its drive circuit, a power conversion transformer T, and a rectifier for its output. For those with a power conversion transformer T, such as one consisting of a circuit REC 1 , a smoothing circuit F, etc., the height of the transformer T generally occupies a large installation area on the printed wiring board P surface, as shown in Figure 2. Higher than component PA,
This determines the height of the case C that protects the device. For this reason, an increase in size cannot be avoided, resulting in an increase in the installation space within the device.

従つて現今のすう勢である機器の小型化の要求
に応えにくいのは勿論、機器における設置空間が
予め設定されている場合には何等かの手段をとら
ない限り収容設置できない場合もある。
Therefore, it is of course difficult to meet the current demand for miniaturization of devices, and if the installation space for the device is preset, it may not be possible to accommodate the device unless some measure is taken.

そこで例えば第3図のように印刷配線板Pの1
面にトランスTや比較的高さが高い大きな部品
PA1を接続し、他面にはトランスTの高さに対し
て殆ど問題にならないような高さの低い部品PA2
を集めて接続する方法をとることにより、取付面
積を小として取付空間を小にすることが行われて
いる。しかしこの方法では依然高さは変わらず、
特に第4図に示すように電子回路装置A,Bを縦
方向に並べて取付ける場合には、各装置間に間隔
Gをもつことを避けられないことから、更に取付
けに要する空間は大になる。従つて従来のように
個々の電子回路装置をそれぞれ独立の保護ケース
内に収容したものを機器内に取付ける方法では高
さを低くして取付け空間の大きさを小さくしよう
とする要求には応えにくい。
For example, as shown in Figure 3, 1 of the printed wiring board P
Transformer T or large parts with relatively high height on the surface
PA 1 is connected, and on the other side there is a low-height component PA 2 that does not have much of a problem with the height of the transformer T.
By using a method of gathering and connecting the parts, the mounting area and the mounting space are reduced. However, with this method, the height still remains the same,
In particular, when electronic circuit devices A and B are installed vertically side by side as shown in FIG. 4, it is unavoidable to have a gap G between each device, which further increases the space required for installation. Therefore, the conventional method of housing each electronic circuit device in its own protective case and installing it inside the device is difficult to meet the demand for lowering the height and reducing the size of the installation space. .

本考案は上記の如き複数組の電子回路装置、特
に2組の装置を高さを低くしながら同一保護ケー
ス内に収容できる構造を提供し、取付け空間を小
さくできるようにしたものである。
The present invention provides a structure in which a plurality of sets of electronic circuit devices as described above, particularly two sets of devices, can be accommodated in the same protective case while reducing the height, thereby making it possible to reduce the installation space.

〔考案の構成〕[Structure of the idea]

(問題点を解決するための手段) 第5図a,b,cは前記したように電力変換用
トランスを構成部品としてもつコンバータやイン
バータにおける本考案の一実施例を示す分解斜視
図、組立正面図および保護ケース内に収容した状
態を示す斜視図であつて、本考案の特徴とすると
ころは次の点にある。
(Means for Solving the Problems) Figures 5a, b, and c are exploded perspective views and assembled front views showing an embodiment of the present invention in a converter or inverter having a power conversion transformer as a component as described above. The present invention is characterized by the following points.

即ち第5図aに示すように他の部品に比べて最
も高い高さのトランスTを差込みうる大きさの貫
通切欠部PHをそれぞれの一端に設けた2枚同形
の印刷配線板を作る。そしてそのそれぞれの他端
に片寄らせてトランスTを搭載して接続し、これ
と貫通し切欠部PHとの間の板面には例えば平滑
回路に使用されるチツプコンデンサなど中間の高
さをもつ部品PA1を集めて接続する。また印刷配
線板Pの裏面即ちトランスTなどの設置面の反対
面には、最も高さの低い部品PA2例えばスイツチ
ング回路を形成するトランジスタ、抵抗その他を
集めて接続して同形の2組の電子回路装置A,B
を構成する。しかるのち中間の高さをもつ部品
PA1の頭部面に接着剤CEを塗布して、第5図b
のように最も高さの高いトランスTを、相手印刷
配線板Pの貫通切欠穴PH内にそれぞれ入れなが
ら重ね合わせて接着して装置AとBとを一体化し
たのち、第5図cのように保護ケースC内に収容
固定するようにしたことを特徴とするものであ
る。
That is, as shown in FIG. 5a, two printed wiring boards of the same shape are made, each having a through notch PH at one end, which is large enough to insert the transformer T, which has the highest height compared to the other parts. Then, a transformer T is mounted and connected to the other end of each, and the plate surface between this and the notch PH that passes through it has a chip capacitor of intermediate height, such as a chip capacitor used in a smoothing circuit. Collect and connect parts PA 1 . In addition, on the back side of the printed wiring board P, that is, the opposite side to the installation side of the transformer T, etc., the lowest height components PA2 , such as transistors, resistors, etc. that form a switching circuit, are collected and connected to form two sets of electronics of the same shape. Circuit devices A, B
Configure. Then parts with intermediate height
Apply adhesive CE to the head surface of PA 1 and make the image shown in Figure 5b.
After integrating the devices A and B by inserting the transformers T with the highest height into the through-holes PH of the mating printed wiring board P and gluing them together, as shown in Figure 5c. It is characterized in that it is housed and fixed within a protective case C.

