JPH03117867U - - Google Patents

Info

Publication number

JPH03117867U

JPH03117867U JP2698290U JP2698290U JPH03117867U JP H03117867 U JPH03117867 U JP H03117867U JP 2698290 U JP2698290 U JP 2698290U JP 2698290 U JP2698290 U JP 2698290U JP H03117867 U JPH03117867 U JP H03117867U

Authority

JP

Japan

Prior art keywords

mounting

wiring board

printed wiring

component

hole

Prior art date

1990-03-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910052737 gold Inorganic materials 0.000 claims description 3
• 239000010931 gold Substances 0.000 claims description 3
• 238000007747 plating Methods 0.000 claims description 3
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
• 230000037431 insertion Effects 0.000 claims 1
• 238000003780 insertion Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)