JPH0311758A - Cooling device for electronic device - Google Patents

Abstract

PURPOSE:To make a cooling device small in size and improved in exhaust efficiency a method wherein a gas-liquid separating device which recovers gas separating it from cooling liquid is provided inside a vessel which supports an electronic device and is provided with a jet nozzle of cooling liquid. CONSTITUTION:A chip 1 fitted facing downward so as to provide a gap 11 between a support 7 and itself, a cooling liquid of constant temperature is spouted from a jet nozzle 10 against the chip 1 in a pressurized constant temperature bath 16 by a pump 15. By this setup, the temperature of the chip 1 is kept within a range. At this point, when the constant temperature bath 16 is exhausted by a blower 17 through the intermediary of a gas-liquid separator 13 and an air suction hole 12, an air flow shown by arrows 18 is induced and a so-called air curtain 19 is formed at the gap 11 between the chip 1 and the support 7 wrapping the chip 1. As the air curtain 19 and the spouted cooling liquid are opposed to each other in flow direction, cooling liquid, its spray, and gas spouted against the chip 1 are made to flow in a downstream direction and prevented from drifting to an electric circuit on the upper side of the chip 1 and a board 2.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an apparatus for cooling electronic devices such as LSIs, and in particular, to a device for cooling electronic devices such as LSIs, and in particular for maintaining the temperature of the above-mentioned devices with high precision and keeping a large number of electronic devices stable at all times. The present invention relates to a cooling device for electronic devices suitable for cooling.

[Conventional technology]

A conventional cooling device for electronic devices is disclosed in Japanese Patent Application Laid-Open No. 1-25447.
As described in the publication, a cooling liquid is injected onto a cooling surface of an electronic device, and gas flows out from the opposite side of the cooling surface along the edge surface of the electronic device, so that the cooling liquid is sprayed onto the cooling surface of the electronic device. I made sure it didn't leak to the side. Further, the gas, which is separated by the difference in specific gravity from the mixture of the cooling liquid and the gas that has accumulated inside the cooling device housing due to the cooling effect, is exhausted to the outside through a piping system, and further gas-liquid separation is performed. The cooling liquid component remaining in the gas was removed by the device.

[Problem to be solved by the invention]

In the conventional device described above, it was necessary to provide a gas-liquid separation device separately from the cooling device, resulting in an overall increase in size.Furthermore, the capacity of the exhaust device was increased due to pressure loss in the piping between the gas-liquid separation device and the cooling device. There was a problem with getting bigger.

In addition, since the exhaust port for exhausting the gas was provided in one corner of the cooling device housing, the gas pressure around the electronic device became uneven, and the cooling liquid was applied to the wiring surface of the electronic device. There was a problem that it was easy to sneak around.

An object of the present invention is to house the gas-liquid separation device inside the cooling device, omit the piping system, and make it compact.

To provide a highly efficient cooling device 6 [Means for solving the problem] In order to achieve the above object, the cooling device is placed in a container that supports the electronic device and is provided with a spout hole for the cooling liquid. A gas-liquid separator is provided to separate the liquid and recover the gas.

Furthermore, the air inlet of the gas-liquid separation device is provided on the lower side, and the edge of the air inlet has an uneven shape.

Alternatively, the intake port is formed into an opening shape that is oblique with respect to the vertical direction so that the cooling liquid separated by condensation easily drips, and at the same time, the area of the intake port is effectively increased.

[Effect]

In the electronic device cooling apparatus according to the present invention, the gas-liquid separator installed almost directly below the electronic device to be cooled takes in the gas, so that a uniform gas flow is created around the electronic device. A curtain is formed that prevents the cooling liquid that is injected onto the electronic device from wrapping around the wiring surface of the electronic device.

Further, since an intake port is provided at the lower part of the gas-liquid separation device, and an uneven shape is provided on the edge thereof, or the intake port is provided diagonally with respect to the lower surface, the cooling liquid condensed within the gas-liquid separation device It becomes easier to drip, and the efficiency of gas-liquid separation is improved, and at the same time, the exhaust efficiency of the gas-liquid separation device is also improved.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

1 and 2, 1 is an electronic device, particularly a semiconductor integrated circuit or a semiconductor package (hereinafter collectively referred to as a chip), and 2 is a CCB connection (Controlled Collapse) between the chip 1 and a very small solder ball 3.
Ceramic substrate (abbreviation for Bonding) (hereinafter referred to as
4 is a pad for supplying power to the chip 1 and inputting/outputting signals; 5 is a printed circuit board on which a number of probes 6 are provided for making electrical connections by contacting the pads 4; 7;
8 is a protruding spacer for allowing air to flow between the substrate 2 and the support 7; 9 is a pin for positioning the substrate 2; and 10 is a cooling liquid for cooling the chip 1. An injection nozzle, 11 is a gap provided around the radius of the chip 1 on the upper surface of the support 7, 12 is an air suction port provided in the support 7, 13 is a gas-liquid separator, 14 is a cooling liquid discharge port, 15 16 is a constant temperature bath for keeping the cooling liquid at a constant temperature; 17 is a blower; and 18 is an arrow indicating the flow direction of air sucked into the gap 11.