(作用および効果) 以上のようにすれば従来構造を示す第2図と本
考案を示す第5図bとを対比して明らかなよう
に、従来構造においては最も高さの高い部品であ
るトランスTと他の部品PAの高さの相異によつ
て無駄な空間SP(第2図参照)をもつ。しかし本
考案においてはトランスTを印刷配線板Pに設け
た貫通切欠部PH内に入れてトランスTの頭部を
逃がすようにしているので、中間の高さの部品
PA1相互の頭部を接することができ、上記従来構
造における無駄な空間SPを埋めることができる。
従つて別々に電子回路装置を構成して実装する従
来に比べて高さを低くできる。また更に、共通の
保護ケース内に収容できるので、第4図によつて
示したように縦方向に積重ねて取付ける場合に比
べて各電子回路装置A,B間の間隔Gを必要とし
ないことから装置の取付け高さを低くでき、取付
けに必要とする空間を小さくできる。
(Function and Effect) As is clear from the comparison between Figure 2 showing the conventional structure and Figure 5 b showing the present invention, the transformer is the highest component in the conventional structure. There is wasted space SP (see Figure 2) due to the difference in height between T and other parts PA. However, in the present invention, the transformer T is placed in the through cutout PH provided in the printed wiring board P so that the head of the transformer T escapes, so parts of intermediate height
The heads of PA 1 can be brought into contact with each other, and the wasted space SP in the above conventional structure can be filled.
Therefore, the height can be reduced compared to the conventional method in which electronic circuit devices are configured and mounted separately. Furthermore, since they can be housed in a common protective case, the distance G between each electronic circuit device A and B is not required compared to the case where they are stacked vertically as shown in FIG. The installation height of the device can be lowered, and the space required for installation can be reduced.

