JPH03113842U - - Google Patents
Info
- Publication number
- JPH03113842U JPH03113842U JP2423690U JP2423690U JPH03113842U JP H03113842 U JPH03113842 U JP H03113842U JP 2423690 U JP2423690 U JP 2423690U JP 2423690 U JP2423690 U JP 2423690U JP H03113842 U JPH03113842 U JP H03113842U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- fixing
- bent
- heat sink
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000002184 metal Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2423690U JP2506808Y2 (ja) | 1990-03-09 | 1990-03-09 | 放熱板用半導体固定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2423690U JP2506808Y2 (ja) | 1990-03-09 | 1990-03-09 | 放熱板用半導体固定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03113842U true JPH03113842U (sl) | 1991-11-21 |
| JP2506808Y2 JP2506808Y2 (ja) | 1996-08-14 |
Family
ID=31527205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2423690U Expired - Lifetime JP2506808Y2 (ja) | 1990-03-09 | 1990-03-09 | 放熱板用半導体固定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506808Y2 (sl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205832A (ja) * | 2009-03-02 | 2010-09-16 | Fujitsu Telecom Networks Ltd | 半導体素子の取付構造 |
-
1990
- 1990-03-09 JP JP2423690U patent/JP2506808Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205832A (ja) * | 2009-03-02 | 2010-09-16 | Fujitsu Telecom Networks Ltd | 半導体素子の取付構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506808Y2 (ja) | 1996-08-14 |