In FIG. 1, there is a gap 11 between the chip 1 and the support 7.
mounted downward to form a

Cooling liquid at a constant temperature in a constant temperature bath 16 pressurized by a pump 15 is sprayed from a spray nozzle 10 . Therefore, the chip 1 can be maintained within a certain temperature range.

At this time, when the blower 17 exhausts the gas through the gas-liquid separator 13 and the air suction port 12, an air flow is generated as shown by the arrow 18, and the chip is inserted into the gap 11 between the chip 1 and the support 7. A so-called air curtain 19 is formed that envelops 1.

Since the air curtain 19 and the jetted cooling liquid are formed to face each other, the cooling liquid flow jetted onto the chip 1, its droplets, steam, etc. are pushed downstream by the air curtain and reach the upper surface of the chip 1. The cooling liquid does not get around to the electric circuit parts such as the circuit board 2 and the printed circuit board 5, which are present in the circuit board 2 and the printed circuit board 5.

In FIG. 3, unlike the case in FIG. 1, an uneven shape 131 is provided at the opening of the gas-liquid separator 13. Since the cooling liquid drips from the tip of the edge of the uneven shape 131, a so-called draining effect occurs, and at the same time, the uneven shape 131
The opening area of the gas-liquid separator 13 can be effectively increased since the portion other than the tip end of the edge is not obstructed by the dripping cooling liquid.

FIG. 4 shows a case where the opening of the gas-liquid separator 13 is cut obliquely. Since the cooling liquid drips from the tip of this diagonal cut, the same effect as in the case of FIG. 3 can be obtained.

FIG. 5 is a sectional view of a cooling apparatus for an electronic device according to the present invention using the gas-liquid separator 13 shown in FIG. Here, the diagonal cut portion is shaped like a knife to further enhance the draining effect. In this way, the collected cooling liquid drips down from the diagonal cut portion 132, so that a large opening area of the gas-liquid separator 13 can be obtained.

〔Effect of the invention〕

According to the present invention, as described above, since a gas-liquid separator for cooling liquid can be installed in a cooling device for an electronic device, it is possible to provide a small-sized cooling device for an electronic device.

Furthermore, since the conventional piping system between the external gas-liquid separator and the cooling device main body is omitted, pressure loss due to the piping system is eliminated and exhaust efficiency can be improved, thereby reducing the capacity of the exhaust blower. can be reduced.

Furthermore, since the gas-liquid separator can be installed directly under the electronic device to be cooled, an air curtain can be uniformly formed around the electronic device by the air flow necessary for removing the cooling liquid. can be effectively eliminated.

Furthermore, providing an uneven shape at the opening of the gas-liquid separator,
Alternatively, the opening is cut diagonally so that the condensed cooling liquid easily drips from the tip of the opening to increase the efficiency of gas-liquid separation.
At the same time, the opening area of the gas-liquid separator can be effectively expanded, and the exhaust efficiency can be improved.

[Brief explanation of drawings]

1 and 5 are sectional views of a cooling device for an electronic circuit device according to the present invention, FIG. 2 is a sectional view of a gas-liquid separator used in FIG. It is a three-dimensional view of a liquid separator. DESCRIPTION OF SYMBOLS 1... Electronic circuit device (chip), 2... Ceramic substrate, 7... Support body, 8... Spacer, 10...
... Coolant injection nozzle, 11 ... Gap (opening), 13
... Gas-liquid broom 2 illustration

Claims (3)

[Claims] 1. A cooling liquid is injected onto a cooling surface of an electronic device, and gas flows out along an edge surface of the electronic device from the opposite side of the cooling surface, thereby preventing the cooling liquid from leaking to the opposite side of the cooling surface. A cooling device for an electronic device, further comprising a gas-liquid separator for separating the cooling liquid and recovering the gas in a container that supports the electronic device and is provided with an ejection hole for the cooling liquid. Device cooling. 2. 2. The cooling device for an electronic device according to claim 1, wherein the gas-liquid separator has an opening on the lower side for sucking the gas, and an edge of the opening has an uneven shape. 3. 2. The cooling device for an electronic device according to claim 1, wherein the gas-liquid separator is provided with an opening on the lower side for inhaling the gas, and the opening is provided obliquely with respect to the vertical direction. .