(変形例) 以上本考案を他の構成部品に比べて高さの高い
電力変換用トランスを有する電子回路装置につい
て説明したが、一般に高さの異なる構成部品から
なるものにも適用することができる。また最も高
い高さの部品が差込まれる貫通切欠部PHは第5
図に示したような一端が開放したものではなく、
第6図に示す斜視図のように丸穴、角穴等の穴で
もよい。また第7図のように1枚の印刷配線板に
おいて高さの最も高い部品PAが複数箇ある場合
には貫通切欠部を複数箇設ければよい。また本考
案は第2図のような印刷配線板の一面にのみ電子
部品を接続した場合にも適用して同様な効果が得
られることは云うまでもない。
(Modified example) Although the present invention has been described above with respect to an electronic circuit device having a power conversion transformer that is taller than other components, it can also be applied to devices that generally consist of components of different heights. . Also, the through notch PH into which the highest height component is inserted is the fifth
It is not open at one end as shown in the diagram, but
As shown in the perspective view of FIG. 6, the hole may be a round hole, a square hole, or the like. Further, when there are a plurality of parts PA having the highest height on one printed wiring board as shown in FIG. 7, a plurality of through-cuts may be provided. It goes without saying that the present invention can also be applied to a case where electronic components are connected only to one side of a printed wiring board as shown in FIG. 2, and similar effects can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は電子回路の一例を示す回路図、第2図
は印刷配線板に電子部品を搭載して形成された電
子回路装置の一例図、第3図は取付け面積を縮少
した電子回路装置図、第4図は取付方法の一例
図、第5図a,b,cは本考案の一例を示す分解
斜視図、組立正面図および保護ケース内に収容し
た状態を示す斜視図、第6図、第7図は本考案の
変形実施例を示す斜視図である。 AC……交流電源、REC……整流回路、S……
スイツチング回路、T……電力変換用トランス、
REC1……整流回路、F……平滑回路、C……保
護ケース、PA……電力変換用トランスなど高さ
の高い部品、PA1……中間の高さの部品、PA2
…最も高さが低い部品、A,B……電子回路装
置、P……印刷配線板(絶縁基板)、PH……貫
通切欠部。
Figure 1 is a circuit diagram showing an example of an electronic circuit, Figure 2 is an example of an electronic circuit device formed by mounting electronic components on a printed wiring board, and Figure 3 is an electronic circuit device with a reduced installation area. Figure 4 shows an example of the mounting method, Figures 5a, b, and c are an exploded perspective view showing an example of the present invention, an assembled front view, and a perspective view showing the state housed in a protective case, and Figure 6. , FIG. 7 is a perspective view showing a modified embodiment of the present invention. AC...alternating current power supply, REC...rectifier circuit, S...
Switching circuit, T...Transformer for power conversion,
REC 1 ... Rectifier circuit, F... Smoothing circuit, C... Protective case, PA... High height components such as power conversion transformers, PA 1 ... Intermediate height components, PA 2 ...
...Parts with the lowest height, A, B...Electronic circuit device, P...Printed wiring board (insulating board), PH...Through cutout.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 他の部品に対して高さの高い部品の取付部を一
端にかよらせて設け、他端に前記高さの高い部品
に対応位置部に他の部品に対して高さの高い部品
が入る貫通切欠部をそれぞれ設けた、2箇同形の
印刷配線基板の前記高さの高い部品の取付部に高
さの高い部品をそれぞれ取付け、残つた印刷配線
基板面に他の部品をそれぞれ取付けた2箇同形の
電子回路装置を、それぞれの高さの高い部品がそ
れぞれ相手印刷配線基板に設けた高さの高い部品
の貫通切欠部内に入れて重ね合わせて形成したこ
とを特徴とする電子回路装置。
A mounting part for a part that is taller than other parts is provided by leaning over one end, and a part that is taller than other parts is placed in a position corresponding to the taller part at the other end. The high-height components were respectively attached to the mounting portions of the high-height components of two printed wiring boards of the same shape, each having a through-cutout portion, and the other components were respectively attached to the remaining printed wiring board surface 2. An electronic circuit device characterized in that electronic circuit devices having the same shape are formed by overlapping each other with each tall component inserted into a through cutout of a tall component provided on a mating printed wiring board.
JP1986015134U 1986-02-06 1986-02-06 Expired JPH0311905Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986015134U JPH0311905Y2 (en) 1986-02-06 1986-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986015134U JPH0311905Y2 (en) 1986-02-06 1986-02-06

Publications (2)

Publication Number Publication Date
JPS62128691U JPS62128691U (en) 1987-08-14
JPH0311905Y2 true JPH0311905Y2 (en) 1991-03-20

Family

ID=30805783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986015134U Expired JPH0311905Y2 (en) 1986-02-06 1986-02-06

Country Status (1)

Country Link
JP (1) JPH0311905Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005286181A (en) * 2004-03-30 2005-10-13 Nec Corp Semiconductor device, method for manufacturing the same, and portable electronic device
JP2015191942A (en) 2014-03-27 2015-11-02 日本電気株式会社 Electronic apparatus, server, and module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910783U (en) * 1982-07-12 1984-01-23 三洋電機株式会社 Vibration isolation device for dehydrating washing machine

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175480U (en) * 1981-04-30 1982-11-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910783U (en) * 1982-07-12 1984-01-23 三洋電機株式会社 Vibration isolation device for dehydrating washing machine

Also Published As

Publication number Publication date
JPS62128691U (en) 1987-08-14

Similar Documents

Publication Publication Date Title
EP1128402A1 (en) Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof
JP3334620B2 (en) DC-DC converter device
US7200011B2 (en) Thermal interface adapter plate conversion kit and method
JPH0311905Y2 (en)
CN1173609C (en) Single system module for electric/electronic equiopment
JP5406349B1 (en) Switching power supply
EP0998019B1 (en) Semiconductor circuit assembly, in particular for a high current converter with low voltage intermediate circuit
JPH0731559Y2 (en) Mounting structure for noise suppression parts
JPH073434Y2 (en) High voltage electronic components
JPH0785659B2 (en) Inverter device
JP2751147B2 (en) Inverter device
JPS6028114Y2 (en) composite parts
JPH0567078U (en) Power conversion unit
JPH0510395Y2 (en)
JPH0412715Y2 (en)
JPH08163876A (en) Inverter for air-conditioner
JPS6037040Y2 (en) High voltage rectifier
JP2577703Y2 (en) Electronic equipment housing
JPS60132036U (en) semiconductor switch
JPH10247559A (en) Capacitor wiring structure
JPS6139974U (en) Audio equipment cabinet fixing device
JPS63224289A (en) Construction of insulation of printed board
JPS5950444U (en) Power IC mounting structure
JPS5967912U (en) Flyback transformer device
JPS61142929A (en) Dc power source unit