JPH03116050U - - Google Patents
Info
- Publication number
- JPH03116050U JPH03116050U JP2478190U JP2478190U JPH03116050U JP H03116050 U JPH03116050 U JP H03116050U JP 2478190 U JP2478190 U JP 2478190U JP 2478190 U JP2478190 U JP 2478190U JP H03116050 U JPH03116050 U JP H03116050U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- jig
- circuit package
- leads
- twisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2478190U JPH03116050U (en:Method) | 1990-03-12 | 1990-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2478190U JPH03116050U (en:Method) | 1990-03-12 | 1990-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116050U true JPH03116050U (en:Method) | 1991-12-02 |
Family
ID=31527732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2478190U Pending JPH03116050U (en:Method) | 1990-03-12 | 1990-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116050U (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012001843A1 (ja) * | 2010-06-28 | 2012-01-05 | 株式会社エス・ケー・ジー | 照明装置 |
| JP2018110143A (ja) * | 2016-12-28 | 2018-07-12 | 三菱電機株式会社 | 半導体装置、電力変換装置、リードフレーム、および半導体装置の製造方法 |
-
1990
- 1990-03-12 JP JP2478190U patent/JPH03116050U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012001843A1 (ja) * | 2010-06-28 | 2012-01-05 | 株式会社エス・ケー・ジー | 照明装置 |
| JP2018110143A (ja) * | 2016-12-28 | 2018-07-12 | 三菱電機株式会社 | 半導体装置、電力変換装置、リードフレーム、および半導体装置の製造方法 |