JPH03116066U - - Google Patents
Info
- Publication number
- JPH03116066U JPH03116066U JP2567490U JP2567490U JPH03116066U JP H03116066 U JPH03116066 U JP H03116066U JP 2567490 U JP2567490 U JP 2567490U JP 2567490 U JP2567490 U JP 2567490U JP H03116066 U JPH03116066 U JP H03116066U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- opening
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 239000003779 heat-resistant material Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2567490U JPH03116066U (lv) | 1990-03-14 | 1990-03-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2567490U JPH03116066U (lv) | 1990-03-14 | 1990-03-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03116066U true JPH03116066U (lv) | 1991-12-02 |
Family
ID=31528596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2567490U Pending JPH03116066U (lv) | 1990-03-14 | 1990-03-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03116066U (lv) |
-
1990
- 1990-03-14 JP JP2567490U patent/JPH03116066U/ja active Pending