JPH03113832U - - Google Patents
Info
- Publication number
- JPH03113832U JPH03113832U JP2286890U JP2286890U JPH03113832U JP H03113832 U JPH03113832 U JP H03113832U JP 2286890 U JP2286890 U JP 2286890U JP 2286890 U JP2286890 U JP 2286890U JP H03113832 U JPH03113832 U JP H03113832U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- chip carrier
- connection terminal
- bump
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007373 indentation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2286890U JPH03113832U (ko) | 1990-03-06 | 1990-03-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2286890U JPH03113832U (ko) | 1990-03-06 | 1990-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03113832U true JPH03113832U (ko) | 1991-11-21 |
Family
ID=31525874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2286890U Pending JPH03113832U (ko) | 1990-03-06 | 1990-03-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03113832U (ko) |
-
1990
- 1990-03-06 JP JP2286890U patent/JPH03113832U/ja active Pending