JPH03116264U - - Google Patents
Info
- Publication number
- JPH03116264U JPH03116264U JP2403490U JP2403490U JPH03116264U JP H03116264 U JPH03116264 U JP H03116264U JP 2403490 U JP2403490 U JP 2403490U JP 2403490 U JP2403490 U JP 2403490U JP H03116264 U JPH03116264 U JP H03116264U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- overflow
- solder
- separation plate
- gently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
Description
第1図a,b,cは本考案オーバーフロー型半
田位置の要部の縦断正面図で、かつ、酸化膜の膜
切れ、および、除去状態を示す流れ図、第2図は
同上第1図bに対応する平面図、第3図〜第6図
は分離板の構造を示す平面図、第7図は従来例の
平面図である。
A……ノズル本体、11……半田槽、12……
ノズル、12a……ノズル開口、13……ダクト
、14……スクリユー搬送体、15……分離板、
16……酸化膜、16a……酸化膜部分、17…
…膜切れ部。
Figures 1a, b, and c are longitudinal sectional front views of the main parts of the overflow type soldering position of the present invention, and are flowcharts showing the state of oxide film breakage and removal, and Figure 2 is the same as Figure 1b of the same. Corresponding plan views, FIGS. 3 to 6 are plan views showing the structure of the separation plate, and FIG. 7 is a plan view of a conventional example. A... Nozzle body, 11... Solder tank, 12...
Nozzle, 12a... Nozzle opening, 13... Duct, 14... Screw carrier, 15... Separation plate,
16... Oxide film, 16a... Oxide film portion, 17...
... Membrane breakage.
Claims (1)
ズルから半田を四方に静かに溢流させ、ノズルの
開口領域に鏡面状の半田流を形成するようにした
オーバーフロー型半田付け装置において、 上記ノズルの中途部に該ノズルの一部を閉塞す
る分離板を張設したことを特徴とするオーバーフ
ロー型半田付け装置。[Claim for Utility Model Registration] A nozzle with a rectangular planar shape and a relatively wide area causes solder to gently overflow in all directions to form a mirror-like solder flow in the opening area of the nozzle. An overflow type soldering device, characterized in that a separation plate is provided in the middle of the nozzle to partially block the nozzle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2403490U JPH03116264U (en) | 1990-03-08 | 1990-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2403490U JPH03116264U (en) | 1990-03-08 | 1990-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03116264U true JPH03116264U (en) | 1991-12-02 |
Family
ID=31527012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2403490U Pending JPH03116264U (en) | 1990-03-08 | 1990-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03116264U (en) |
-
1990
- 1990-03-08 JP JP2403490U patent/JPH03116264U/ja active Pending
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