JPH03113853U - - Google Patents

Info

Publication number
JPH03113853U
JPH03113853U JP2297190U JP2297190U JPH03113853U JP H03113853 U JPH03113853 U JP H03113853U JP 2297190 U JP2297190 U JP 2297190U JP 2297190 U JP2297190 U JP 2297190U JP H03113853 U JPH03113853 U JP H03113853U
Authority
JP
Japan
Prior art keywords
active element
connection
frequency active
decoupling capacitor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2297190U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2297190U priority Critical patent/JPH03113853U/ja
Publication of JPH03113853U publication Critical patent/JPH03113853U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2297190U 1990-03-07 1990-03-07 Pending JPH03113853U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2297190U JPH03113853U (cs) 1990-03-07 1990-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2297190U JPH03113853U (cs) 1990-03-07 1990-03-07

Publications (1)

Publication Number Publication Date
JPH03113853U true JPH03113853U (cs) 1991-11-21

Family

ID=31525975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2297190U Pending JPH03113853U (cs) 1990-03-07 1990-03-07

Country Status (1)

Country Link
JP (1) JPH03113853U (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101014229B1 (ko) * 2010-09-16 2011-02-14 이소정 입식 다리교정기
KR101979809B1 (ko) * 2018-07-09 2019-05-16 주식회사 엔트렌스 근육의 수축이완에 적응하도록 구성된 무릎 보조기

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101014229B1 (ko) * 2010-09-16 2011-02-14 이소정 입식 다리교정기
KR101979809B1 (ko) * 2018-07-09 2019-05-16 주식회사 엔트렌스 근육의 수축이완에 적응하도록 구성된 무릎 보조기

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