JPH03118616U - - Google Patents
Info
- Publication number
- JPH03118616U JPH03118616U JP2775390U JP2775390U JPH03118616U JP H03118616 U JPH03118616 U JP H03118616U JP 2775390 U JP2775390 U JP 2775390U JP 2775390 U JP2775390 U JP 2775390U JP H03118616 U JPH03118616 U JP H03118616U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- package
- molding
- lead frame
- electromagnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案の一実施例の構造を示す断面図
、第２図は従来のこの種のパツケージ成形用金型
の一例の構造を示す断面図、第３図は第２図に示
すパツケージ成形用金型により成形したパツケー
ジの構造を示す斜視図である。
１……上型、２……下型、３……リードフレー
ム、４……樹脂パツケージ、５……樹脂膜、１１
……成形樹脂注入部、１２，２２……パツケージ
成形型、２３……凸部、２３ａ……電磁石で形成
した凸部。なお図中同一符号は同一または相当す
る部分を示す。
FIG. 1 is a sectional view showing the structure of an embodiment of the present invention, FIG. 2 is a sectional view showing the structure of an example of a conventional mold for molding packages of this type, and FIG. FIG. 2 is a perspective view showing the structure of a package molded by a molding die. DESCRIPTION OF SYMBOLS 1... Upper mold, 2... Lower mold, 3... Lead frame, 4... Resin package, 5... Resin film, 11
...Molding resin injection part, 12, 22...Package mold, 23...Protrusion, 23a...Protrusion formed by electromagnet. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
フレームを挟んで押さえつけ、該リードフレーム
の面を上記下型のパツケージ成形型内部の凸部の
上面に接触させ、底面にインサートしたリードフ
レームの表面が露出した凹部を備えたパツケージ
を成形するのに用いるパツケージ成形金型におい
て、 下型のパツケージ成形型内部の上記凸部を電磁
石で形成したことを特徴とするパツケージ成形用
金型。[Claims for Utility Model Registration] A lead frame is sandwiched and pressed between an upper mold and a lower mold equipped with a package mold, and the surface of the lead frame is brought into contact with the upper surface of the convex part inside the package mold of the lower mold, A package molding die used for molding a package having a concave portion exposing the surface of a lead frame inserted at the bottom, wherein the convex portion inside the lower package molding mold is formed by an electromagnet. Molding mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775390U JPH03118616U (en) | 1990-03-20 | 1990-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775390U JPH03118616U (en) | 1990-03-20 | 1990-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03118616U true JPH03118616U (en) | 1991-12-06 |
Family
ID=31530593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2775390U Pending JPH03118616U (en) | 1990-03-20 | 1990-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03118616U (en) |
-
1990
- 1990-03-20 JP JP2775390U patent/JPH03118616U/ja active Pending